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公开(公告)号：US20160025648A1
公开(公告)日：2016-01-28
申请号：US14803872
申请日：2015-07-20
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Saibal Banerjee
CPC classification number: G01N21/8851 , G01N21/9501 , G01N2021/8887 , H01J37/222 , H01J37/26 , H01J37/28 , H01J2237/22 , H01J2237/221 , H01J2237/26 , H01J2237/2817
Abstract: Methods and systems for determining one or more characteristics for defects detected on a specimen are provided. One system includes one or more computer subsystems configured for identifying a first defect that was detected on a specimen by an inspection system with a first mode but was not detected with one or more other modes. The computer subsystem(s) are also configured for acquiring, from the storage medium, one or more images generated with the one or more other modes at a location on the specimen corresponding to the first defect. In addition, the computer subsystem(s) are configured for determining one or more characteristics of the acquired one or more images and determining one or more characteristics of the first defect based on the one or more characteristics of the acquired one or more images.
Abstract translation: 提供了用于确定在样本上检测到的缺陷的一个或多个特性的方法和系统。 一个系统包括一个或多个计算机子系统，其配置用于通过具有第一模式的检查系统识别在样本上检测到的第一缺陷，但是未用一个或多个其他模式检测到。 计算机子系统还被配置为从存储介质获取在与第一缺陷相对应的样本上的位置处用一个或多个其他模式生成的一个或多个图像。 另外，计算机子系统被配置用于确定所获取的一个或多个图像的一个或多个特性，并且基于所获取的一个或多个图像的一个或多个特性来确定第一缺陷的一个或多个特性。
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公开(公告)号：US20150324964A1
公开(公告)日：2015-11-12
申请号：US14707573
申请日：2015-05-08
Applicant: KLA-Tencor Corporation
Inventor： Eugene Shifrin , Chetana Bhaskar , Ashok V. Kulkarni , Chien-Huei (Adam) Chen , Kris Bhaskar , Brian Duffy
IPC: G06T7/00
CPC classification number: G06T7/001 , G06T2200/28 , G06T2207/30148
Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.
Abstract translation: 提供了用于生成用于晶片检查过程的信息的系统和方法。 一种方法包括获取位于晶片上的模具的检查系统的输出，基于输出的管芯位置组合用于管芯的输出，在内部管芯位置的基础上确定统计学 基于针对模具位置确定的统计特性，将组合输出的特性值的变化的属性以及将模具位置分配给不同的组。 该方法还包括在用于执行晶片检查过程的检查系统可访问的存储介质中存储用于管芯位置和内部管芯位置分配的不同组的信息，其包括应用缺陷检测参数， 基于该信息为晶片生成的检查系统的附加输出，从而检测晶片上的缺陷。
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公开(公告)号：US10713769B2
公开(公告)日：2020-07-14
申请号：US16424431
申请日：2019-05-28
Applicant: KLA-Tencor Corporation
Inventor： Jing Zhang , Yujie Dong , Brian Duffy , Richard Wallingford , Michael Daino , Kris Bhaskar
Abstract: Methods and systems for performing active learning for defect classifiers are provided. One system includes one or more computer subsystems configured for performing active learning for training a defect classifier. The active learning includes applying an acquisition function to data points for the specimen. The acquisition function selects one or more of the data points based on uncertainty estimations associated with the data points. The active learning also includes acquiring labels for the selected one or more data points and generating a set of labeled data that includes the selected one or more data points and the acquired labels. The computer subsystem(s) are also configured for training the defect classifier using the set of labeled data. The defect classifier is configured for classifying defects detected on the specimen using the images generated by the imaging subsystem.
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公开(公告)号：US20200126212A1
公开(公告)日：2020-04-23
申请号：US16364161
申请日：2019-03-25
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Martin Plihal , Santosh Bhattacharyya , Gordon Rouse , Chris Maher , Erfan Soltanmohammadi
IPC: G06T7/00 , H01L21/66 , G06T7/11 , G01R31/308 , G03F7/20
Abstract: Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.
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公开(公告)号：US10539612B2
公开(公告)日：2020-01-21
申请号：US15136680
申请日：2016-04-22
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy
IPC: G01R31/305 , G01R31/307
Abstract: A voltage contrast imaging defect detection system includes a voltage contrast imaging tool and a controller coupled to the voltage contrast imaging tool. The controller is configured to generate one or more voltage contrast imaging metrics for one or more structures on a sample, determine one or more target areas on the sample based on the one or more voltage contrast imaging metrics, receive a voltage contrast imaging dataset for the one or more target areas on the sample from the voltage contrast imaging tool, and detect one or more defects based on the voltage contrast imaging dataset.
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Patent Agency Ranking
公开(公告)号：US10416088B2
公开(公告)日：2019-09-17
申请号：US15784187
申请日：2017-10-16
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Saibal Banerjee
Abstract: Methods and systems for determining one or more characteristics for defects detected on a specimen are provided. One system includes one or more computer subsystems configured for identifying a first defect that was detected on a specimen by an inspection system with a first mode but was not detected with one or more other modes. The computer subsystem(s) are also configured for acquiring, from the storage medium, one or more images generated with the one or more other modes at a location on the specimen corresponding to the first defect. In addition, the computer subsystem(s) are configured for determining one or more characteristics of the acquired one or more images and determining one or more characteristics of the first defect based on the one or more characteristics of the acquired one or more images.
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公开(公告)号：US10276346B1
公开(公告)日：2019-04-30
申请号：US15281934
申请日：2016-09-30
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Amir Azordegan , Christopher Sears
IPC: H01J37/28 , H01J37/244 , H01J37/147
Abstract: A multi-beam inspection system includes one or more particle beam sources to generate two or more particle beams, a set of particle control elements configured to independently direct the two or more particle beams to a sample, one or more detectors positioned to receive particles emanating from the sample in response to the two or more particle beams, and a controller communicatively coupled to the one or more detectors. The controller includes one or more processors to generate two or more inspection datasets associated with the particles received by the one or more detectors.
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公开(公告)号：US10267746B2
公开(公告)日：2019-04-23
申请号：US14918394
申请日：2015-10-20
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Ajay Gupta , Thanh Huy Ha
IPC: G01N21/88 , G01N23/00 , G01N21/95 , G03F7/20 , G01N21/956
Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.
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公开(公告)号：US20190067060A1
公开(公告)日：2019-02-28
申请号：US16113930
申请日：2018-08-27
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Brian Duffy , Mike VonDenHoff , Andrew Cross , Kaushik Sah , Antonio Mani
Abstract: Methods and systems fir identifying nuisances and defects of interest (DOIs) in defects detected on a wafer are provided. One method includes acquiring metrology data for the wafer generated by a metrology tool that performs measurements on the wafer at an array of measurement points. In one embodiment, the measurement points are determined prior to detecting the defects on the wafer and independently of the defects detected on the wafer. The method also includes determining locations of defects detected on the wafer with respect to locations of the measurement points on the wafer and assigning metrology data to the defects as a defect attribute based on the locations of the defects determined with respect to the locations of the measurement points. In addition, the method includes determining if the defects are nuisances or DOIs based on the defect attributes assigned to the defects.
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公开(公告)号：US20190033838A1
公开(公告)日：2019-01-31
申请号：US15727212
申请日：2017-10-06
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy
IPC: G05B19/418 , G03F7/20
Abstract: An inspection system includes a controller communicatively coupled to a physical inspection device (PID), a virtual inspection device (VID) configured to analyze stored PID data, and a defect verification device (DVD). The controller may receive a pattern layout of a sample including multiple patterns fabricated with selected lithography configurations defining a process window, receive locations of PID-identified defects identified through analysis of the sample with the PID, wherein the PID-identified defects are verified by the DVD, remove one or more lithography configurations associated with the locations of the PID-identified defects from the process window, iteratively refine the process window by removing one or more lithography configurations associated with VID-identified defects identified through analysis of selected portions of stored PID data with the VID, and provide, as an output, the process window when a selected end condition is met.
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