公开(公告)号：US20240292531A1

公开(公告)日：2024-08-29

申请号：US18657931

申请日：2024-05-08

Applicant: Kuprion Inc.

Inventor： Alfred A. Zinn ,  Khanh Nguyen

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0306 ,  H05K1/092 ,  H05K1/115 ,  H05K1/181 ,  H05K1/183 ,  H05K3/107 ,  H05K3/303 ,  H05K3/4038 ,  H05K3/46 ,  H05K2201/09227 ,  H05K2201/09563

Abstract: Printed circuit boards may be formed using ceramic substrates with high thermal conductivity to facilitate heat dissipation. Metal nanoparticles, such as copper nanoparticles, may be used to form conductive traces and fill through-plane vias upon the ceramic substrates. Multi-layer printed circuit boards may comprise two or more ceramic substrates adhered together, wherein each ceramic substrate has one or more conductive traces defined thereon and the one or more conductive traces are formed through consolidation of metal nanoparticles. The one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.

公开(公告)号：US10701804B2

公开(公告)日：2020-06-30

申请号：US14728970

申请日：2015-06-02

Applicant: Kuprion Inc.

Inventor： Alfred A. Zinn

IPC: H05K1/09 ,  C09D11/322 ,  C09D11/52 ,  H05K3/12 ,  H05K1/02 ,  H05K3/14 ,  H05K3/02 ,  H05K3/40 ,  H01L27/12 ,  H01L21/48

Abstract: An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.

公开(公告)号：US10692621B2

公开(公告)日：2020-06-23

申请号：US15547437

申请日：2016-01-29

Applicant: Kuprion Inc.

Inventor： Byung Hoon Lee ,  Chee Lip Gan ,  Yeng Ming Lam ,  Alfred A. Zinn

IPC: H01B1/02 ,  B82Y40/00 ,  B82Y30/00 ,  B82B3/00 ,  H01B1/22 ,  H01B13/00

Abstract: According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.