公开(公告)号：US07132310B2

公开(公告)日：2006-11-07

申请号：US11333316

申请日：2006-01-18

申请人： Masahiro Nakano ,  Katsuhiko Gunji ,  Yasunobu Oikawa ,  Katsuo Sato

发明人： Masahiro Nakano ,  Katsuhiko Gunji ,  Yasunobu Oikawa ,  Katsuo Sato

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H03H9/1071 ,  H01L2224/16225 ,  H01L2224/45144 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/08 ,  H01L2924/00

摘要： A basic portion layer 21 of a substrate electrode 12a connected to a projecting electrode 13 electrically and mechanically on a substrate member of ceramics. The substrate member on which the basic portion layer 21 is formed is subjected to sintering. A surface of the basic portion layer 21 in the sintered substrate member is polished. On the polished basic portion layer 21, the plating layers 22, 23are formed, so that surface roughness of the substrate electrode 12a may be, for example, not larger than 0.1 μmRMS. Accordingly, junction strength of an integrated circuit element mounted on a packaging substrate by a flip-chip method can be improved.

摘要翻译： 衬底电极12a的基本部分层21，其在陶瓷的衬底构件上电连接到突出电极13。 对其上形成有碱性部分层21的基材进行烧结。 研磨烧结基板部件中的基体部分层21的表面。 在抛光的基底层21上形成镀层22,23，使得基板电极12a的表面粗糙度例如可以不大于0.1μmumRMS。 因此，可以提高通过倒装芯片方法安装在封装基板上的集成电路元件的结合强度。

公开(公告)号：US07106356B2

公开(公告)日：2006-09-12

申请号：US10262092

申请日：2002-09-30

申请人： Masatoshi Nakayama ,  Masahiro Nakano ,  Tsukimi Endo

发明人： Masatoshi Nakayama ,  Masahiro Nakano ,  Tsukimi Endo

IPC分类号： B41J2/335

CPC分类号： B41J2/345

摘要： A method of producing a wear-resistant protective film for a thermal head comprises depositing a wear-resistant protective film by sputtering on a thermal head which includes a substrate, and a heat-developing layer and a pair of electrodes formed on either the substrate or a heat-regenerative layer formed thereon. A layer of the wear resistant protective film is formed under a RF larger bias and another layer without a bias or with a smaller bias. Good step coverage is obtained by the RF sputter layer of the wear-resistant and the protective film prevents the intrusion of water that can cause cracking, and the layer formed under no or smaller bias reduces internal stresses and inhibits the development of cracks due to internal stresses as well as the cracking by RF sputtering.

公开(公告)号：US20050012435A1

公开(公告)日：2005-01-20

申请号：US10889043

申请日：2004-07-13

申请人： Masahiro Nakano ,  Masaki Sobu ,  Shigeki Ohtsuka ,  Yasunaga Kagaya

发明人： Masahiro Nakano ,  Masaki Sobu ,  Shigeki Ohtsuka ,  Yasunaga Kagaya

IPC分类号： H03H9/145 ,  H03H3/08 ,  H03H9/02 ,  H03H9/10 ,  H03H9/64 ,  H03H9/72 ,  H01L41/047

CPC分类号： H03H9/02929 ,  H01L2224/16225 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/02984 ,  H03H9/02992 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/1071 ,  H03H9/72 ,  H03H9/725

摘要： A surface acoustic wave element includes a thin film electrode composed of monocrystal aluminum disposed on a piezoelectric substrate. At least one metal of Cu, Ta, W, and Ti is segregated in the thin film electrode composed of monocrystal aluminum. In this surface acoustic wave element, segregation of Cu or the like occurs in the thin film electrode. Such segregation is effective to reduce the occurrence of cracks on the piezoelectric substrate during ultrasonic wave connection for flip chip mounting. That is, because the occurrence of cracks on the piezoelectric substrate is reduced, tolerance against the ultrasonic vibration is advantageously improved in the surface acoustic wave element.

摘要翻译： 表面声波元件包括由设置在压电基板上的单晶铝构成的薄膜电极。 Cu，Ta，W和Ti中的至少一种金属在由单晶铝构成的薄膜电极中分离。 在该表面声波元件中，在薄膜电极中发生Cu等的偏析。 这种偏析对于减少用于倒装芯片安装的超声波连接期间压电基板上的裂纹的发生是有效的。 也就是说，由于压电基板上出现裂缝，所以在弹性表面波元件中有利地提高了对超声波振动的耐受性。

公开(公告)号：US5622942A

公开(公告)日：1997-04-22

申请号：US142332

申请日：1993-11-22

申请人： Masahiro Nakano ,  Motohiro Mishima ,  Tatsuhiko Kano ,  Nobuyuki Nagata

发明人： Masahiro Nakano ,  Motohiro Mishima ,  Tatsuhiko Kano ,  Nobuyuki Nagata

IPC分类号： A61K31/19 ,  A61K31/245 ,  A61K31/445 ,  A61K31/57 ,  A61K31/56

CPC分类号： A61K31/245 ,  A61K31/19 ,  A61K31/445 ,  A61K31/57

摘要： A percutaneous absorptive anesthetic is provided, wherein said anesthetic is formed by mixing a base agent of said anesthetic with one or two type of mixtures which has/have been selected from the groups, for example made of glycyrrhizin, glycyrrhetic acid, glycyrrhetic acid derivatives glycyrrhetic acid 3.beta.-monohemisuccinate, glycyrrhetic acid 3.beta.-monohemisuccinate, 18.beta.-olean-12-ene-3.beta., 30-dihemiphthalate, 18.beta.-olean-9, (11)12-diene-3.beta., 30-diol-dihemiphthalate, olean-11,13(18)-diene-3.beta., 30-diol-dihemiphthalate or their pharmaceutically allowable salt.

摘要翻译： PCT No.PCT / JP92 / 00543 Sec。 371日期：1993年11月22日 102（e）1993年11月22日PCT PCT日期为1992年4月24日提供了一种经皮吸收性麻醉剂，其中所述麻醉剂是通过将所述麻醉剂的基础药物与一种或两种类型的/ 例如由甘草甜素，甘草次酸，甘草次酸衍生物甘草次酸3β-单一次硫酸琥珀酸酯，甘草次酸3β-单次硫代琥珀酸酯，18β-12-ene-3β，30-二邻苯二甲酸酯，18β- 9，（11），12-二烯-3β，30-二醇 - 二邻苯二甲酸酯，油烯-1,11,13（18） - 二烯-3β，30-二醇 - 二邻苯二甲酸酯或其药学上可允许的盐。

公开(公告)号：US5590969A

公开(公告)日：1997-01-07

申请号：US372691

申请日：1995-01-13

申请人： Masatoshi Nakayama ,  Masahiro Nakano ,  Tsukimi Endo

发明人： Masatoshi Nakayama ,  Masahiro Nakano ,  Tsukimi Endo

IPC分类号： B41J2/335 ,  C01B21/082

CPC分类号： B41J2/3353 ,  B41J2/3355 ,  B41J2/3357

摘要： A wear-resistant protective film for thermal printing heads comprising Si, O, and N as principal constituent elements, contains additionally at least one alkaline earth metal selected from the group consisting of Be, Mg, Ca, Sr, Ba, and Ra. Preferably, the film has a composition SiM.sub.x O.sub.y N.sub.z in which M stands for an alkaline earth metal, x is 0.01-0.5, y is 0.1-2.0, and z is 0.2-1.8.

摘要翻译： 包含Si，O和N作为主要构成元素的热敏打印头用耐磨保护膜还含有选自Be，Mg，Ca，Sr，Ba和Ra中的至少一种碱土金属。 优选地，该膜具有组成SiMxOyNz，其中M代表碱土金属，x为0.01-0.5，y为0.1-2.0，z为0.2-1.8。

公开(公告)号：US5428373A

公开(公告)日：1995-06-27

申请号：US981013

申请日：1992-11-24

申请人： Masashi Shiraishi ,  Masahiro Nakano ,  Satoshi Motegi ,  Kyouichi Takahashi ,  Kouzou Maehara

发明人： Masashi Shiraishi ,  Masahiro Nakano ,  Satoshi Motegi ,  Kyouichi Takahashi ,  Kouzou Maehara

IPC分类号： B41J2/335

CPC分类号： B41J2/3352 ,  B41J2/3357 ,  B41J2/3358 ,  Y10T29/49083

摘要： A thermal head for thermal recording or thermal transfer recording and a method of manufacturing the head. The head has a heat sink having an upper surface, a heating element substrate, disposed on the upper surface of the heat sink, having a projected convex portion on which an array of heating resistor elements are arranged, an electrical structure mounted on the same side as that of the upper surface of the heat sink and electrically connected to the heating resistor elements, and a protection structure for mechanically protecting the electrical structure. The substrate is constituted such that the height of the substrate from the surface of the heat sink is higher than the height of the protection structure, and the height of the projected convex portion is equal to or more than 0.6 mm.

摘要翻译： 一种用于热记录或热转印记录的热敏头及其制造方法。 头部具有设置在散热器的上表面上的具有上表面的散热器，加热元件基板，具有突出的凸部，在其上布置有加热电阻元件阵列，安装在同一侧的电结构 与散热器的上表面的电连接，并且电连接到加热电阻元件，以及用于机械保护电气结构的保护结构。 衬底被构造成使得衬底从散热器的表面的高度高于保护结构的高度，并且突出的凸部的高度等于或大于0.6mm。

公开(公告)号：US4616599A

公开(公告)日：1986-10-14

申请号：US698531

申请日：1985-02-05

申请人： Takafumi Taguchi ,  Masahiro Nakano ,  Nobuo Hiramoto ,  Hideki Tominaga

发明人： Takafumi Taguchi ,  Masahiro Nakano ,  Nobuo Hiramoto ,  Hideki Tominaga

IPC分类号： F01P7/16

CPC分类号： F01P7/167 ,  F01P2023/00 ,  F01P2025/13 ,  F01P2025/30 ,  F01P2025/32 ,  F01P2025/62 ,  F01P2025/64

摘要： In a cooling arrangement for an internal combustion engine, adapted to control a circulating amount of cooling water between a water jacket of the engine and a radiator, it is so arranged that control gain is variable according to the state of operations of the engine in order to achieve a compatibility between the response in control and prevention of hunting phenomenon.

摘要翻译： 在内燃机的冷却装置中，适于控制发动机的水套与散热器之间的冷却水的循环量，按照发动机的运转状态依次进行控制增益的变化 实现控制回应与预防狩猎现象的兼容性。

公开(公告)号：US08099053B2

公开(公告)日：2012-01-17

申请号：US12441721

申请日：2007-09-21

申请人： Masahiro Nakano ,  Kazuhiro Sato ,  Mitsuhiro Suzuki ,  Taketoshi Shimizu

发明人： Masahiro Nakano ,  Kazuhiro Sato ,  Mitsuhiro Suzuki ,  Taketoshi Shimizu

IPC分类号： H04B1/00

CPC分类号： G08C17/00 ,  G08C2201/50

摘要： Remote control data is securely transmitted to a device under control. A remote control device transmits an acknowledge request for A ch to the device under control (S21). When the device under control has assigned A ch as the reception channel, acknowledge ACK is received. A ch is assigned as the transmission channel (S23), and a command frame is transmitted through A ch (S24). When acknowledge ACK has not been received, an acknowledge request for B ch is transmitted to the device under control (S25). When the device under control has assigned B ch as the reception channel, acknowledge ACK is received. B ch is assigned as the transmission channel (S27), and a command frame is transmitted through B ch (S28). The remote control device can transmits a command through a channel through which the device under control can receive the command, so that secure remote control can be accomplished.

摘要翻译： 遥控数据被安全传输到受控制的设备。 遥控装置向控制装置（S21）发送对A ch的确认请求。 当控制器件分配了A ch作为接收通道时，接收到确认ACK。 将ch指定为发送信道（S23），通过A ch发送命令帧（S24）。 当未接收到确认ACK时，对控制的设备（S25）发送对Bch的确认请求。 当被控制的设备分配了BCH作为接收通道时，接收到确认ACK。 B ch被指定为传输信道（S27），并且通过B ch（S28）发送命令帧。 遥控装置可以通过控制装置可以接收命令的通道发送命令，从而可以实现安全的遥控。

公开(公告)号：US20060249825A1

公开(公告)日：2006-11-09

申请号：US11480500

申请日：2006-07-05

申请人： Masahiro Nakano

发明人： Masahiro Nakano

IPC分类号： H01L23/02

CPC分类号： H03H9/059 ,  H01L2224/16225 ,  H01L2924/15311 ,  H03H9/1071 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  Y02P70/613

摘要： On a piezoelectric substrate 23, there are provided surface acoustic wave devices F1 and F2 in which predetermined circuit patterns are formed, and a package substrate 11 comprising side vias 16 formed in a caved manner in the thickness direction on side surfaces on which the surface acoustic wave devices are mounted. When the side vias 16 are each assumed to have the opening width φ and the maximum depth D, a size satisfying φ/2

公开(公告)号：US06946772B2

公开(公告)日：2005-09-20

申请号：US10436438

申请日：2003-05-13

申请人： Kenji Inoue ,  Masahiro Nakano ,  Katsuo Sato

发明人： Kenji Inoue ,  Masahiro Nakano ,  Katsuo Sato

IPC分类号： H03H9/10 ,  H03H9/64 ,  H03H9/72 ,  H03H9/25

CPC分类号： H03H9/6483

摘要： An SAW element 11 comprises a first wiring section 20 formed between an input terminal 18 and an output terminal 19, a plurality of first SAW resonators 15 which are located in serial to the first wiring section 20, a plurality of second SAW resonators 16 which are located in serial to the first wiring section 20 at the side of the input terminal 18 or at the side of the output terminal 19 with respect to the first SAW resonators 15, a plurality of second wiring section 22 which are formed between an intermediate point of the second SAW resonators 16 each other in the first wiring section 20 and a reference voltage electrode 21, and a plurality of third SAW resonators 17 which are located in the second wiring section 22, respectively, and which have anti-resonant frequencies corresponding with resonant frequencies of the second SAW resonators 16.

摘要翻译： SAW元件11包括形成在输入端子18和输出端子19之间的第一布线部分20，与第一布线部分20串联连接的多个第一SAW谐振器15，多个第二SAW谐振器16 位于输入端子18一侧的第一布线部分20处，或者相对于第一SAW谐振器15与输出端子19的一侧串联连接，多个第二布线部分22形成在第一布线部分20的中间点 在第一配线部分20中的第二SAW谐振器16彼此相对的第二SAW谐振器16和参考电压电极21以及分别位于第二配线部分22中的多个第三SAW谐振器17，并且具有对应于共振的反谐振频率 第二SAW谐振器16的频率。