摘要:
An internal row address signal is generated by a refresh address counter and supplied to a row decoder. In a normal refresh operation, the refresh address counter sequentially increments the internal row address signal on the basis of a trigger signal. As a result, the data in all memory cells is refreshed. In a low-consumption-current refresh operation, at least one of the bits of the internal row address signal is fixed. Hence, the refresh operation is executed only for the memory cells of a predetermined refresh area.
摘要:
A semiconductor integrated circuit device is disclosed. The device includes a memory cell array, an I/O buffer, a read/write buffer, an error checking and correcting circuit, and an initialization checking circuit. N-bit data is input to the I/O buffer and the I/O buffer outputs N-bit data. The I/O buffer inputs N-bit data to the read/write buffer, and the read/write buffer outputs N-bit data to the I/O buffer. The memory cell array inputs up to M×N-bit data to the read/write buffer, and the read/write buffer outputs up to M×N-bit data to the memory cell array. The read/write buffer writes a variable number of bits to the memory cell array (N is a natural number equal to or larger than 1, and M is a natural number equal to or larger than 2).
摘要:
With respect to a substrate on which a resist solution is applied, the inplane uniformity of the quality of a resist film is improved in a heating processing carried out before exposure, and the yields of products are improved. A substrate on which a resist solution is applied is mounted on a heating plate in a processing vessel. Then, a purge gas is supplied into the processing vessel, and heating is started. Above the mounting position of the substrate, a thickness detecting sensor for monitoring the thickness of the resist film formed on the surface of the substrate is provided. When the thickness becomes a predetermined value or less, a control part cause a lift pin to upwardly move so as to increase the distance between the substrate and the heating plate. Thus, the heating value applied to the substrate decreases, and thereafter, only the solvent is volatilized without having a bad influence on a polymer in the resist film.
摘要:
A low-pressure dryer dries a substrate applied a coating solution thereon at low pressure. The dryer includes an airtight chamber installing a substrate table to place the substrate thereon; a diffuser plate, provided as facing the substrate placed on the substrate table with a gap, for discharging gas existing in the gap toward outside, the diffuser plate having a size almost the same as or larger than the substrate; a substrate-temperature adjuster, installed in the substrate table, for adjusting a temperature of the substrate; and a decompression mechanism for decompressing the airtight chamber. The diffuser plate has a temperature adjuster for making temperature adjustments to have a temperature difference between a first region and a second region of the diffuser plate, the first region facing a center region of the substrate, the second region being outside the first region and including a region facing an outer region of the substrate.
摘要:
A semiconductor integrated circuit device includes a memory cell array, an error checking and correcting (ECC) circuit which performs an error checking and correcting operation for readout data read out from the normal data storing portion at data readout time during read latency and an I/O buffer. The memory cell array includes a normal data storing portion and a parity data storing portion. The normal data storing portion stores data for use in a normal data write and a normal data read. The parity data storing portion stores parity data for use in error checking and correcting. The EEC circuit carries out error checking and correcting read data read out from the normal data storing portion, during read latency cycle at a data read operation. The I/O buffer outputs the read data error checked and corrected by the ECC circuit, after the read latency cycle has lapsed.
摘要:
A substrate coated with a coating solution is placed on a heating plate in a processing chamber in which an inert gas is circulating. The substrate is heated on the heating plate while the inert gas is circulating at an extremely small first circulating amount. The substrate is heated further on the heating plate while the inert gas is circulating at a second circulating amount larger than the first circulating amount. Detected is the density of the solvent in the processing chamber. The supply and exhaust amounts of the inert gas are controlled based on the density detected after the start of heating, so that an exhaust amount of the inert gas becomes a predetermined amount for a predetermined period until the solvent density reaches a predetermined density. A necessary control process is performed so that the solvent density reaches the predetermined density when the solvent density has not reached or exceeded the predetermined density after the predetermined period has elapsed. The two-time thermal-process or solvent-density control promotes evaporation of the resist solvent while restricting scattering of a photo-oxidizing agent included in the resist from being promoted beyond the wafer surface, thus achieving coated-film uniformity for the thermal process.
摘要:
A processing apparatus comprises a plurality of process unit groups each including a plurality of process units for subjecting an object to a series of processes, the process units being arranged vertically in multiple stages, an object transfer space being defined among the process unit groups, and a transfer mechanism for transferring the object, the transfer mechanism having a transfer member vertically movable in the object transfer space, the transfer member being capable of transferring the object to each of the process units. The processing apparatus further comprises a mechanism for forming a downward air flow in the object transfer space, a mechanism for controlling the quantity of the downward air flow, and a mechanism for controlling the pressure in the object transfer space. Thus, a variation in condition of the object transfer space is reduced.
摘要:
The present invention provides a substrate treating system for successively treating a plurality of substrates W under an air-conditioned environment. The system comprises an outer casing provided with a cassette transfer port through which a cassette is transferred, a cassette section having a cassette table arranged within an inner space surrounded by the outer casing for supporting the cassette transferred through the cassette transfer port, a sub-arm mechanism for taking the substrates one by one from the cassette section, a process section positioned adjacent to the cassette section and having a plurality of treating units for treating the substrates arranged therein, a main arm mechanism arranged within the process section for receiving the substrates from the sub-arm mechanism arranged in the cassette section and, then, transferring the received substrates to each of the treating units while transferring the treated substrates out of the treating units, an air supply mechanism for supplying a clean air to form a down-stream within the space surrounded by the outer casing, and a partition plate for partitioning the inner space surrounded by the outer casing not to interfere the down-flow of the air formed by the air supply mechanism, the partition plate having a substrate transfer port through which the substrate is transferred from one of the partitioned spaces to the other partitioned space.