摘要:
A synchronization scheme for bidirectional data applications where the customer supplies data for transmission at a rate which is customer controlled. In accordance with the present invention, in each transmission direction, the customer data is converted into data symbols in a predetermined constellation. In response to these data symbols, additional symbols are added. In the disclosed embodiment, the additional symbols added are symbols lying outside of the constellation and are not used to represent customer data. The additional symbols added raise the symbol rate in each transmission direction to one higher than that provided by the symbols representative of the customer data alone. This higher symbol rate in each transmission direction is preferably the same, or the higher symbol rate in one direction is related to the higher symbol rate in the other direction by a rational number. At each receiver, the additional symbols are removed and customer data is recovered from its representative data symbols.
摘要:
To reduce near-end crosstalk (NEXT) in systems possessing excess bandwidth, a signal is transmitted from a first to a second location. At the second location, the received signal is examined and a characteristic of this signal is determined while the delay provided in the transmit signal path at this location is varied. Based on this examination, a particular amount of delay is introduced into the transmit signal path which reduces NEXT. This process is repeated for each direction of transmission. In the disclosed embodiment, the characteristic of the received signal which is determined is the mean square error and the amount of delay selected is that corresponding to the minimum mean square error.
摘要:
The present disclosure generally discloses a three-dimensional (3D) image reconstruction capability. The 3D image reconstruction capability may be configured to support reconstruction of a 3D image of a scene. The 3D image reconstruction capability may be configured to support reconstruction of a 3D image of a scene based on lensless compressive image acquisition performed using a lensless compressive camera having a single aperture and a set of multiple sensors. The reconstructed 3D image of a scene may include (1) image data indicative of a set of multiple two-dimensional (2D) images reconstructed based on the set of multiple sensors of the lensless compressive camera (which may be represented as images) and (2) depth information indicative of depths at points or areas of an overlapping portion of the multiple images reconstructed based on the set of multiple sensors of the lensless compressive camera (which may be represented as a depth map).
摘要:
A communication method and a related apparatus for header compression by using an automatic retransmission mechanism are disclosed. The method comprises determining with a receive end parameters required for performing header compression and an ARQ through negotiation, constructing a lower-layer PDU that comprises header compression information, and sending the PDU to a receive end. By using methods provided in the embodiments of the present invention, combination of a header compression mechanism and an ARQ mechanism may be implemented, thereby improving header compression efficiency and accuracy, and saving air interface resources.
摘要:
Three dimensional integrated circuits with double sided power, coolant, and data features and methods of constructing same are provided. According to some embodiments, an integrated circuit package can generally comprise one or more semiconductor wafers and opposing end substrates. The semiconductor wafers can each have a top exterior surface and a bottom exterior surface. The plurality of semiconductor wafers can form a multi-dimensional wafer stack of die wafers such that adjacent wafers have facing surfaces. Each of the semiconductor wafers can comprise one or more channels formed through the wafers. A portion of the channels can extend generally between the top and bottom exterior surfaces of the semiconductor wafers. A portion of the channels can carry conductors for coupling the wafers and/or coolant for cooling the wafers. The opposing end substrates can be disposed proximate opposing ends of the multi-dimensional stack. The opposing end substrates can be configured to supply power, coolant, and data signals to opposing ends of the multi-dimensional wafer stack. Other embodiments are also claimed and described.
摘要:
An exemplary lensless compressive imaging device may include a micro mirror array having a plurality of mirror elements that are individually controllable for selectively directing light reflecting from the micro mirror array. A detector detects light reflected from at least one of the mirror elements. A processor provides compressive image information based on the detected light.
摘要:
Use of DKK-1 protein or the nucleic acid sequence in preparation of cancer diagnostic agents or kits, method to detect liver cancer with the monoclonal antibody thereof, the kit comprising anti-DKK-1 antibody or protein specific nucleic acid probes, together with a label, and method to detecting specific DKK-1 protein expression are disclosed.
摘要:
Advance training information is provided to a receiving Home network station via auxiliary coding, synchronized and/or included in the relevant Ethernet type packet. The advance training information may be, e.g., past equalizer, timing recovery circuit, AGC circuit, echo canceler values resulting from the reception of a previous frame. The training information may be, e.g., an early identity of the source of the packet, with a subsequent lookup performed by the receiving station for predetermined training value(s), or the training values themselves may be transmitted to the home network receiver via auxiliary coding. The auxiliary coding information may be transmitted before and/or during the frame training period of the relevant frame. This permits use of predetermined training values specific to the particular transmitter based on past frames received from that same transmitter during the training period for the received signal to be further refined from that determined from the auxiliary coding, resulting in more efficient and more accurate training of, e.g., a receiving equalizer, time recovery circuits, AGC, echo canceler, etc. Exemplary auxiliary coding techniques include, e.g., BPSK, FSK, QAM.
摘要:
Three dimensional integrated circuits with double sided power, coolant, and data features and methods of constructing same are provided. According to some embodiments, an integrated circuit package can generally comprise one or more semiconductor wafers and opposing end substrates. The semiconductor wafers can each have a top exterior surface and a bottom exterior surface. The plurality of semiconductor wafers can form a multi-dimensional wafer stack of die wafers such that adjacent wafers have facing surfaces. Each of the semiconductor wafers can comprise one or more channels formed through the wafers. A portion of the channels can extend generally between the top and bottom exterior surfaces of the semiconductor wafers. A portion of the channels can carry conductors for coupling the wafers and/or coolant for cooling the wafers. The opposing end substrates can be disposed proximate opposing ends of the multi-dimensional stack. The opposing end substrates can be configured to supply power, coolant, and data signals to opposing ends of the multi-dimensional wafer stack. Other embodiments are also claimed and described.
摘要:
A housing, comprising: a substrate; and a vacuum depositing coating formed on the substrate by vacuum depositing method, the vacuum depositing coating including a first metal coating, a second metal coating formed on the first metal coating, and a third metal coating formed on the second metal coating; wherein the first metal coating is an aluminum coating having a light transmittance of about 25-35%, the second metal coating is a silicon dioxide coating having a thickness of about 150-450 nm, and the third metal coating is a titanium coating having a light transmittance of about 45-55%. A method for making the housing is also described.