Electrically conductive paste and multilayer ceramic substrate
    23.
    发明申请
    Electrically conductive paste and multilayer ceramic substrate 有权
    导电胶和多层陶瓷基板

    公开(公告)号:US20070080329A1

    公开(公告)日:2007-04-12

    申请号:US10576801

    申请日:2004-11-10

    IPC分类号: H01B1/12

    摘要: An electrically conductive paste used for forming wiring conductors, such as via holes (15) disposed on a multilayer ceramic substrate (11), is provided, wherein the temperature range, in which sintering is effected in a firing step, can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a grass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (12) included in the multilayer ceramic substrate (11) in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

    摘要翻译: 提供了用于形成布线导体的导电糊,例如设置在多层陶瓷基片(11)上的通孔(15),其中在烧结步骤中进行烧结的温度范围可被相对最佳地控制 。 导电糊包含金属粉末,草料和有机载体。 在烧成工序中包含在多层陶瓷基板(11)中的陶瓷层(12)的烧结温度下不烧结的无机成分配置在金属粉末的粒子表面。 玻璃料的软化点比上述烧结温度低150℃〜300℃。