公开(公告)号：US5506311A

公开(公告)日：1996-04-09

申请号：US335332

申请日：1994-11-03

申请人： Shoji Tamai ,  Masahiro Ohta ,  Saburo Kawashima ,  Katsuaki Iiyama ,  Hideaki Oikawa ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Masahiro Ohta ,  Saburo Kawashima ,  Katsuaki Iiyama ,  Hideaki Oikawa ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08L79/08 ,  C08L81/04

CPC分类号： C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  C08L79/08

摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

公开(公告)号：US5205894A

公开(公告)日：1993-04-27

申请号：US724548

申请日：1991-06-17

申请人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

发明人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C09J179/08

CPC分类号： C08G73/1039 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C09J179/08

摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

公开(公告)号：US5086125A

公开(公告)日：1992-02-04

申请号：US574502

申请日：1990-08-24

申请人： Masahiro Ohta ,  Saburo Kawashima ,  Katsuaki Iiyama ,  Shoji Tamai ,  Hideaki Oikawa ,  Akihiro Yamaguchi

发明人： Masahiro Ohta ,  Saburo Kawashima ,  Katsuaki Iiyama ,  Shoji Tamai ,  Hideaki Oikawa ,  Akihiro Yamaguchi

IPC分类号： C08L79/08

CPC分类号： C08L79/08 ,  Y10S525/906 ,  Y10S525/928

摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin composition of this invention comprises 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide has recurring units of the following formula: ##STR1## wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, ##STR2## The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: ##STR3## aromatic polysulfone consisting of recurring units of the formula: ##STR4## or aromatic polyetherimide consisting of recurring units of the formula: ##STR5##

公开(公告)号：US4797466A

公开(公告)日：1989-01-10

申请号：US11907

申请日：1987-02-06

申请人： Hideaki Oikawa ,  Masahiro Ohta ,  Saburo Kawashima ,  Shoji Tamai ,  Yoshiho Sonobe ,  Akihiro Yamaguchi

发明人： Hideaki Oikawa ,  Masahiro Ohta ,  Saburo Kawashima ,  Shoji Tamai ,  Yoshiho Sonobe ,  Akihiro Yamaguchi

IPC分类号： C08G73/00 ,  C08G73/10 ,  C09J5/06 ,  C09J179/08

CPC分类号： C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C08G73/1085 ,  Y10T428/31721

摘要： This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula ##STR1## (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide can be prepared by reacting 2,6-bis(3-aminophenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid.Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'-benzophenonetetracarboxylic dianhydride.

摘要翻译： 本发明涉及一种新型聚酰亚胺及其制备方法，聚酰亚胺的粘合剂及其应用方法。 聚酰亚胺具有下式的重复单元：其中R是选自具有不少于2个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和未缩合的四价基团 多芳基，其中芳族基团与键或交联官能团相互连接）。 聚酰亚胺可以通过2,6-二（3-氨基苯氧基）吡啶与四羧酸二酐在有机溶剂中反应制得，并酰亚胺化得到的聚酰胺酸。 可以使用各种四羧酸二酐，特别优选的是均苯四酸二酐和3,3'，4,4'-二苯甲酮四羧酸二酐。

公开(公告)号：US5374708A

公开(公告)日：1994-12-20

申请号：US741460

申请日：1991-08-08

申请人： Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi ,  Masumi Saruwatari

发明人： Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi ,  Masumi Saruwatari

IPC分类号： C08G73/10 ,  C08J5/18 ,  C08L79/08 ,  D01F6/74 ,  B29C47/38 ,  B29C47/88 ,  C08G69/26

CPC分类号： C08J5/18 ,  C08G73/1042 ,  C08G73/1071 ,  C08L79/08 ,  D01F6/74 ,  C08J2379/08 ,  Y10T428/2969 ,  Y10T428/31721

摘要： Polyimide filaments and polyimide films having great strength, high elastic modulus and high crystallinity and comprising a novel polyimide which can be melt-processed without impairing high crystallinity and which essentially consists of recurring structural units represented by the formula (I): ##STR1## more than 85 mol % the polyimide consists of recurring structural units of the formula (II): ##STR2## and from 0.5 to 15 mol % of the polyimide consists of recurring structural units represented by the formula (III), the formula (II) exclusive, the formula (IV) and/or the formula (V).

摘要翻译： PCT No.PCT / JP90 / 01679 Sec。 371日期1991年8月8日 102（e）日期1991年8月8日PCT 1990年12月21日PCT PCT。 出版物WO91 / 09900 日本1991年7月11日。具有强度高，弹性模量高，结晶度高的聚酰亚胺丝和聚酰亚胺膜，其包含可以熔融加工而不损害高结晶度的新型聚酰亚胺，并且其主要由式（10）表示的重复结构单元组成 I）：（I）大于85mol％的聚酰亚胺由式（II）的重复结构单元组成：图像（II）和0.5至15mol％的聚酰亚胺由代表性的重复结构单元组成 通式（III），式（II）排除，式（IV）和/或式（V）。

公开(公告)号：US5364967A

公开(公告)日：1994-11-15

申请号：US5276

申请日：1993-01-19

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C07C211/50

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物其中R是H或CH 3，其中R是H或CH 3，还公开了包含这些化合物的形成树脂的组合物。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

公开(公告)号：US5268447A

公开(公告)日：1993-12-07

申请号：US914015

申请日：1992-07-15

申请人： Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/10 ,  C08G69/26

CPC分类号： C08G73/1071

摘要： A readily melt processable polyimide obtained by reacting diamine represented by the formula: 4,4' ##STR1## wherein n is an integer of 1 or 2, with 3,3'4,4' -diphenylethertetracarboxylic dianhydride and/or 4,4' -(p-phenylenedioxy)diphthalic dianhydride or a mixture of these tetracarboxylic acid dianhydrides and pyromellitic dianhydride in the presence of phthalic anhydride.

摘要翻译： 一种容易熔融加工的聚酰亚胺，其通过使由下式表示的二胺与4,4'-二苯基醚四羧酸二酐和/或4,4'-二苯基四羧酸二酐反应得到，其中n为1或2的整数， - （对亚苯基二氧基）二邻苯二甲酸二酐或这些四羧酸二酐和均苯四甲酸二酐在邻苯二甲酸酐存在下的混合物。

公开(公告)号：US5821319A

公开(公告)日：1998-10-13

申请号：US627037

申请日：1996-04-03

申请人： Atsushi Shibuya ,  Yuichi Okawa ,  Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Atsushi Shibuya ,  Yuichi Okawa ,  Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/14 ,  C08L27/12 ,  C08L27/16 ,  C08L77/00 ,  C08L79/08 ,  C08G73/10 ,  C08G69/26

CPC分类号： C08L27/12 ,  C08G73/14 ,  C08L79/08 ,  C08L27/16 ,  C08L77/00 ,  Y10T428/1018 ,  Y10T428/1023 ,  Y10T428/29 ,  Y10T428/2913 ,  Y10T428/2969 ,  Y10T428/31504 ,  Y10T428/31721

摘要： A sliding material and a heat resistant filament which primarily comprises a liquid crystal polyimide, a liquid crystal polyamide or a liquid crystal polyamide-imide copolymer having at least one recurring structural unit selected from the formula (1) and the formula (2) and is excellent in heat resistance, mechanical characteristics and other fundamental properties of polyimides, and relates to significant improvement of heat-resistance by heat-treating the sliding material, the filament and the molded items. The liquid crystal polyamide-imide copolymer which comprises in a polymer molecule 0.05.about.0.95 mole ratio of the recurring structural units of the formula (1) and 0.95.about.0.05 mole ratio of recurring structural units of the formula (2) has excellent processing ability ##STR1##

摘要翻译： 一种滑动材料和耐热丝，其主要包括具有至少一个选自式（1）和式（2）的重复结构单元的液晶聚酰亚胺，液晶聚酰胺或液晶聚酰胺 - 酰亚胺共聚物，并且是 聚酰亚胺的耐热性，机械特性和其它基本性能优异，并且涉及通过热处理滑动材料，长丝和模制品而显着提高耐热性。 在聚合物分子中含有式（1）的重复结构单元的0.05分子量分数0.95摩尔比和式（2）的重复结构单元的0.95摩尔比的液晶聚酰胺 - 酰亚胺共聚物具有优异的加工能力， （1） （2）

公开(公告)号：US5525704A

公开(公告)日：1996-06-11

申请号：US547517

申请日：1995-10-24

申请人： Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C08G73/10

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

公开(公告)号：US5484948A

公开(公告)日：1996-01-16

申请号：US284103

申请日：1994-08-02

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C07D207/444

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。