Abstract:
A light-emitting device is provided, which includes a flexible substrate having a via, a top surface, and a bottom surface, a light-emitting unit having a first electrode and a second electrode, and disposed on the top surface, a thin film transistor electrically connected to the light-emitting unit, a circuit disposed on the bottom surface, a conductive layer disposed in the via, a barrier layer covering the conductive layer, another conductive layer electrically connected to and in contact with the conductive layer and disposed outside the via, and another barrier layer in contact with a top surface of the another conductive layer. The conductive layer and the another conductive layer are disposed on opposite sides of the flexible substrate. The circuit is electrically connected to the first electrode through the via and electrically connected to the first electrode through the thin film transistor.
Abstract:
An electronic device includes an electronic unit, an encapsulation layer surrounding the electronic unit, a circuit structure electrically connected to the electronic unit and a bonding component. The circuit structure includes a first metal layer electrically connected to the electronic unit, a first dielectric layer disposed on the first metal layer and having an opening and a second metal layer disposed in the opening. The bonding component overlaps the second metal layer, and at least partially disposed in the opening. In cross-sectional view, a first height between a first dielectric layer top surface and a first metal layer top surface is greater than a second height between a second metal layer top surface and the first metal layer top surface. A difference between the first height and the second height is greater than or equal to 1 μm and less than or equal to 15 μm.
Abstract:
A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.
Abstract:
A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.
Abstract:
An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.
Abstract:
An electronic device is provided. The electronic device includes a plurality of light-emitting elements and a first thin-film transistor array. The first thin-film transistor array is used to drive at least a portion of the plurality of light-emitting elements, and the plurality of light-emitting elements and the first thin-film transistor array are disposed on different substrates.
Abstract:
An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.
Abstract:
A substrate unit, a display device, and a method for manufacturing the display device are disclosed. The method for manufacturing the display device includes the steps of: providing a first carrier plate and forming a first interlayer on the first carrier plate; disposing a first glass substrate on the first interlayer to form a first substrate unit; forming a first device layer on the first glass substrate to obtain a first device substrate; providing a second carrier plate and forming a second interlayer on the second carrier plate; disposing a second glass substrate on the second interlayer to form a second substrate unit; combining the first device substrate with the second substrate unit; separating the first glass substrate from the first interlayer; and separating the second glass substrate from the second interlayer to obtain the display device.
Abstract:
A display manufacturing method comprises steps of: moving a first substrate and a second substrate by a conveying apparatus; and implementing a first exposure and a second exposure of the first substrate and a first exposure and a second exposure of the second substrate by at least one light emitting element when the conveying apparatus drives the first and second substrates to pass through the light source module. When the first exposures of the first and second substrates are implemented, the moving directions of the first and second substrates are opposite, or when the second exposures of the first and second substrates are implemented, the moving directions of the first and second substrates are opposite. A photo alignment process is also disclosed.
Abstract:
A method for manufacturing display panel is disclosed, which comprises: (A) providing a substrate, an oxide semiconductor layer disposed on the substrate, and a gate electrode disposed on the substrate and corresponding to the oxide semiconductor layer; (B) forming a metal layer on the oxide semiconductor layer; (C) forming a photoresist on the metal layer, and etching the metal layer to form a source electrode and a drain electrode; (D) heating the photoresist and the photoresist covers at least partial of side walls of the source electrode and the drain electrode; (E) applying an alkaline solution on the substrate; and (F) removing the photoresist to expose the source electrode and the drain electrode.