公开(公告)号：US11203017B2

公开(公告)日：2021-12-21

申请号：US16099668

申请日：2016-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A Nielsen ,  Manish Giri ,  Chantelle Domingue ,  Kenneth Ward ,  Christie Dudenhoefer ,  Matthew David Smith ,  Joshua M. Yu ,  Diane R. Hammerstad ,  Hilary Ely

IPC: B01L3/00 ,  B01L3/02 ,  G01N15/10 ,  G01N35/10 ,  G01N15/14

Abstract: According to an example, a microfluidic apparatus may include a channel, a foyer, in which the foyer is in fluid communication with the channel and in which the channel has a smaller width than the foyer, a sensor to sense a property of a fluid passing through the channel, a nozzle in fluid communication with the foyer, and an actuator positioned in line with the nozzle. The microfluidic apparatus may also include a controller to determine whether the sensed property of the fluid meets a predetermined condition and to perform a predefined action in response to the sensed property of the fluid meeting the predetermined condition.

公开(公告)号：US11179720B2

公开(公告)日：2021-11-23

申请号：US16319702

申请日：2016-10-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Manish Giri ,  Chantelle Domingue ,  Tod Woodford ,  Matthew David Smith ,  Rachel M. White ,  Joshua M. Yu ,  Hilary Ely ,  Jeremy Sells

IPC: B01L3/00 ,  F16K99/00

Abstract: The present disclosure is drawn to microfluidic chips. The microfluidic chips can include an inflexible material having an elastic modulus of 0.1 gigapascals (GPa) to 450 GPa. A microfluidic channel can be formed within the inflexible material and can connect an inlet and an outlet. A working electrode can be associated with the microfluidic channel and can have a surface area of 1 μm2 to 60,000 μm2 within the microfluidic channel. A bubble support structure can also be formed within the microfluidic channel such that the working electrode is positioned to electrolytically generate a bubble that becomes associated with the bubble support structure.

公开(公告)号：US11135579B2

公开(公告)日：2021-10-05

申请号：US16099478

申请日：2016-07-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Diane R. Hammerstad ,  Matthew David Smith ,  Hilary Ely

IPC: B01L3/02 ,  B01L3/00 ,  B01L9/00

Abstract: An apparatus includes a media that includes an encoded pattern to indicate a location of each of a plurality of dispensing locations on a receiving area for a pipette dispenser. The encoded pattern is employed to guide the pipette dispenser to dispense a volume to a selected dispensing location from the plurality of dispensing locations based on a predetermined dispensing location on the receiving area.

公开(公告)号：US11065619B2

公开(公告)日：2021-07-20

申请号：US16472694

申请日：2017-02-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Gary G. Lutnesky ,  Matthew David Smith ,  Dennis R. Esterberg

IPC: B01L3/00 ,  H01R12/71 ,  H05K1/11 ,  B01L3/02

Abstract: A cassette may include a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout may include a first row of interconnect pads including at least one interconnect pad. Each interconnect pad of the first row of interconnect pads may be electrically coupled to one of a first set of vias. The electrical interconnection pad layout may also include a second row of interconnection pads including at least one interconnect pad. Each interconnect pad of the second row of interconnect pads being electrically coupled to one of a second set of vias. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to an alignment of the interconnect pads of the first and second rows.

公开(公告)号：US20180285153A1

公开(公告)日：2018-10-04

申请号：US15772463

申请日：2016-02-04

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Joshua M. Yu ,  Matthew David Smith ,  Manish Giri ,  Shameed Salt M A

IPC: G06F9/48 ,  G01N35/00 ,  G06F9/54 ,  G16H50/20 ,  B01L3/00

Abstract: A system and method for managing a microfluidics device. The system includes a microfluidics device; a controller with a first processor which receives outputs from the microfluidics device and provides inputs to the microfluidics device; and a computing device with a second processor and an application program interface (API). The computing device provides instructions to the controller using the API. The instructions are executed by the first processor to produce real-time outputs to the microfluidics device.

公开(公告)号：US11975547B2

公开(公告)日：2024-05-07

申请号：US17608078

申请日：2019-07-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Vignesh Kannan ,  Dennis R. Esterberg ,  Christie Dudenhoefer ,  Kenneth Ward ,  Matthew David Smith ,  Daniel Fradl

IPC: B41J29/13

CPC classification number: B41J29/13 ,  B01L2200/025 ,  B01L2200/0642 ,  B01L2300/0609 ,  H05K2201/10424 ,  H05K2201/10954

Abstract: In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.

公开(公告)号：US11639056B2

公开(公告)日：2023-05-02

申请号：US16765795

申请日：2017-12-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Matthew David Smith ,  Dennis R. Esterberg ,  Jeffrey A. Nielsen

IPC: B41J2/14 ,  B01L3/02 ,  G01N35/10 ,  B01L3/00

Abstract: In one example in accordance with the present disclosure, a fluidic ejection controller is described. The fluidic ejection controller includes a firing board to pass electrical control signals for ejecting fluid from a fluidic ejection device. An ejection board of the fluidic ejection controller is electrically coupled to, and selectively removable from, the firing board to pass the electrical control signals to the fluidic ejection device. Electrical pins are disposed on the ejection board in a pattern that matches a pattern of electrical pads on the fluidic ejection device. The electrical pins interface with corresponding electrical pads to pass the electrical control signals from the ejection board to the fluidic ejection device.

公开(公告)号：US11097272B2

公开(公告)日：2021-08-24

申请号：US16099172

申请日：2016-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chantelle Domingue ,  Tod Woodford ,  Manish Giri ,  Matthew David Smith ,  George H Corrigan, III ,  Masoud Zavarehi ,  Joshua M. Yu

IPC: B01L3/00 ,  G01N15/10 ,  G01N35/10

Abstract: According to an example, a microfluidic apparatus may include a fluid slot and a foyer that is in fluid communication with the fluid slot via a channel having a relatively smaller width than the foyer. The microfluidic apparatus may also include an electrical sensor to measure a change in an electrical field caused by a particle of interest in a fluid passing through the channel from the fluid slot to the foyer, an actuator to apply pressure onto fluid contained in the foyer, and a controller to receive the measured change in the electrical field from the electrical sensor, determine, from the received change in the electrical field, an electrical signature of the particle of interest, and control the actuator to control movement of the particle of interest based upon the determined electrical signature of the particle of interest.

公开(公告)号：US10241066B2

公开(公告)日：2019-03-26

申请号：US15112639

申请日：2014-01-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Nicholas Matthew Cooper McGuinness ,  Melinda M. Valencia ,  Manish Giri ,  Chantelle Elizabeth Domingue ,  Jeremy Sells ,  Matthew David Smith

IPC: G01N27/06 ,  G01N15/02 ,  G01N27/12 ,  B01L3/00 ,  G01N15/12 ,  G01N15/10 ,  G01N15/14

Abstract: A microfluidic sensing device comprises a channel and an impedance sensor within the channel. The impedance sensor comprises a local ground and an electrode within the channel. The local ground and the electrode are to form an electric field region that is elongated along the channel.

公开(公告)号：US20180264470A1

公开(公告)日：2018-09-20

申请号：US15546392

申请日：2015-01-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sirena Lu ,  Manish Giri ,  Matthew David Smith ,  Melinda M. Valencia

IPC: B01L3/00

CPC classification number: B01L3/502715 ,  B01L2200/147 ,  B01L2300/023 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2400/0415 ,  G01N33/4875 ,  G08C15/00

Abstract: A controller is connected to controlled devices on a microfluidic chip with a multiplexer. Signal transmission band width is differently allocated amongst the plurality of controlled devices on the microfluidic chip.