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    SPACE-EFFICIENT PRESSURE RELIEF MECHANISM FOR IMMERSION COOLING OF COMPUTING ELEMENTS
    21.
    发明申请
    SPACE-EFFICIENT PRESSURE RELIEF MECHANISM FOR IMMERSION COOLING OF COMPUTING ELEMENTS 审中-公开

    公开(公告)号：US20200037469A1

    公开(公告)日：2020-01-30

    申请号：US16593624

    申请日：2019-10-04

    申请人： International Business Machines Corporation

    发明人： Shurong Tian ,  Todd E. Takken

    IPC分类号： H05K7/20 ,  G06F1/20

    摘要： A cooling apparatus includes a chamber and a pressure-relief element. The chamber includes a coolant in a liquid phase disposed near a heat-generation object. The coolant in the liquid phase dissipates heat from the heat-generation object and is converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature. The pressure-relief element has a conduit. A first end of the conduit is submerged in the coolant in the liquid phase internal to the chamber and a second end of the conduit is connected to atmosphere external to the chamber.

    SPACE-EFFICIENT PRESSURE RELIEF MECHANISM FOR IMMERSION COOLING OF COMPUTING ELEMENTS
    23.
    发明申请
    SPACE-EFFICIENT PRESSURE RELIEF MECHANISM FOR IMMERSION COOLING OF COMPUTING ELEMENTS 审中-公开

    公开(公告)号：US20190200483A1

    公开(公告)日：2019-06-27

    申请号：US15854986

    申请日：2017-12-27

    申请人： International Business Machines Corporation

    发明人： Shurong Tian ,  Todd E. Takken

    IPC分类号： H05K7/20 ,  G06F1/20

    摘要： A cooling apparatus includes a chamber and a pressure-relief element. The chamber includes a coolant in a liquid phase disposed near a heat-generation object. The coolant in the liquid phase dissipates heat from the heat-generation object and is converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature. The pressure-relief element has a conduit. A first end of the conduit is submerged in the coolant in the liquid phase internal to the chamber and a second end of the conduit is connected to atmosphere external to the chamber.

    Flexible cold plate with enhanced flexibility
    24.
    发明授权
    Flexible cold plate with enhanced flexibility 有权

    公开(公告)号：US10215504B2

    公开(公告)日：2019-02-26

    申请号：US14818117

    申请日：2015-08-04

    申请人： International Business Machines Corporation

    发明人： Paul W. Coteus ,  Shawn A. Hall ,  Mark D. Schultz ,  Todd E. Takken ,  Shurong Tian

    IPC分类号： F28F7/00 ,  F28F3/12 ,  F28F3/14 ,  F28F3/04 ,  H01L23/473 ,  H05K7/20

    摘要： An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.

    Near-chip compliant layer for reducing perimeter stress during assembly process
    26.
    发明授权
    Near-chip compliant layer for reducing perimeter stress during assembly process 有权
    用于减少组装过程中周边应力的近芯片兼容层

    公开(公告)号：US09570373B1

    公开(公告)日：2017-02-14

    申请号：US14963466

    申请日：2015-12-09

    申请人： International Business Machines Corporation

    发明人： Mark D. Schultz ,  Todd E. Takken ,  Shurong Tian ,  Yuan Yao

    IPC分类号： H01L23/367 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H01L21/48 ,  H01L23/34

    CPC分类号： H01L23/3675 ,  H01L21/4882 ,  H01L23/10 ,  H01L23/345 ,  H01L23/36 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50

    摘要： A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.

    摘要翻译： 在基板的第一侧上设置有热源（单个半导体芯片或类似高度的紧密间隔的半导体芯片组），该基板在所述第一侧上具有包括可压缩材料的支撑构件。 与所述热源成角度定向的散热部件被接近所述热源，使得所述散热部件在接触所述热源之前接触所述支撑部件。 所述除热部件组装到所述热源，使得所述支撑构件至少部分地吸收否则将施加到所述热源的全局不均匀力，而不存在所述支撑构件包括所述可压缩材料。

    Cooling system for electronic components
    27.
    发明授权
    Cooling system for electronic components 有权
    电子元件冷却系统

    公开(公告)号：US09213378B2

    公开(公告)日：2015-12-15

    申请号：US13781837

    申请日：2013-03-01

    申请人： International Business Machines Corporation

    发明人： William James Anderl ,  Evan George Colgan ,  James Dorance Gerken ,  Christopher Michael Marroquin ,  Shurong Tian

    IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H01L23/473

    CPC分类号： G06F1/206 ,  H01L23/4093 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

    摘要翻译： 本发明的实施例提供电子外壳的非中断流体冷却。 可以从具有流体流动系统的电路卡移除一个或多个电子部件封装。 当安装时，电子部件封装与流体流动系统重合并处于热关系。 如果特定的电子部件封装变得不起作用，则可以从电子外壳移除，而不会影响流体流动系统或其他相邻的电子元件封装。

    FLEXIBLE COLD PLATE FOR CONTACTING VARIED AND VARIABLE CHIP HEIGHTS
    30.
    发明申请
    FLEXIBLE COLD PLATE FOR CONTACTING VARIED AND VARIABLE CHIP HEIGHTS 有权

    公开(公告)号：US20220408544A1

    公开(公告)日：2022-12-22

    申请号：US17304252

    申请日：2021-06-17

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Shurong Tian ,  Todd Edward Takken

    IPC分类号： H05K1/02 ,  H05K7/20

    摘要： An apparatus comprising chips mounted to a substrate, wherein one or more of the chips comprises a first height and one or more of the chips comprises a second height, wherein the first height is taller than the second height. A cold plate located above the plurality of chips, wherein the cold plate includes a bottom wall and a top wall, wherein the cold plate includes a plurality of cooling fins that are attached to the bottom wall of the cold plate, wherein the cold plate accommodates the plurality of chips, wherein the chips includes chips having the first height and the second height.