公开(公告)号：US07946500B2

公开(公告)日：2011-05-24

申请号：US11957469

申请日：2007-12-16

申请人： Hirotaka Nishizawa ,  Akira Higuchi ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Akira Higuchi ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06

CPC分类号： G06K19/07732 ,  G06K19/005 ,  G06K19/077 ,  G06K19/07749

摘要： An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface.

摘要翻译： 通过抑制不对应于非接触式接口的存储卡的引脚布置和引脚形状的修改来提供用于非接触式接口的天线连接功能。 具有存储卡的两个天线连接引脚被分成两个区域，其中一个电位引脚的尺寸最大并且用作间隔布置的分离引脚。 由于两个天线连接引脚的尺寸与电源引脚的尺寸一样大，所以提供了两个天线连接引脚，并且通过使用具有尺寸的引脚区域来获得与非接触式接口对应的存储卡 一个可能的电源引脚与存储卡不对应的非接触式接口。 因此，可以形成与非接触式接口相对应的存储卡的引脚区域，而不会脱离与非接触式接口对应的存储卡的引脚区域。

公开(公告)号：US07646085B2

公开(公告)日：2010-01-12

申请号：US10550278

申请日：2004-09-24

申请人： Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike ,  Junichiro Osako ,  Tamaki Wada

发明人： Hirotaka Nishizawa ,  Kenji Osawa ,  Hideo Koike ,  Junichiro Osako ,  Tamaki Wada

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L21/4763

CPC分类号： H01R12/721 ,  H01R12/7076 ,  H01R13/7036

摘要： A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. Thus, a time period till the cutoff of the power source is easily made comparatively long. The power source feeding terminals should preferably be extended onto the insertion side of the semiconductor device, but an extendible distance is sometimes liable to be limited. In order to ensure the necessary time period without changing the length and shape of the power source feeding terminals on the semiconductor device side, each of the power source feeding terminals may be formed so as to have two, front and rear touch points with the corresponding connector terminal of the host equipment side, but complicated improvements are necessitated for the construction of the connector terminal of the host equipment side. According to the semiconductor device, the time period required till the power source cutoff is easily ensured, and the complicated improvements are not required for the construction of the corresponding connector terminals of the host equipment side.

摘要翻译： 半导体器件包括外部接口端子和处理电路，并且当可拆卸地设置在主机设备中时，其被馈送有工作电源。 外部接口端子之间的电源馈送端子（VCC，VSS）足够长以至少在从外部接口端子之间分离提取检测端子至少预定的时间段内接触主机设备的相应端子， 从主机设备的相应终端，它们形成为比提取检测终端在半导体器件的提取方向上更长。 因此，直到电源截止的时间段容易变得相当长。 电源馈电端子优选地延伸到半导体器件的插入侧，但是可延伸距离有时容易受到限制。 为了在不改变半导体器件侧的电源馈送端子的长度和形状的情况下确保必要的时间周期，每个电源馈电端子可以形成为具有两个相应的前后接触点 主机设备侧的连接器端子，但是主机设备侧的连接器端子的构造需要复杂的改进。 根据半导体装置，能够容易地确保电源切断所需的时间，并且不需要对主机设备侧的对应的连接器端子的构造进行复杂的改进。

公开(公告)号：US07615855B2

公开(公告)日：2009-11-10

申请号：US12116190

申请日：2008-05-06

申请人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

发明人： Junichiro Osako ,  Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi

IPC分类号： H01L23/02 ,  H01L23/12 ,  H01L23/28

CPC分类号： H05K3/284 ,  B29C45/14647 ,  B29C45/14655 ,  B29C45/1657 ,  B29C45/1671 ,  B29C2045/1673 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K2201/10159 ,  H05K2203/1316 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.

摘要翻译： 将IC体装载到由热固性树脂材料制成的壳体2上，并用由热固性树脂材料制成的密封部分密封，从而制造IC卡。 IC体包括：在其背面形成有外部连接端子的布线基板; 半导体芯片，其负载在所述布线基板的表面上，并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 本发明可以提高IC卡的强度，同时降低制造成本，提高可靠性。

公开(公告)号：US07478473B2

公开(公告)日：2009-01-20

申请号：US11536433

申请日：2006-09-28

申请人： Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi ,  Junichiro Osako ,  Tamaki Wada

发明人： Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi ,  Junichiro Osako ,  Tamaki Wada

IPC分类号： H05K3/30

CPC分类号： G06K19/07743 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/14 ,  Y10S439/945 ,  Y10S439/946 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

摘要： The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.

摘要翻译： 提高IC卡的生产率。 在其中具有布线基板的存储体和安装在布线基板的主表面上的半导体芯片被夹持在第一壳体和第二壳体之间的类型的存储卡中，平面轮廓 存储器体小于存储卡的平面轮廓的一半。 存储体被布置成相对于位于第一端侧和第二端侧之间的中线的位置，更靠近作为存储卡的一个短边的第一端侧，作为位于存储卡的相对的短边 与第一端侧相对的一侧。 将第一和第二种情况下的存储体配置区域以外的区域用作另一功能区域。

公开(公告)号：US20080257967A1

公开(公告)日：2008-10-23

申请号：US11907911

申请日：2007-10-18

申请人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Takashi Totsuka ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/28 ,  G11C11/34 ,  G11C16/04 ,  H04B1/38 ,  H04M1/00 ,  H05K7/10 ,  G06F17/00

CPC分类号： G06K19/07743 ,  G06K19/072 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07739 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/284 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.

摘要翻译： 实现与SIM卡的兼容性和适应具有微型计算机和存储卡控制器的IC卡模块中的高速存储器访问。 IC卡模块包括多个第一外部连接端子和暴露于卡片基板的一个表面的多个第二外部连接端子，连接到第一外部连接端子的微型计算机，连接到第二外部连接端子的存储器控​​制器 以及连接到存储器控制器的易失性存储器。 卡基板的形状和第一外部连接端子的布局基于ETSI TS 102 221 V4.4.0（2001-10）的插件UICC的标准或具有兼容性。 第二外部连接端子基于第一外部连接端子的标准设置在端子布局的最小范围之外。 第一和第二外部连接端子分别包括彼此电分离的信号端子。

公开(公告)号：US07416133B2

公开(公告)日：2008-08-26

申请号：US10961136

申请日：2004-10-12

申请人： Hirotaka Nishizawa ,  Akira Higuchi ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada

发明人： Hirotaka Nishizawa ,  Akira Higuchi ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada

IPC分类号： G05F17/00

CPC分类号： G06K19/077 ,  G06K13/0825 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01079 ,  H01L2924/1815 ,  H01L2924/00014

摘要： An IC card is prevented from falling off readily an electronic device while maintaining the mechanical strength of the IC card. A recess for preventing a memory card from falling off an electronic device is provided at the side of one side of a principal surface of a cap of the memory card which is configured by fitting a memory body in a recess formed on a parts mounting surface of the cap. The bottom of the recess is terminated in the middle of the thickness of the cap. This construction makes it possible to prevent the memory card from falling off readily an electronic device while maintaining the mechanical strength of the memory card.

摘要翻译： 在保持IC卡的机械强度的同时，防止IC卡容易脱落。 在存储卡的帽的主表面的一侧设置有用于防止存储卡从电子设备脱落的凹部，其通过将存储器体装配在形成在 这顶帽子。 凹槽的底部终止于盖的厚度的中间。 这种结构使得可以在保持存储卡的机械强度的同时防止存储卡容易地脱落电子设备。

公开(公告)号：US07291903B2

公开(公告)日：2007-11-06

申请号：US11113188

申请日：2005-04-25

申请人： Hirotaka Nishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama ,  Takashi Totsuka

发明人： Hirotaka Nishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama ,  Takashi Totsuka

IPC分类号： H01L23/02 ,  G06K21/00 ,  H05K1/18 ,  H01R13/73

CPC分类号： G06K19/077 ,  G06K7/0021 ,  G06K13/06 ,  G06K19/07732 ,  G06K19/07741 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  Y10S439/948 ,  H01L2224/48227 ,  H01L2924/00012

摘要： This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.

摘要翻译： 本发明提供了一种超小型化的小型存储卡，其具有用于防止错误插入到存储卡插槽的机构。 多功能存储卡由卡体和用于容纳卡体的盖组成。 卡体由密封安装在布线基板主表面上的多个半导体芯片的模塑树脂制成。 将卡体容纳在盖中，使布线基板的背面朝外。 引导通道设置在盖的两个侧面，以防止卡被倒置插入。 此外，在盖的后缘设置凸部，以防止卡以错误的方向插入。

公开(公告)号：US20070023885A1

公开(公告)日：2007-02-01

申请号：US11536433

申请日：2006-09-28

申请人： Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi ,  Junichiro Osako ,  Tamaki Wada

发明人： Hirotaka Nishizawa ,  Kenji Osawa ,  Akira Higuchi ,  Junichiro Osako ,  Tamaki Wada

IPC分类号： H01L23/02

CPC分类号： G06K19/07743 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/14 ,  Y10S439/945 ,  Y10S439/946 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

摘要： The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.

摘要翻译： 提高IC卡的生产率。 在其中具有布线基板的存储体和安装在布线基板的主表面上的半导体芯片被夹持在第一壳体和第二壳体之间的类型的存储卡中，平面轮廓 存储器体小于存储卡的平面轮廓的一半。 存储体被布置成相对于位于第一端侧和第二端侧之间的中线的位置，更靠近作为存储卡的一个短边的第一端侧，作为位于存储卡上的存储卡的相对的短边 与第一端侧相对的一侧。 将第一和第二种情况下的存储体配置区域以外的区域用作另一功能区域。

公开(公告)号：US20060205280A1

公开(公告)日：2006-09-14

申请号：US11371929

申请日：2006-03-10

申请人： Hirotaka Nishizawa ,  Tamaki Wada ,  Kenji Osawa ,  Junichiro Osako ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Tamaki Wada ,  Kenji Osawa ,  Junichiro Osako ,  Michiaki Sugiyama

IPC分类号： H01R24/00

CPC分类号： H01L23/49855 ,  G06K19/07732 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/145 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, wherein the upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.

摘要翻译： 一种半导体器件，包括：一侧具有多个外部连接端子的第一布线板，安装在所述第一布线板的另一侧上并通过多根电线电连接到所述第一布线基板的半导体芯片，用于密封的密封树脂 半导体芯片和导线，以及第二布线基板，其在一侧具有多个接触点，并且在另一侧与所述密封树脂的上表面接合，其中，所述多根导线的所述环的上端部， 将第一配线基板与半导体芯片电连接，从密封树脂的顶面露出，并与第二配线基板电连接。

公开(公告)号：US20060202041A1

公开(公告)日：2006-09-14

申请号：US11368454

申请日：2006-03-07

申请人： Hirotaka Hishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada

发明人： Hirotaka Hishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada

IPC分类号： G06K19/06 ,  H01L23/02

CPC分类号： H01L23/49855 ,  G06K19/072 ,  G06K19/07732 ,  G06K19/07743 ,  H01L21/52 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor chip is mounted onto a wiring substrate having external connecting terminals, electrodes on the semiconductor chip and wiring lines on the wiring substrate are connected together electrically through bonding wires, and a sealing portion is formed by resin molding, to form an IC body. Further, a case formed of a thermoplastic resin is provided. The IC body is mounted into a recess of the case through a bonding material. Thereafter, a region near the recess of the case is deformed plastically to fix the IC body to the case and then the bonding material is cured. In this way there is fabricated an IC card comprising the case and the IC body whose stability is improved by being bonded to the case through the bonding material. The production yield of the IC card can be improved.

摘要翻译： 将半导体芯片安装到具有外部连接端子的布线基板上，半导体芯片上的电极和布线基板上的布线通过接合线电连接在一起，并且通过树脂模制形成密封部分，以形成IC体。 此外，提供由热塑性树脂形成的壳体。 IC体通过接合材料安装在壳体的凹部中。 此后，外壳的凹部附近的区域发生塑性变形，以将IC体固定在壳体上，然后使粘接材料固化。 以这种方式，制造了一种IC卡，其包括壳体和IC体，其通过通过接合材料结合到壳体来提高其稳定性。 可以提高IC卡的生产成本。