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21.发明申请公开(公告)号：US20100144928A1
公开(公告)日：2010-06-10
申请号：US12517494
申请日：2007-12-03
申请人： Yoshitsugu Morita , Hiroshi Ueki
发明人： Yoshitsugu Morita , Hiroshi Ueki
IPC分类号： C08L63/00
CPC分类号： C08G59/4085 , C08G59/621
摘要： A curable epoxy resin composition comprising at least the following components: (I) an epoxy resin; (II) a curing agent for an epoxy resin; (III) a diorganosiloxane having on both molecular terminals siloxane residual radicals represented by the following average unit formula: (XR12SiO1/2)a(SiO4/2)b (where R1 is a monovalent hydrocarbon group that is free of unsaturated aliphatic bond, and “X” is a single bond, a hydrogen atom, a group designated by R1, an epoxy-containing monovalent organic group, or an alkoxysilylalkyl group; however, at least one group designated by “X” in one molecule is a single bond, at least two groups designated by “X” are epoxy-containing alkyl groups; “a” is a positive number; “b” is a positive number; and “a/b” is a number ranging from 0.2 to 4); and (IV) an inorganic filler; is capable of producing a cured body of high strength in spite of having a low modulus of elasticity (low stress).
摘要翻译： 一种可固化环氧树脂组合物，其至少包含以下组分：（I）环氧树脂; （II）环氧树脂固化剂; （III）二分子末端的二有机硅氧烷，硅氧烷残基由下列平均单元式表示：（XR12SiO1 / 2）a（SiO4 / 2）b（其中R1是不含不饱和脂肪键的单价烃基， “X”是单键，氢原子，由R1表示的基团，含环氧基的一价有机基团或烷氧基甲硅烷基烷基;但是，在一个分子中由“X”表示的至少一个基团是单键， 由“X”表示的至少两个基团是含环氧基的烷基;“a”是正数;“b”是正数;“a / b”是0.2至4的数）; 和（IV）无机填料; 尽管具有低弹性模量（低应力），但能够生产高强度的固化体。
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22.发明申请Adhesive-Promoting Agent, Curable Organopolysiloxane Composition, and Semiconductor Device 有权粘合促进剂，固化有机聚硅氧烷组合物和半导体装置公开(公告)号：US20090294796A1
公开(公告)日：2009-12-03
申请号：US12299929
申请日：2007-05-10
申请人： Yoshitsugu Morita , Tomoko Kato , Hiroshi Ueki , Osamu Tanaka
发明人： Yoshitsugu Morita , Tomoko Kato , Hiroshi Ueki , Osamu Tanaka
CPC分类号： C08K5/54 , C08L83/00 , C08L83/04 , C09J183/04 , H01L2224/48091 , H01L2924/00014
摘要： An adhesion-promoting agent represented by the following average formula: R1aSiO(4-a/2 (where R1 is a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, an aryl group with 6 to 20 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, or an epoxy-containing organic group; however, in one molecule, the content of the alkenyl groups should constitute at least 5 mole % of all groups designated by R1; the content of the aryl groups should constitute at least 5 mole % of all groups designated by R1; the content of the alkoxy groups should constitute at least 5 mole % of all groups designated by R1; the content of the epoxy-containing organic groups should constitute at least 5 mole % of all groups designated by R1; and “a” is a number that satisfies the following condition: 1.0≦a
摘要翻译： 由以下平均通式表示的增粘剂：R1aSiO（4-a / 2（其中R1为选自具有1-10个碳原子的任选取代的烷基，具有2至20个碳原子的链烯基， 具有6至20个碳原子的芳基，具有1至10个碳原子的烷氧基或含环氧基的有机基团;然而，在一个分子中，烯基的含量应构成指定的所有基团的至少5摩尔％ 由R 1表示;芳基的含量应构成由R1表示的所有基团的至少5摩尔％;烷氧基的含量应构成由R1表示的所有基团的至少5摩尔％;含环氧基的 有机基团应构成由R1指定的所有基团的至少5摩尔％;“a”是满足以下条件的数：1.0 <= a <4）是新型粘合促进剂和可固化的有机基聚硅氧烷组合物， 含有上述粘合促进剂 对各种有机树脂基材具有优异的粘合性，适合于形成具有高折射率和高透光率的固化体。
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23.发明申请公开(公告)号：US20090234078A1
公开(公告)日：2009-09-17
申请号：US11908587
申请日：2006-03-15
申请人： Hiroshi Ueki , Minoru Isshiki , Yoshitsugu Morita , Tomoko Kato
发明人： Hiroshi Ueki , Minoru Isshiki , Yoshitsugu Morita , Tomoko Kato
CPC分类号： C07F7/0838
摘要： An organotrisiloxane represented by the following general formula (I), wherein R1 and R2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds, with the proviso that at least one of R1 or R2 is an aryl group, and R3 designates an organic group that contains a phenolic hydroxyl group, is a novel compound that possesses good reactivity and excellent compatibility and dispersibility with respect to the curable resins, such as epoxy resin.
摘要翻译： 由以下通式（I）表示的有机三
氧硅烷，其中R 1和R 2可以相同或不同，并且表示不具有脂族不饱和键的任选取代的一价烃基，条件是R 1或R 2中的至少一个为 芳基，R3表示含有酚性羟基的有机基，是具有良好的反应性，相对于环氧树脂等固化性树脂的相容性和分散性优异的新型化合物。-
24.发明授权Silicon-containing polymer, method of manufacturing thereof, and curable polymer composition 失效含硅聚合物，其制造方法和可固化聚合物组合物公开(公告)号：US08674037B2
公开(公告)日：2014-03-18
申请号：US12988785
申请日：2009-04-06
摘要： A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein R1 designates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; R2 designates identical or different, substituted or unsubstituted alkylene groups; R3 designates substituted or unsubstituted monovalent hydrocarbon groups; R4 designates alkyl groups or hydrogen atoms; ‘a’ is a positive number that satisfies the following condition: 0=a=3; and ‘x’, ‘y’, and ‘z’ are positive numbers that satisfy the following conditions: 0
摘要翻译： 由以下平均单元式表示的含硅聚合物：（O 2 / 2SiR1-R2-C6H4-R2-SiR1O2 / 2）x [R3SiO（4-a）/ 2] y（R4O1 / 2）z（其中R1 表示相同或不同的取代或未取代的一价烃基; R 2表示相同或不同的取代或未取代的亚烷基; R 3表示取代或未取代的一价烃基; R 4表示烷基或氢原子;'a' 以下条件：0 = a = 3;'x'，'y'和'z'是满足以下条件的正数：0
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25.发明申请Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby 有权制造半导体器件的方法和由此产生的半导体器件公开(公告)号：US20100213623A1
公开(公告)日：2010-08-26
申请号：US12280248
申请日：2007-02-14
申请人： Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
发明人： Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
CPC分类号： B29C43/18 , B29C43/50 , C08L83/06 , C08L83/14 , H01L21/565 , H01L23/293 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.
摘要翻译： 一种制造半导体器件的方法，该半导体器件通过将未密封的半导体器件放置在模具中并将供入到模具和未密封的半导体器件之间的空间中的可固化的硅氧烷组合物压缩成型，将密封在固化的硅氧烷体中的方法进行压缩成型 上述可固化硅氧烷组合物至少包含以下组分：（A）含环氧基的硅氧烷和（B）环氧树脂的固化剂; 可以减少半导体芯片和电路板翘曲，提高表面耐擦伤性。
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公开(公告)号：US20100022704A1
公开(公告)日：2010-01-28
申请号：US12443286
申请日：2007-09-05
申请人： Yoshitsugu Morita , Tomoko Kato , Hiroshi Ueki
发明人： Yoshitsugu Morita , Tomoko Kato , Hiroshi Ueki
IPC分类号： C08L83/06
CPC分类号： C08L83/14 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/50 , C08G77/70 , C08L83/04 , C08L83/00
摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane represented by the following general formula: X—R2—(R12SiO)mR12Si—R2—X {where R1 designates a monovalent hydrocarbon group that has six or fewer carbon atoms and is free of aliphatic unsaturated bonds; R2 designates an alkylene group; and X is an organopolysiloxane residue represented by the following average unit formula: (YR12SiO1/2)a(SiO4/2)b (where R1 is the same as defined above; Y is a single bond, a hydrogen atom, a group represented by aforementioned R1, an epoxy-containing alkyl group, an alkoxysilylalkyl group, or an alkyl group with seven or more carbon atoms; however, in one molecule, at least one Y is a single bond, and at least one Y is an alkyl group with seven or more carbon atoms; “a” is a positive number; “b” is a positive number; and “a/b” is a number in the range of 0.2 to 4.0), the aforementioned group represented by R1 or an alkenyl group; however, at least one X is the aforementioned organopolysiloxane residue; and “m” is an integer equal to or greater than 1} and (B) a curing agent for epoxy resin; possesses good handleability and, when cured, forms a cured silicone body having low modulus of elasticity.
摘要翻译： 至少包含以下成分的可固化有机硅组合物：（A）由以下通式表示的二有机聚硅氧烷：X-R2-（R12SiO）mR12Si-R2-X {其中R1表示具有6个或更少碳原子的一价烃基 并且不含脂族不饱和键; R2表示亚烷基; X是由以下平均单元式表示的有机聚硅氧烷残基：（YR12SiO1 / 2）a（SiO4 / 2）b（其中R1与上述相同; Y是单键，氢原子，以 上述R 1，含环氧基的烷基，烷氧基甲硅烷基烷基或具有7个以上碳原子的烷基;但是，在一个分子中，至少一个Y为单键，至少一个Y为烷基， “a”为正数;“b”为正数，“a / b”为0.2〜4.0的数值），上述由R 1表示的基团或烯基 ; 然而，至少一个X是上述有机聚硅氧烷残基; 和“m”为1以上的整数，（B）环氧树脂用固化剂。 具有良好的可操作性，并且当固化时形成具有低弹性模量的固化的硅氧烷体。
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公开(公告)号：US20090214870A1
公开(公告)日：2009-08-27
申请号：US11908592
申请日：2006-03-15
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Tomoko Kato
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Tomoko Kato
CPC分类号： H01L23/3737 , C08G59/40 , C08L83/06 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/12044 , H01L2924/1301 , H01L2924/16152 , Y10T428/31511 , C08L83/00 , H01L2924/00 , H01L2224/0401
摘要： A curable silicone composition comprising: (A) a diorganosiloxane represented by the following general formula: A-R2—(R12SiO)nR12Si—R2-A {wherein R1 represents the same or different optionally substituted univalent hydrocarbon groups that do not have unsaturated aliphatic bonds; R2 represents bivalent organic groups; A designates siloxane residual radicals represented by the following average unit formula: (XR12SiO1/2)a (SiO4/2)b (wherein R1 designates the previously mentioned group; X designates a single bond, hydrogen atom, the previously mentioned group that is designated by R1, an epoxy-containing alkyl group, or an alkoxysilylalkyl group; at least one X in one molecule is a single bond; at least two X's are epoxy-containing alkyl groups; “a” is a positive number, “b” is a positive number; and “a/b” is a positive number within the range of 0.2 to 4), and “n” is an integer which is equal to or greater than 1}; and (B) a curing agent for an epoxy resin, is characterized by excellent handlability and curability and that is suitable for curing into a cured body that has excellent flexibility and adhesive characteristics; to provide a highly reliable electronic device.
摘要翻译： 一种可固化有机硅组合物，其包含：（A）由以下通式表示的二有机硅氧烷：A-R2-（R12SiO）nR12Si-R2-A {其中R1表示不具有不饱和脂肪键的相同或不同的任选取代的一价烃基 ; R2表示二价有机基团; A表示由以下平均单元式表示的硅氧烷残基：（XR12SiO1 / 2）a（SiO4 / 2）b（其中R1表示前述基团; X表示单键，氢原子，指定为前述的基团 通过R 1，含环氧基的烷基或烷氧基甲硅烷基烷基;一个分子中的至少一个X是单键;至少两个X是含环氧基的烷基;“a”是正数，“b”是 正数，“a / b”为0.2〜4的正数），“n”为1以上的整数。 和（B）环氧树脂用固化剂，其特征在于优异的可处理性和固化性，并且适于固化成具有优异的柔性和粘合特性的固化体; 以提供高度可靠的电子设备。
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公开(公告)号：US08563666B2
公开(公告)日：2013-10-22
申请号：US12738463
申请日：2008-10-06
申请人： Yoshitsugu Morita , Hiroshi Ueki
发明人： Yoshitsugu Morita , Hiroshi Ueki
IPC分类号： C08G77/14
摘要： A curable silicone composition comprising: (A) a liquid organopolysiloxane having in one molecule at least two epoxy groups; (B) a compound containing groups that react with the epoxy groups; (C) a thermally conductive filler; and (D) a silicone powder, preferably, an epoxy-containing silicone powder; possesses excellent handleability and workability in combination with low viscosity and that, when cured, forms a cured body of excellent elasticity, adhesiveness, and thermal conductivity.
摘要翻译： 一种可固化有机硅组合物，其包含：（A）在一个分子中具有至少两个环氧基团的液体有机聚硅氧烷; （B）含有与环氧基反应的基团的化合物; （C）导热填料; 和（D）硅氧烷粉末，优选含环氧基的硅氧烷粉末; 具有优异的可操作性和低粘度的加工性，并且当固化时形成具有优异弹性，粘合性和导热性的固化体。
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公开(公告)号：US08227528B2
公开(公告)日：2012-07-24
申请号：US12675499
申请日：2008-08-19
申请人： Yoshitsugu Morita , Hiroshi Ueki
发明人： Yoshitsugu Morita , Hiroshi Ueki
CPC分类号： C08G59/688 , C08G77/12 , C08G77/16 , C08K5/5435 , C08K5/57 , C08L63/00 , C08L83/04 , C08L83/00
摘要： A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 μm, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength.
摘要翻译： 一种可固化环氧树脂组合物，其包含：（I）可固化环氧树脂; （II）环氧树脂固化剂; 和（III）通过将分散状态的可缩合固化的硅橡胶组合物固化在水中而获得的硅橡胶粉末，通过滴定等于或低于3000测量的环氧当量的粉末和在0.1的范围内的平均粒度 至100μm，具有优异的流动性，并且当固化时形成固化产物，尽管低弹性模量具有高强度。
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30.发明申请SILICON-CONTAINING POLYMER, METHOD OF MANUFACTURING THEREOF, AND CURABLE POLYMER COMPOSITION 失效含硅聚合物，其制造方法和可固化聚合物组合物公开(公告)号：US20110118413A1
公开(公告)日：2011-05-19
申请号：US12988785
申请日：2009-04-06
摘要： A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein R1 designates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; R2 designates identical or different, substituted or unsubstituted alkylene groups; R3 designates substituted or unsubstituted monovalent hydrocarbon groups; R4 designates alkyl groups or hydrogen atoms; ‘a’ is a positive number that satisfies the following condition: 0=a=3; and ‘x’, ‘y’, and ‘z’ are positive numbers that satisfy the following conditions: 0
摘要翻译： 由以下平均单元式表示的含硅聚合物：（O 2 / 2SiR1-R2-C6H4-R2-SiR1O2 / 2）x [R3SiO（4-a）/ 2] y（R4O1 / 2）z（其中R1 表示相同或不同的取代或未取代的一价烃基; R 2表示相同或不同的取代或未取代的亚烷基; R 3表示取代或未取代的一价烃基; R 4表示烷基或氢原子;'a' 以下条件：0 = a = 3;'x'，'y'和'z'是满足以下条件的正数：0
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