公开(公告)号：US08269290B2

公开(公告)日：2012-09-18

申请号：US12461971

申请日：2009-08-31

申请人： Kazuhiko Sugiura

发明人： Kazuhiko Sugiura

IPC分类号： H01L29/84

CPC分类号： G01P15/0802 ,  B81B2201/025 ,  B81C1/00238 ,  B81C2201/019 ,  G01P15/125 ,  H01L25/0657 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a semiconductor device, a first semiconductor substrate includes a first element on a first-surface side thereof, and a second semiconductor substrate includes a second element and a wiring part on a first-surface side thereof. The first semiconductor substrate and the second semiconductor substrate are attached with each other in such a manner that a first surface of the first semiconductor substrate is opposite a first surface of the second semiconductor substrate. A hole is provided from a second surface of the first semiconductor substrate to the wiring part through the first semiconductor substrate, and a sidewall of the hole is insulated. A drawing wiring part made of a conductive member fills the hole.

摘要翻译： 在半导体器件中，第一半导体衬底在其第一表面侧上包括第一元件，第二半导体衬底在其第一表面侧上包括第二元件和布线部。 第一半导体衬底和第二半导体衬底彼此附接，使得第一半导体衬底的第一表面与第二半导体衬底的第一表面相对。 通过第一半导体衬底从第一半导体衬底的第二表面到布线部分设置一个孔，并且孔的侧壁被绝缘。 由导电构件制成的绘图布线部分填充孔。

公开(公告)号：US08146426B2

公开(公告)日：2012-04-03

申请号：US12318186

申请日：2008-12-23

申请人： Kazuhiko Sugiura ,  Yoshihiko Isobe

发明人： Kazuhiko Sugiura ,  Yoshihiko Isobe

IPC分类号： G01P15/125 ,  G01P9/04 ,  G01C19/56

CPC分类号： G01P15/125 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/082

摘要： A physical sensor includes: a substrate having a silicon layer, an oxide film and a support layer; and a sensor portion having movable and fixed electrodes and a lower electrode. The movable electrode is supported by a beam on the support layer. The fixed electrode faces the movable electrode. The lower electrode is disposed on the support layer and faces the movable electrode. The physical sensor detects horizontal physical quantity based on a capacitance between the movable and fixed electrodes, and vertical physical quantity based on a capacitance between the movable and lower electrodes. The beam includes vertical and horizontal beams. The thickness of the vertical beam is smaller than the thickness of the horizontal beam.

摘要翻译： 物理传感器包括：具有硅层，氧化膜和支撑层的衬底; 以及具有可移动和固定电极的传感器部分和下部电极。 可动电极由支撑层上的梁支撑。 固定电极面向可动电极。 下电极设置在支撑层上并面向可动电极。 物理传感器基于可移动和固定电极之间的电容以及基于可动电极和下电极之间的电容的垂直物理量来检测水平物理量。 梁包括垂直和水平梁。 垂直梁的厚度小于水平梁的厚度。

公开(公告)号：US07968958B2

公开(公告)日：2011-06-28

申请号：US12213711

申请日：2008-06-24

申请人： Tetsuo Fujii ,  Kazuhiko Sugiura

发明人： Tetsuo Fujii ,  Kazuhiko Sugiura

IPC分类号： H01L29/84

CPC分类号： B81B7/007 ,  B81B2207/07 ,  B81B2207/097 ,  B81C2203/0118 ,  G01P15/0802 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/16145 ,  H01L2924/00014

摘要： A semiconductor device includes: a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the sensor element; and a plate-shaped cap element bonded to the surface of the sensor element. The cap element has a wiring pattern portion facing the sensor element. The wiring pattern portion connects an outer periphery of the surface of the sensor element and the sensor structure so that the sensor structure is electrically coupled with an external element via the outer periphery. The sensor element does not have a complicated multi-layered structure, so that the sensor element is simplified. Further, the dimensions of the device are reduced.

摘要翻译： 半导体器件包括：传感器元件，其具有表面的板形，并且包括设置在传感器元件的表面部分中的传感器结构; 以及结合到传感器元件的表面的板状盖元件。 盖元件具有面向传感器元件的布线图案部分。 布线图形部分连接传感器元件的表面的外周和传感器结构，使得传感器结构经由外周与外部元件电耦合。 传感器元件不具有复杂的多层结构，因此传感器元件被简化。 此外，装置的尺寸减小。

公开(公告)号：US07859091B2

公开(公告)日：2010-12-28

申请号：US12068771

申请日：2008-02-12

申请人： Tetsuo Fujii ,  Kazuhiko Sugiura

发明人： Tetsuo Fujii ,  Kazuhiko Sugiura

IPC分类号： H01L23/06

CPC分类号： B81B7/007 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes: a first substrate made of semiconductor and having first regions, which are insulated from each other and disposed in the first substrate; and a second substrate having electric conductivity and having second regions and insulation trenches. Each insulation trench penetrates the second substrate so that the second regions are insulated from each other. The first substrate provides a base substrate, and the second substrate provides a cap substrate. The second substrate is bonded to the first substrate so that a sealed space is provided between a predetermined surface region of the first substrate and the second substrate. The second regions include an extraction conductive region, which is coupled with a corresponding first region.

摘要翻译： 半导体器件包括：由半导体制成的第一衬底，其具有彼此绝缘并设置在第一衬底中的第一区域; 以及具有导电性并具有第二区域和绝缘沟槽的第二基板。 每个绝缘沟槽穿透第二衬底，使得第二区域彼此绝缘。 第一衬底提供基底，第二衬底提供盖衬底。 第二基板被接合到第一基板，使得在第一基板的预定表面区域和第二基板之间设置密封空间。 第二区域包括与对应的第一区域耦合的引出导电区域。

公开(公告)号：US20070232107A1

公开(公告)日：2007-10-04

申请号：US11723431

申请日：2007-03-20

申请人： Kazuhiko Sugiura ,  Hirotsugu Funato ,  Tetsuo Fujii ,  Yumi Maruyama

发明人： Kazuhiko Sugiura ,  Hirotsugu Funato ,  Tetsuo Fujii ,  Yumi Maruyama

IPC分类号： H01R33/02

CPC分类号： H05K5/0091 ,  B81C1/00269 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012

摘要： In an attachment structure, a protective cap is provided with an adhesion layer on its outer peripheral edge part and its internal surface. The protective cap is bonded and fixed to an adherend member through the adhesion layer. This attachment structure can be suitably used for a semiconductor device. Alternatively, in a semiconductor device, a protective cap can be bonded using an adhesive. In this case, an outer peripheral edge part of the protective cap has a first end positioned on its inner rim surface, and a second end positioned on its outer rim surface. Furthermore, the first end protrudes toward a sensor chip more than the second end, and is adjacent to the sensor chip.

摘要翻译： 在附接结构中，保护盖在其外周边缘部分及其内表面上设置有粘附层。 保护帽通过粘合层粘合固定在被粘物上。 这种连接结构可以适用于半导体器件。 或者，在半导体器件中，可以使用粘合剂粘合保护帽。 在这种情况下，保护盖的外周边缘部分具有位于其内缘表面上的第一端和位于其外缘表面上的第二端。 此外，第一端比传感器芯片更靠近传感器芯片，并且与传感器芯片相邻。

公开(公告)号：US20060128158A1

公开(公告)日：2006-06-15

申请号：US11296466

申请日：2005-12-08

申请人： Kazuhiko Sugiura

发明人： Kazuhiko Sugiura

IPC分类号： H01L21/306

CPC分类号： B81C1/00476

摘要： A method of manufacturing a micro-structure includes dry-etching a sacrificial layer provided to a silicon substrate to form structures the sacrificial layer reacting with etching gas to generate reaction products including H2O, wherein the dry-etching includes etching the sacrificial layer and removing H2O as one of the reaction products generated through the etching step of the sacrificial layer, wherein the etching and the removing of H2O are repetitively performed.

摘要翻译： 制造微结构的方法包括干法蚀刻设置在硅衬底上的牺牲层，以形成牺牲层与蚀刻气体反应产生包含H 2 O 2的反应产物的结构， 蚀刻包括蚀刻牺牲层并除去H 2 O作为通过牺牲层的蚀刻步骤产生的反应产物之一，其中蚀刻和除去H 2 O 2 O重复执行。

公开(公告)号：US10441618B2

公开(公告)日：2019-10-15

申请号：US15770620

申请日：2016-10-21

申请人： Kazuhiko Sugiura ,  Aditya Kulkarni

发明人： Kazuhiko Sugiura ,  Aditya Kulkarni

IPC分类号： A61K36/18 ,  A61K36/185 ,  A23L2/52 ,  A23G3/34 ,  A23G4/00 ,  A23L33/105 ,  A23L9/10 ,  A23F5/46 ,  A23G3/48 ,  A23G4/06 ,  A23G9/42 ,  A23L2/54 ,  A61K31/7034 ,  A23G1/48 ,  A23G3/36 ,  A23L2/39

摘要： A moringa extract containing a benzyl glucosinolate in a content of 6% by mass or more, calculated as a dry solid content of the extract, wherein the extract does not substantially contain an alkaloid. The moringa extract of the present invention for solving a first aspect is useful in the field of foodstuff or the like. Also, the PPAR activator of the present invention for solving a second aspect has excellent PPAR activation action, and has no disadvantages in side effects, so that it can be ingested for long term, which can be preferably used in foodstuff and the like. Therefore, the PPAR activator of the present invention for solving a second aspect can be expected to be used as a food, a supplement or a medicament not only for prevention of disease such as insulin resistance, hyperinsulinism, Type 2 diabetes, hypertension, hyperlipidemia, arterial sclerosis and obesity, but also for fatigue recovery or endurance improvement by improving basal metabolism. In addition, a benzyl glucosinolate-containing composition for solving a third aspect is useful in the field of foodstuff or the like.

公开(公告)号：US08726268B2

公开(公告)日：2014-05-13

申请号：US12361562

申请日：2009-01-29

申请人： Kazuhiko Sugiura

发明人： Kazuhiko Sugiura

IPC分类号： G06F9/445 ,  G06F3/12 ,  G06F11/07

CPC分类号： G06F3/1293 ,  G06F3/04895 ,  G06F3/1204 ,  G06F3/1225 ,  G06F3/123 ,  G06F3/1284 ,  G06F3/1296 ,  G06F3/1297 ,  G06F8/61 ,  G06F9/4411 ,  G06F11/0733

摘要： A computer-readable medium causes an information processing apparatus capable of performing a plurality of setting processing for making a setting in accordance with a predetermined sequence to perform processing including a first display control process including displaying a corresponding setting image for each of the plurality of setting processing, an information acceptance process including accepting information required to perform the setting processing through the displayed setting image, a shift command acceptance process including accepting a shift command for making a shift toward another setting processing from setting processing corresponding to the setting image displayed in the first display control process, and a second display control process including displaying an input completion image showing information accepted in the information acceptance process in addition to the setting image corresponding to the setting processing to be shifted by the shift command when the shift command is accepted in the shift command acceptance process.

摘要翻译： 计算机可读介质使得能够执行多个设置处理的信息处理设备，用于根据预定顺序进行设置，以执行包括第一显示控制处理的处理，所述第一显示控制处理包括针对多个设置中的每个设置显示相应的设置图像 处理，信息接收处理，包括接受通过所显示的设置图像执行设置处理所需的信息;移位指令接受处理，包括接受从与在显示的设置图像中显示的设置图像相对应的设置处理进行另一设置处理的移位指令 第一显示控制处理和第二显示控制处理，包括显示表示在信息接收处理中接受的信息的输入完成图像，除了与当通过移位指令移位的设置处理相对应的设置图像时 shift命令接受过程中接受shift命令。

公开(公告)号：US08264051B2

公开(公告)日：2012-09-11

申请号：US13036319

申请日：2011-02-28

申请人： Tetsuo Fujii ,  Kazuhiko Sugiura

发明人： Tetsuo Fujii ,  Kazuhiko Sugiura

IPC分类号： H01L29/84

CPC分类号： B81B7/007 ,  B81B2207/07 ,  B81B2207/097 ,  B81C2203/0118 ,  G01P15/0802 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/16145 ,  H01L2924/00014

摘要： A semiconductor device includes: a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the sensor element; and a plate-shaped cap element bonded to the surface of the sensor element. The cap element has a wiring pattern portion facing the sensor element. The wiring pattern portion connects an outer periphery of the surface of the sensor element and the sensor structure so that the sensor structure is electrically coupled with an external element via the outer periphery. The sensor element does not have a complicated multi-layered structure, so that the sensor element is simplified. Further, the dimensions of the device are reduced.

摘要翻译： 半导体器件包括：传感器元件，其具有表面的板形，并且包括设置在传感器元件的表面部分中的传感器结构; 以及结合到传感器元件的表面的板状盖元件。 盖元件具有面向传感器元件的布线图案部分。 布线图形部分连接传感器元件的表面的外周和传感器结构，使得传感器结构经由外周与外部元件电耦合。 传感器元件不具有复杂的多层结构，因此传感器元件被简化。 此外，装置的尺寸减小。

公开(公告)号：US07901967B2

公开(公告)日：2011-03-08

申请号：US11600136

申请日：2006-11-16

申请人： Atsushi Komura ,  Muneo Tamura ,  Kazuhiko Sugiura ,  Hirotsugu Funato ,  Yumi Maruyama ,  Tetsuo Fujii ,  Kenji Kohno

发明人： Atsushi Komura ,  Muneo Tamura ,  Kazuhiko Sugiura ,  Hirotsugu Funato ,  Yumi Maruyama ,  Tetsuo Fujii ,  Kenji Kohno

IPC分类号： H01L21/00

CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78

摘要： A method for dicing a semiconductor substrate includes: forming a reforming layer in the substrate by irradiating a laser beam on the substrate; forming a groove on the substrate along with a cutting line; and applying a force to the substrate in order to cutting the substrate at the reforming layer as a starting point of cutting. The groove has a predetermined depth so that the groove is disposed near the reforming layer, and the force provides a stress at the groove.

摘要翻译： 一种用于切割半导体衬底的方法包括：通过在衬底上照射激光束在衬底中形成重整层; 与切割线一起在基板上形成凹槽; 并向基板施加力以切割重整层处的基板作为切割的起点。 槽具有预定的深度，使得槽设置在重整层附近，并且该力在槽处提供应力。