摘要:
A combination of a dry oxidizing, wet etching, and wet cleaning processes are used to remove particle defects from a wafer after ion implantation, as part of a wafer bonding process to fabricate a SOI wafer. The particle defects on the topside and the backside of the wafer are oxidized, in a dry strip chamber, with an energized gas. In a wet clean chamber, the backside of the wafer is treated with an etchant solution to remove completely or partially a thermal silicon oxide layer, followed by exposure of the topside and the backside to a cleaning solution. The cleaning solution contains ammonium hydroxide, hydrogen peroxide, DI water, and optionally a chelating agent, and a surfactant. The wet clean chamber is integrated with the dry strip chamber and contained in a single wafer processing system.
摘要:
A radially expandable stent comprising a plurality of spaced band-like elements and intersecting links is disclosed. The band-like elements have a generally serpentine configuration to provide continuous waves of generally sinusoidal character to each band-like element. The waves are characterized by a plurality of peaks and troughs taking a generally longitudinal direction along the cylinder such that the waves in the band-like elements open as the stent is expanded from a first diameter to a second diameter. The intersecting links are substantially U-shaped and terminate in first and second shanks. The first shank of a link emanates from a region between a peak and trough on a band-like element and the second shank of the link emanates from a region between a peak and trough on an adjacent band-like element.
摘要:
A stent in a non-expanded state includes a first expansion column and a second expansion column. The first expansion column comprises a plurality of expansion strut pairs. Each expansion strut pair includes a first expansion strut and a second expansion strut joined by a joining strut. The second expansion column comprises a plurality of expansion strut pairs. Each expansion strut pair includes a first expansion strut and a second expansion strut joined by a joining strut. The first and second expansion columns are connected via a first connecting strut column. The first connecting strut column comprises a plurality of first connecting struts. The first expansion strut of the first expansion strut pair in the first expansion column has a longitudinal axis offset from a longitudinal axis of the first expansion strut of the second expansion strut pair in the second expansion column.
摘要:
The present invention provides an improved medical device delivery catheter. The medical device delivery system comprises a catheter having a medical device receiving portion adapted to receive a medical device near the distal end of the catheter and a medical device such as a stent concentrically arranged around the catheter within the medical device receiving portion. The medical device delivery system further comprises a movable medical balloon disposed about the medical device. In use, the balloon may be inflated to dilate a lesion, retracted to deploy the medical device and subsequently reinflated to seat the medical device.
摘要:
Methods and apparatuses are provided that remove a scrubber brush from contact with a wafer surface prior to slowing down the scrubber brush's rotational rate. The scrubbing method may include rotating a scrubber brush at a non-reduced rate, while the scrubber brush is in contact with the wafer and removing the scrubber brush from contact with the wafer while rotating the scrubber brush at the non-reduced rate. The scrubbing apparatus has a controller programmed to perform the scrubbing method.
摘要:
A Megasonic cleaning apparatus having at least one reflector (e.g., a parabolic or paraboloid reflector) positioned to collect otherwise wasted cleaning energy and redirect that energy to one or a plurality of positions on a wafer's edge is provided. A first embodiment comprises a complex parabolic reflector which has a width greater than that of the wafer and a preferred length approximately equal to the diameter of the wafer, and which is shaped to provide focal points which vary along the length of the parabolic reflector, such that energy striking the reflector at different points along the reflector's length is directed to a plurality of different points along the wafer's edge. A second embodiment comprises a simple parabolic reflector having a width greater than that of the wafer and a preferred length less than the diameter of the wafer, and which is provided to focus at a cord along the wafer's surface, effectively focusing cleaning energy on two points along the wafer's edge at any given time. Yet another embodiment of the invention comprises a paraboloid reflector having a width greater than that of the wafer and a preferred length which is substantially less than the diameter of the wafer and which is shaped to focus all collected energy to a single point on the wafer's edge. Multiple such reflectors may be positioned in the cleaning tank to optimize energy usage and wafer cleaning.
摘要:
A sonic tank for cleaning substrates is provided. The tank has two or more upwardly angled walls. Arrays of one or more transducers are positioned along at least two of the two or more angled walls. The transducer arrays are alternately energized maintaining nearly 100% substrate surface cleaning at any given time, and 50% duty cycle (or less) for each transducer array. The substrate supports are positioned such that nearly every point along the substrate's surface is contacted by energy from at least one transducer, and transducer opposing walls are positioned to avoid interfering reflections therefrom.