公开(公告)号：US20150144788A1

公开(公告)日：2015-05-28

申请号：US14564921

申请日：2014-12-09

Applicant: Hermes Microvision Inc.

Inventor： Zhongwei Chen ,  Jack Jau ,  Weiming Ren ,  Chiyan Kuan ,  Yixiang Wang ,  Xiaoli Guo ,  Feng Cao

IPC: H01J37/26 ,  H01J37/22 ,  H01J37/28

CPC classification number: H01J37/261 ,  H01J37/226 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/063 ,  H01J2237/10 ,  H01J2237/24475 ,  H01J2237/24495 ,  H01J2237/24528 ,  H01J2237/2801 ,  H01J2237/2804 ,  H01J2237/2806 ,  H01J2237/2814

Abstract: The present invention provides a dual-beam apparatus which employs the dark-field e-beam inspection method to inspect small particles on a surface of a sample such as wafer and mask with high throughput. The dual beam apparatus comprises two single-beam dark-field units placed in a same vacuum chamber and in two different orientations. The two single-beam dark-field units can perform the particle inspection separately or almost simultaneously by means of the alternately-scanning way. The invention also proposes a triple-beam apparatus for both inspecting and reviewing particles on a sample surface within the same vacuum chamber. The triple-beam apparatus comprises one foregoing dual-beam apparatus performing the particle inspection and one high-resolution SEM performing the particle review.

Abstract translation: 本发明提供一种双光束装置，其采用暗场电子束检查方法以高生产量检查诸如晶片和掩模的样品表面上的小颗粒。 双光束装置包括放置在相同真空室中并具有两个不同取向的两个单光束暗场单元。 两个单光束暗场单元可以通过交替扫描方式分别或几乎同时进行粒子检测。 本发明还提出了一种用于检查和检查在相同真空室内的样品表面上的颗粒的三光束装置。 三光束装置包括执行颗粒检查的一个前述双光束装置和执行颗粒检查的一个高分辨率SEM。

公开(公告)号：US20150083912A1

公开(公告)日：2015-03-26

申请号：US14560784

申请日：2014-12-04

Applicant: Hermes Microvision Inc.

Inventor： Zhongwei Chen ,  Jack Jau ,  Weiming Ren

IPC: H01J37/26 ,  H01J37/28

CPC classification number: H01J37/28 ,  H01J37/026 ,  H01J37/10 ,  H01J37/14 ,  H01J37/20 ,  H01J37/22 ,  H01J37/244 ,  H01J37/261 ,  H01J37/285 ,  H01J37/292 ,  H01J2237/04926 ,  H01J2237/1405 ,  H01J2237/24475 ,  H01J2237/24495 ,  H01J2237/24528 ,  H01J2237/2801 ,  H01J2237/2804 ,  H01J2237/2806 ,  H01J2237/2814

Abstract: The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput.

Abstract translation: 本发明提供了检查诸如晶片和掩模之类的样品表面上的小颗粒的装置。 这些装置通过形成暗场BSE图像提供高检测效率和高吞吐量。 这些装置可以通过同时形成SE图像和亮场BSE图像另外检查样品表面上的物理和电气缺陷。 这些装置可被设计成进行单光束或甚至多个单光束检查以实现高吞吐量。

公开(公告)号：US08748814B1

公开(公告)日：2014-06-10

申请号：US13826015

申请日：2013-03-14

Applicant: Hermes Microvision Inc.

Inventor： Hong Xiao ,  Jack Jau

IPC: H01J37/153 ,  G01R31/02

CPC classification number: H01J37/28 ,  G01R31/024 ,  H01J2237/24578 ,  H01J2237/2817

Abstract: This invention provides a test structure for inspecting word line array fabricated by SADP process, wherein the test structure comprises a contour circuit to cover one end of the WL array, and is alternatively float and ground to the word line array. The word line array then can be inspected by using E-beam inspection tool to identify open and short defects.

Abstract translation: 本发明提供了一种用于检查由SADP工艺制造的字线阵列的测试结构，其中测试结构包括覆盖WL阵列的一端的轮廓线，并且交替地浮动并接地到字线阵列。 然后可以使用电子束检查工具来检查字线阵列，以识别开路和短路缺陷。