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公开(公告)号：US08401345B2
公开(公告)日：2013-03-19
申请号：US12816935
申请日：2010-06-16
IPC分类号： G02F1/035
CPC分类号： G02B6/1228 , G02F1/01708 , G02F2001/0157
摘要： An integrated circuit that includes an optical waveguide defined in a semiconductor layer is described. In this integrated circuit, light is coupled between the optical waveguide and an optical modulator, which is disposed on the optical waveguide, using 3-dimensional (3-D) taper structures that are proximate to the ends of the optical modulator. The cross-sectional areas of these 3-D taper structures transition, over a distance, from that of the optical waveguide (distal from the optical modulator) to that of optical modulator (proximate to the ends of the optical modulator). In this way, a spatial extent of an optical mode in the optical waveguide and a spatial extent of the optical mode in the optical modulator may be approximately matched to reduce the optical loss when the light is coupled to or from the optical modulator.
摘要翻译： 描述了包括在半导体层中限定的光波导的集成电路。 在该集成电路中，使用靠近光调制器的端部的3维（3-D）锥形结构将光耦合在光波导和设置在光波导上的光调制器之间。 这些3-D锥形结构的横截面积在一段距离上与光波导（远离光调制器）的横截面面积转换到光调制器（近于光调制器的端部）的截面面积。 以这种方式，光学波导中的光学模式的空间范围和光学调制器中的光学模式的空间范围可以近似匹配，以减少当光耦合到光学调制器时的光学损耗。
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公开(公告)号：US08121446B2
公开(公告)日：2012-02-21
申请号：US12566101
申请日：2009-09-24
CPC分类号： G02B6/4214 , G02B6/4201 , G02B6/43
摘要： A multi-chip module (MCM) is described. This MCM includes two substrates having facing surfaces. Disposed on a surface of a first of these substrates, there is an optical waveguide, having an eigenmode in the plane of the surface, and an optical coupler, which redirects optical signals to and/or from the optical waveguide and a direction normal to the surface. Furthermore, disposed on a surface of a second of the substrates, which faces the surface of the first substrate, and which overlaps the optical coupler, there is an optoelectronic device. This optoelectronic device, which has an eigenmode in a direction perpendicular to the surface of the second substrate, selectively receives or provides the optical signal to and/or from the optical coupler. For example, the selective receiving or providing may be controlled by selectively applying a potential to the quantum-well device, thereby changing the optical properties of the optoelectronic device.
摘要翻译： 描述了多芯片模块（MCM）。 该MCM包括具有相对表面的两个基板。 设置在这些基板中的第一个基板的表面上，存在在表面的平面中具有本征模的光波导和光耦合器，其将光信号重定向到和/或从光波导和垂直于 表面。 此外，设置在面对第一基板的表面并且与光耦合器重叠的第二基板的表面上，存在光电子器件。 该光电子器件在垂直于第二衬底的表面的方向上具有本征模式，选择性地接收或向光耦合器提供光信号。 例如，可以通过选择性地向量子阱器件施加电势来控制选择性接收或提供，从而改变光电器件的光学特性。
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公开(公告)号：US20120207424A1
公开(公告)日：2012-08-16
申请号：US12816935
申请日：2010-06-16
IPC分类号： G02F1/035
CPC分类号： G02B6/1228 , G02F1/01708 , G02F2001/0157
摘要： An integrated circuit that includes an optical waveguide defined in a semiconductor layer is described. In this integrated circuit, light is coupled between the optical waveguide and an optical modulator, which is disposed on the optical waveguide, using 3-dimensional (3-D) taper structures that are proximate to the ends of the optical modulator. The cross-sectional areas of these 3-D taper structures transition, over a distance, from that of the optical waveguide (distal from the optical modulator) to that of optical modulator (proximate to the ends of the optical modulator). In this way, a spatial extent of an optical mode in the optical waveguide and a spatial extent of the optical mode in the optical modulator may be approximately matched to reduce the optical loss when the light is coupled to or from the optical modulator.
摘要翻译： 描述了包括在半导体层中限定的光波导的集成电路。 在该集成电路中，使用靠近光调制器的端部的3维（3-D）锥形结构将光耦合在光波导和设置在光波导上的光调制器之间。 这些3-D锥形结构的横截面积在一段距离上与光波导（远离光调制器）的横截面面积转换到光调制器（近于光调制器的端部）的截面面积。 以这种方式，光学波导中的光学模式的空间范围和光学调制器中的光学模式的空间范围可以近似匹配，以减少当光耦合到光学调制器时的光学损耗。
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公开(公告)号：US20100266295A1
公开(公告)日：2010-10-21
申请号：US11962415
申请日：2007-12-21
IPC分类号： H04B10/12
CPC分类号： H04J14/02 , H04B10/801 , H04J14/0227 , H04Q11/0062 , H04Q2011/0096
摘要： Embodiments of a system are described. This system includes an array of chip modules (CMs) that are configured to communicate data signals with each other via optical communication. In a given CM module, optical signal paths, such as waveguides, are routed in the same way as in the other CMs in the array. In this way, a common optical design in the CMs may be used in the system to prevent data conflicts during the optical communication.
摘要翻译： 描述系统的实施例。 该系统包括被配置为经由光通信彼此通信数据信号的芯片模块（CM）阵列。 在给定的CM模块中，诸如波导的光信号路径以与阵列中的其他CM相同的方式路由。 以这种方式，可以在系统中使用CM中的普通光学设计来防止光通信期间的数据冲突。
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公开(公告)号：US08670671B2
公开(公告)日：2014-03-11
申请号：US13361866
申请日：2012-01-30
CPC分类号： H04J14/02 , H04B10/506 , H04J14/0221
摘要： An optical source includes a set of N light sources that provide a corresponding set of N optical signals having N carrier wavelengths. These optical signals are combined into a seed optical signal and transported to a substrate using an optical fiber. This substrate includes a set of K optical amplifiers that amplify the seed optical signal and provide a set of M output optical signals on a corresponding set of M output optical waveguides (where M is less than K). In this way, a total power of the set of M output optical signals may be significantly larger than that of the seed optical signal, thereby ensuring that a majority of a power efficiency of the optical source is associated with power efficiencies of the set of K optical amplifiers instead of power efficiencies of the set of N light sources.
摘要翻译： 光源包括一组N个光源，其提供具有N个载波波长的相应的一组N个光信号。 这些光信号被组合成种子光信号，并使用光纤传输到基板。 该衬底包括一组放大种子光信号的K个放大器，并在相应的一组M个输出光波导（其中M小于K）上提供一组M个输出光信号。 以这种方式，一组M个输出光信号的总功率可以显着大于种子光信号的总功率，从而确保光源的大部分功率效率与该组K的功率效率相关联 光放大器而不是N组光源的功率效率。
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公开(公告)号：US08467632B2
公开(公告)日：2013-06-18
申请号：US12986062
申请日：2011-01-06
IPC分类号： G02F1/01
CPC分类号： G02F1/025 , G02F2001/0157
摘要： During operation of an electro-absorption modulator, an optical signal is conveyed, using an optical waveguide in the electro-absorption modulator, to a semiconductor layer that substantially fills a gap between two portions of the optical waveguide. Then, the optical signal is electro-absorption modulated by selectively applying a voltage to electrodes that produces an electric field, approximately perpendicular to the midline of the optical waveguide, in the semiconductor layer. These electrodes are coupled to the edges of the semiconductor layer at the periphery along the width of the semiconductor layer by intervening layers. Furthermore, the intervening layers include a material that has a lower index of refraction than the semiconductor layer, and a lower optical absorption than the electrodes.
摘要翻译： 在电吸收调制器的操作期间，使用电吸收调制器中的光波导将光信号传送到基本上填充光波导的两个部分之间的间隙的半导体层。 然后，通过选择性地向在半导体层中产生大致垂直于光波导的中线的电场的电极施加电压来对光信号进行电吸收调制。 这些电极通过中间层沿半导体层的宽度在周边连接到半导体层的边缘。 此外，中间层包括具有比半导体层低的折射率的材料，并且具有比电极更低的光学吸收。
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公开(公告)号：US08267583B2
公开(公告)日：2012-09-18
申请号：US12581709
申请日：2009-10-19
CPC分类号： G02B6/13 , G02B6/12002
摘要： A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip.
摘要翻译： 描述了包括使用光学互连耦合的三维（3D）芯片堆叠的多芯片模块（MCM）。 在该MCM中，设置在3D堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到第三光耦合器的第二光耦合器， 光波导。 第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。 此外，第二光学耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面）或从第二方向到光波导。 注意，与第二方向相关联的光路通过中间芯片中的衬底中的开口。
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公开(公告)号：US08207752B2
公开(公告)日：2012-06-26
申请号：US12685159
申请日：2010-01-11
申请人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
发明人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
IPC分类号： H03K19/003
CPC分类号： H03K19/177
摘要： A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.
摘要翻译： 描述了多芯片模块（MCM）。 该MCM包括多个站点，其中多个站点中的给定站点包括具有邻近连接器的多个芯片，其通过与给定站点相关联的多个组件在MCM内通过邻近通信传递信息。 请注意，MCM包括给定站点的全局冗余和本地冗余。 特别地，全局冗余涉及在多个站点中提供一个或多个冗余站点。 此外，本地冗余包括在多个芯片中提供一个或多个冗余芯片以及在多个组件中提供一个或多个冗余组件。
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公开(公告)号：US08772920B2
公开(公告)日：2014-07-08
申请号：US13182220
申请日：2011-07-13
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/18 , H01L25/50 , H01L2224/13005 , H01L2224/13017 , H01L2224/13027 , H01L2224/13109 , H01L2224/13111 , H01L2224/13147 , H01L2224/14181 , H01L2224/14183 , H01L2224/16105 , H01L2224/16108 , H01L2224/16111 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/481 , H01L2224/48227 , H01L2224/73103 , H01L2224/81138 , H01L2224/81899 , H01L2225/06551 , H01L2225/06555 , H01L2225/06593 , H01L2924/01327 , H01L2924/07802 , H01L2924/12042 , H01L2924/01082 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012 , H01L2924/00
摘要： In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are aligned by positive features that are mechanically coupled to negative features recessed below the surfaces of adjacent semiconductor dies. Moreover, the chip package includes an interposer plate at approximately a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the interposer plate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as solder balls or spring connectors. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the interposer plate.
摘要翻译： 在芯片封装中，半导体管芯或芯片（被称为“板堆叠”）的垂直堆叠中的半导体管芯通过机械耦合到相邻半导体管芯的表面下方的负特性的正特征对准。 此外，芯片封装包括与板堆叠大致成直角的插入板，其沿着板堆的边缘电耦合到半导体管芯。 特别地，靠近插入板的表面（沿着板堆叠的堆叠方向）的电焊盘通过中间导电材料（例如焊料球）电耦合到靠近半导体管芯的边缘的焊盘， 弹簧连接器。 注意，芯片封装可以促进半导体管芯和插入板之间的信号的高带宽通信。
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公开(公告)号：US08796811B2
公开(公告)日：2014-08-05
申请号：US13205745
申请日：2011-08-09
IPC分类号： H01L27/12 , H01L21/50 , G02B6/10 , H01L27/146 , H01L27/148
CPC分类号： H01L27/1465 , H01L21/187 , H01L27/14661 , H01L27/1467 , H01L27/14881 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00
摘要： In a hybrid integrated module, a semiconductor die is mechanically coupled face-to-face to an integrated device in which the substrate has been removed. For example, the integrated circuit may include an optical device fabricated on a silicon-on-insulator (SOI) wafer in which the backside silicon handler has been completely removed, thereby facilitating improved device performance and highly efficient thermal tuning of the operating wavelength of the optical device. Moreover, the semiconductor die may be a VLSI chip that provides power, and serves as a mechanical handler and/or an electrical driver. The thermal tuning efficiency of the substrateless optical device may be enhanced by over 100× relative to an optical device with an intact substrate, and by 5× relative to an optical device in which the substrate has only been removed in proximity to the optical device.
摘要翻译： 在混合集成模块中，将半导体管芯面对面地机械耦合到已经去除衬底的集成器件。 例如，集成电路可以包括制造在绝缘体上硅（SOI）晶片上的光学器件，其中背面硅处理器已经被完全去除，从而有助于改进器件性能和高效率地调谐工作波长 光学装置。 此外，半导体管芯可以是提供电力并用作机械处理器和/或电驱动器的VLSI芯片。 相对于具有完整衬底的光学器件，无基底光学器件的热调谐效率可以提高超过100倍，并且相对于其中衬底仅在光学器件附近被去除的光学器件可以提高5倍。
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