摘要:
This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.
摘要:
To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.
摘要:
A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. Thus, a time period till the cutoff of the power source is easily made comparatively long. The power source feeding terminals should preferably be extended onto the insertion side of the semiconductor device, but an extendible distance is sometimes liable to be limited. In order to ensure the necessary time period without changing the length and shape of the power source feeding terminals on the semiconductor device side, each of the power source feeding terminals may be formed so as to have two, front and rear touch points with the corresponding connector terminal of the host equipment side, but complicated improvements are necessitated for the construction of the connector terminal of the host equipment side. According to the semiconductor device, the time period required till the power source cutoff is easily ensured, and the complicated improvements are not required for the construction of the corresponding connector terminals of the host equipment side.
摘要:
To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.
摘要:
This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.
摘要:
A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, wherein the upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.
摘要:
On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.
摘要:
A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. The processing circuits include an interface control circuit (2) which is connected to the external interface terminals, and a rewritable nonvolatile memory (3) which is controlled by the interface control circuit. The nonvolatile memory stores information on the basis of the difference of the threshold voltages of memory cells. The interface control circuit causes a storage area midway of a threshold voltage initialization process to complete a process in which the threshold voltages of the memory cells are uniformalized into a predetermined threshold voltage distribution, before the power source is cut off after the separation of the extraction detecting terminal from the corresponding terminal of the host equipment.
摘要:
A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. These power source feeding terminals are a power source terminal and a ground terminal, and any power source compensating capacitor is not connected between the power source terminal and the ground terminal. Since a time period required till the cutoff of the power source can be easily ensured, a capacitor for compensating the operating power source at the power source cutoff which occurs midway of an operation is not necessitated.