公开(公告)号：US08208258B2

公开(公告)日：2012-06-26

申请号：US12556053

申请日：2009-09-09

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： A cooling system and method are provided for facilitating cooling of multiple liquid-cooled electronics racks. The cooling system includes a main system coolant supply loop with a plurality of system coolant supply branch lines for facilitating supply of cooled system coolant to the electronics racks, and a main system coolant return loop with a plurality of system coolant return branch lines for facilitating return of exhausted system coolant from the electronics racks. When operational, cooled system coolant circulates through the coolant supply loop and exhausted system coolant circulates through the coolant return loop. A plurality of modular cooling units are coupled to the coolant supply loop and coolant return loop. Each modular cooling unit includes a heat exchanger to facilitate cooling of a portion of the exhausted coolant circulating through the main system coolant return loop for return as cooled system coolant to the main system coolant supply loop.

摘要翻译： 提供了一种用于促进多个液冷电子机架的冷却的冷却系统和方法。 冷却系统包括主系统冷却剂供应回路，其具有多个系统冷却剂供应分支管线，以便于将冷却的系统冷却剂供应到电子机架，以及具有多个系统冷却剂返回分支管线以便于返回的主系统冷却剂回流回路 从电子机架排出的系统冷却液。 冷却系统冷却剂在运行时循环通过冷却剂供应回路，排气系统冷却剂循环通过冷却液回流回路。 多个模块化冷却单元联接到冷却剂供应回路和冷却剂回流回路。 每个模块化冷却单元包括热交换器，以便于冷却循环通过主系统冷却剂回流回路的排出冷却剂的一部分，以便作为冷却系统冷却剂返回到主系统冷却剂供应回路。

公开(公告)号：US08081461B2

公开(公告)日：2011-12-20

申请号：US12491325

申请日：2009-06-25

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4735 ,  F28D15/0266 ,  F28F13/187 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material.

摘要翻译： 提供冷却装置和制造方法以便于电子装置的冷却。 冷却装置包括导热多孔材料和液体冷却剂供应。 导热多孔材料（例如金属泡沫材料）被耦合到要冷却的电子设备的表面，或耦合到电子设备的结构。 液体冷却剂供应包括喷射冲击结构，其包括用于将液体冷却剂引导到要冷却的表面上的一个或多个喷嘴。 喷射喷嘴延伸到导热多孔材料中，并且有助于将液体冷却剂输送到待冷却的表面上。 导热多孔材料与要冷却的表面热接触，并且通过沸腾通过多孔材料的液体冷却剂来促进电子器件的冷却。

公开(公告)号：US08020298B2

公开(公告)日：2011-09-20

申请号：US12246545

申请日：2008-10-07

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： B21D53/06 ,  B23P15/26

CPC分类号： F28F1/126 ,  F28D2001/0266 ,  F28D2021/0031 ,  F28F1/30 ,  F28F1/32 ,  F28F2009/228 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/3672 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49377 ,  Y10T29/49378 ,  Y10T29/4938 ,  H01L2924/00

摘要： A method of fabricating a heat exchanger which includes: obtaining multiple coolant-carrying conduit sections, each having a non-circular cross-section, and first and second main surfaces; providing multiple primary folded fins secured to the conduit sections. Each folded fin includes a solid fin surface with multiple bends defining alternating, U-shaped air-passage channels, and a base surface and a top surface. Each folded fin is secured at the base or top surface to a main surface of a conduit section, and the folded fins have leading and trailing edges relative to airflow direction. The method includes forming a plurality of sets of secondary fins, each set extending from the leading or trailing edge of a respective folded fin at an angle other than 0. At least one conduit section has a first folded fin secured to its first main surface, and a second folded fin secured to its second main surface thereof.

摘要翻译： 一种制造热交换器的方法，包括：获得多个具有非圆形横截面的冷却剂承载管段，以及第一和第二主表面; 提供固定到导管部分的多个主折叠翼片。 每个折叠翅片包括具有限定交替的U形通气通道的多个弯曲的固体翅片表面，以及基部表面和顶部表面。 每个折叠的翅片在基部或顶部表面固定到导管部分的主表面，并且折叠的翅片具有相对于气流方向的前缘和后缘。 该方法包括形成多组辅助散热片，每组二次散热片各自以相应的折叠翅片的前缘或后缘以不同于0的角度延伸。至少一个导管段具有固定到其第一主表面上的第一折叠翅片， 以及固定到其第二主表面的第二折叠翅片。

公开(公告)号：US07990709B2

公开(公告)日：2011-08-02

申请号：US12565189

申请日：2009-09-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  H05K5/00 ,  G06F1/20

CPC分类号： H05K7/2079 ,  H05K7/20745 ,  Y10T29/49826

摘要： Apparatus and method are provided for facilitating cooling of air passing through an electronics rack. The apparatus includes a heat exchange assembly hingedly mounted above and external to the rack, such that air passing above the rack from an air outlet side to an air inlet side thereof passes through the heat exchange assembly, and is cooled. The heat exchange assembly includes a support structure to support hinged mounting of the assembly above the rack, and an air-to-liquid heat exchanger coupled to the support structure. The heat exchanger has an inlet plenum and an outlet plenum in fluid communication with respective connect couplings which facilitate connection of the plenums to coolant supply and return lines, respectively. The heat exchanger also includes heat exchange tube sections, each of which has a coolant channel with an inlet and an outlet coupled to the inlet and outlet plenums, respectively.

摘要翻译： 提供了用于促进通过电子机架的空气冷却的装置和方法。 该装置包括铰链地安装在机架上方和外部的热交换组件，使得从空气出口侧到其空气入口侧的齿条上方的空气通过热交换组件，并被冷却。 热交换组件包括支撑结构以支撑组件在机架上方的铰接安装，以及耦合到支撑结构的空气 - 液体热交换器。 热交换器具有入口压力室和与相应的连接联接器流体连通的出口增压室，分别促进增压室连接到冷却剂供应和回流管线。 热交换器还包括热交换管部分，每个热交换管部分具有冷却剂通道，分别具有入口和出口，该入口和出口分别连接到入口和出口增压室。

公开(公告)号：US07983040B2

公开(公告)日：2011-07-19

申请号：US12256628

申请日：2008-10-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H05K7/20236 ,  H05K7/20772

摘要： Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled.

摘要翻译： 提供了一种装置和方法，用于促进具有多种不同类型待组件的电子子系统的浸入式冷却。 该设备包括一个容纳电子子系统的容器，以及一个冷却剂入口和一个冷却剂出口，用于促进冷却剂通过容器的进出。 该装置还包括与容器的冷却剂入口和出口流体连通地联接的冷却剂泵组件，用于促进冷却剂通过容器的主动泵送。 当电子子系统可操作地插入容器中并且冷却剂被泵送通过容器时，电子子系统的多种不同类型的部件被冷却剂浸没冷却。 在一个实施例中，填充元件设置在容器内，并且其尺寸设计成减小容器内的冷却剂的量，同时仍保持电子子系统的部件浸没冷却。

公开(公告)号：US07965509B2

公开(公告)日：2011-06-21

申请号：US12418973

申请日：2009-04-06

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Maurice F. Holahan ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Rebecca N. Wagner

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Maurice F. Holahan ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Rebecca N. Wagner

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28F9/0275 ,  H01L2924/0002 ,  H05K7/20772 ,  H05K7/20781 ,  H01L2924/00

摘要： A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit.

摘要翻译： 提供了一种用于冷却包括双列直插存储器（DIMM）阵列的计算机的电子发热部件的方法和相关组件。 组件包括具有第一和第二（反向）侧的板的冷却部件，热耦合到包括DIMM阵列的发热部件。 第一板侧具有冷却剂导管，其一端通过柔性管连接到供应歧管，另一端通过另一柔性管连接到回流歧管，使得当供应冷却剂时，冷却剂通过供应歧管循环到回流歧管 穿过所述第一板的导管。

公开(公告)号：US07963119B2

公开(公告)日：2011-06-21

申请号：US11944680

申请日：2007-11-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： H05K7/2079 ,  G06F1/20 ,  G06F2200/201

摘要： A hybrid air and liquid coolant conditioning unit is provided for facilitating cooling of electronics rack(s) of a data center. The unit includes a first heat exchange assembly, including a liquid-to-liquid heat exchanger, a system coolant loop and a facility coolant loop, and a second heat exchange assembly, including an air-to-liquid heat exchanger, an air-moving device, and the facility coolant loop. The system coolant loop provides cooled system coolant to the electronics rack(s), and expels heat in the liquid-to-liquid heat exchanger from the electronics rack(s) to the facility coolant. The air-to-liquid heat exchanger extracts heat from the air of the data center and expels the heat to the facility coolant of the facility coolant loop. The facility coolant loop provides chilled facility coolant in parallel to the liquid-to-liquid heat exchanger and the air-to-liquid heat exchanger. In one implementation, the hybrid coolant conditioning unit includes a vapor-compression heat exchange assembly.

摘要翻译： 提供混合式空气和液体冷却剂调节单元以便于数据中心的电子机架的冷却。 该单元包括第一热交换组件，其包括液体 - 液体热交换器，系统冷却剂回路和设备冷却剂回路，以及第二热交换组件，其包括空气 - 液体热交换器，空气移动 设备和设备冷却液回路。 系统冷却剂回路将冷却的系统冷却剂提供给电子机架，并将液体 - 液体热交换器中的热量从电子机架排出到设备冷却剂。 空气 - 液体热交换器从数据中心的空气中提取热量，并将热量排出到设备冷却剂回路的设备冷却剂中。 设备冷却液回路提供与液体 - 液体热交换器和空气 - 液体热交换器并联的冷却设备冷却剂。 在一个实施方案中，混合冷却剂调节单元包括蒸汽压缩热交换组件。

公开(公告)号：US07948757B2

公开(公告)日：2011-05-24

申请号：US12850099

申请日：2010-08-04

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01B9/06 ,  F25D23/12 ,  B05B7/06

CPC分类号： H01L23/4735 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S165/908 ,  Y10T29/49002 ,  H01L2924/00

摘要： A method of fabricating a multi-fluid cooling system is provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

摘要翻译： 提供了一种制造多流体冷却系统的方法，用于从一个或多个电子设备去除热量。 冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上 以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。 当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

公开(公告)号：US07878007B2

公开(公告)日：2011-02-01

申请号：US12031982

申请日：2008-02-15

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25B49/00 ,  G01K13/00

CPC分类号： F24F11/0001 ,  G06F1/20 ,  H05K7/20836

摘要： Monitoring method and system are provided for dynamically determining airflow rate through and heat removal rate of an air-conditioning unit, such as a computer room air-conditioning unit. The method includes: sensing inlet and outlet temperatures of fluid passing through a heat exchanger associated with the air-conditioning unit; sensing air temperature at an air inlet side of the heat exchanger; automatically determining at least one of airflow rate through or heat removal rate of the air-conditioning unit, the automatically determining employing the sensed inlet temperature and outlet temperature of fluid passing through the heat exchanger, and the sensed air temperature at the air inlet side of the heat exchanger; and outputting the determined airflow rate through or heat removal rate of the air-conditioning unit. In one embodiment, the heat exchanger is an auxiliary air-to-air heat exchanger, and in another embodiment, the heat exchanger is the air-to-liquid heat exchanger of the air-conditioner.

摘要翻译： 提供监测方法和系统，用于动态地确定诸如计算机室空调单元之类的空调单元的空气流量和排热率。 该方法包括：检测通过与空调单元相关联的热交换器的流体的入口和出口温度; 感测热交换器的空气入口侧的空气温度; 自动确定空气调节单元的气流速率或排热速率中的至少一个，使用感测到的通过热交换器的流体的入口温度和出口温度以及感测到的空气入口侧的空气温度的自动确定 热交换器; 并输出所确定的空气流量通过或所述空调单元的除热率。 在一个实施例中，热交换器是辅助空气 - 空气热交换器，在另一个实施例中，热交换器是空调器的空气 - 液体热交换器。

公开(公告)号：US20100118494A1

公开(公告)日：2010-05-13

申请号：US12269156

申请日：2008-11-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772

摘要： A hybrid immersion cooling apparatus and method is provided for cooling of electronic components housed in a computing environment. The components are divided into primary and secondary heat generating components and are housed in a liquid sealed enclosure. The primary heat generating components are cooled by indirect liquid cooling provided by at least one cold plate having fins. The cold plate is coupled to a first coolant conduit that circulates a first coolant in the enclosure and supplies the cold plate. Immersion cooling is provided for secondary heat generating components through a second coolant that will be disposed inside the enclosure such as to partially submerge the cold plate and the first coolant conduit as well as the heat generating components.

摘要翻译： 提供一种用于冷却容纳在计算环境中的电子部件的混合浸没式冷却装置和方法。 这些部件分为一级和二级发热部件，并被容纳在液体密封的外壳中。 通过由具有翅片的至少一个冷板提供的间接液体冷却来冷却主要发热部件。 冷板联接到第一冷却剂导管，该第一冷却剂管使第一冷却剂循环在外壳中并供应冷板。 通过第二冷却剂为二次发热部件提供浸入式冷却，第二冷却剂将设置在外壳内部，以便部分地淹没冷板和第一冷却剂管道以及发热部件。