公开(公告)号：US11658262B1

公开(公告)日：2023-05-23

申请号：US16853723

申请日：2020-04-20

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin ,  Hui-Chieh Wang ,  Wan-Ling Huang

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting device is provided. The method for manufacturing the light emitting device includes: providing a substrate with light emitting units disposed thereon; attaching the light emitting units to a carrier; removing the substrate; and transferring a portion of the light emitting units from the carrier to a driving substrate.

公开(公告)号：US11335827B2

公开(公告)日：2022-05-17

申请号：US16858826

申请日：2020-04-27

Applicant: InnoLux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Tung-Kai Liu ,  Hui-Chieh Wang ,  Chun-Hsien Lin ,  Jui-Feng Ko

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/32

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

公开(公告)号：US10720553B2

公开(公告)日：2020-07-21

申请号：US16581939

申请日：2019-09-25

Applicant: InnoLux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Hui-Chieh Wang ,  Shu-Ming Kuo ,  Ming-I Chao ,  Shun-Yuan Hu

IPC: H01L21/56 ,  H01L33/44 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16

Abstract: A display device is provided. The display device includes a thin-film transistor substrate, a conductive pad disposed on the thin-film transistor substrate, and an adhesion film disposed on the conductive pad. The adhesion film includes a plurality of conductive particles. The display device also includes a light-emitting component disposed on the adhesion film. The light-emitting component includes a connection feature. The display device also includes a protection layer partially surrounding the light-emitting component. The connection feature of the light-emitting component has a lower portion not surrounded by the protection layer. The adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0

公开(公告)号：US10483434B2

公开(公告)日：2019-11-19

申请号：US15659947

申请日：2017-07-26

Applicant: InnoLux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Hui-Chieh Wang ,  Shu-Ming Kuo ,  Ming-I Chao ,  Shun-Yuan Hu

IPC: H01L33/44 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16

Abstract: A display device is provided. The display device includes a thin-film transistor substrate, a conductive pad disposed on the thin-film transistor substrate, and an adhesion film disposed on the conductive pad. The adhesion film includes a plurality of conductive particles. The display device also includes a light-emitting component disposed on the adhesion film. The light-emitting component includes a connection feature. The display device also includes a protection layer partially surrounding the light-emitting component. The connection feature of the light-emitting component has a lower portion not surrounded by the protection layer. The adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0

公开(公告)号：US10366910B2

公开(公告)日：2019-07-30

申请号：US15604609

申请日：2017-05-24

Applicant: Innolux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Bo-Feng Chen ,  Hui-Chieh Wang

IPC: H01L21/67 ,  H05K3/00 ,  H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00 ,  H05K3/40 ,  H05K1/11

Abstract: The current disclosure provides a pickup and placing device including a control element, a substrate and a pickup structure. The substrate has an upper surface and a lower surface opposite to each other and a plurality of conductive via structures, wherein the conductive via structures are electrically connected to the control element. The pickup structure includes a plurality of pickup heads used for picking up or placing a plurality of light emitting diodes respectively. The pickup structure is disposed on the lower surface of the substrate or disposed in the substrate and extended outside the substrate, and the substrate is disposed between the control element and the pickup structure, wherein the pickup heads are electrically connected to the conductive via structures.

公开(公告)号：US10177177B2

公开(公告)日：2019-01-08

申请号：US15064236

申请日：2016-03-08

Applicant: InnoLux Corporation

Inventor： Kuan-Feng Lee ,  Hui-Chieh Wang

IPC: H01L27/12 ,  H01L29/786 ,  H01L27/32 ,  G02F1/1368 ,  G02F1/1362 ,  G02F1/1333 ,  H01L51/52

Abstract: A display panel includes a TFT substrate, an opposite substrate and a display layer. A TFT of the TFT substrate has a drain. A first insulating layer has a first sub-layer and a second sub-layer disposed on the drain sequentially. The first sub-layer has a first opening with a first width. The second sub-layer has a second opening with a second width on the first opening. The first and second openings form a first via, and the second width is greater than the first width. A passivation layer is disposed on the first insulating layer. A second insulating layer is disposed on the passivation layer. A pixel electrode layer is disposed on the second insulating layer and disposed in the first via to connect the drain. The display layer is disposed between the TFT substrate and the opposite substrate.