公开(公告)号：US08985847B2

公开(公告)日：2015-03-24

申请号：US13300803

申请日：2011-11-21

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： G01N3/60 ,  G01N17/00 ,  G01N25/16 ,  G01N25/00 ,  H05K7/20

CPC分类号： H05K7/20836

摘要： Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.

摘要翻译： 提供了对电子部件的冷却的监视，其包括：确定与电子部件中的一个或多个相关联的当前热阻，耦合到电子部件的散热器或耦合电子部件和散热器的热接口; 以及通过处理器确定当前热阻是否超过设定的热阻阈值，并且响应于当前热阻超过设定的热阻阈值，指示热阻故障。 作为增强，确定热阻时间的变化率，并且与变化率阈值进行比较，并且如果超过阈值，则提供变化率热阻警告。

公开(公告)号：US08922998B2

公开(公告)日：2014-12-30

申请号：US13281495

申请日：2011-10-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Eric J. McKeever ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Eric J. McKeever ,  Robert E. Simons

IPC分类号： G06F1/20 ,  H05K5/00 ,  H05K7/20 ,  F28D7/10 ,  F28D7/12 ,  F28D7/02 ,  F28F3/12 ,  F28F1/10 ,  F28F1/00

CPC分类号： H05K7/20272 ,  H05K7/2079 ,  Y10T29/4935 ,  Y10T29/49389

摘要： A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

摘要翻译： 提供了一种冷却装置，其包括连接到一个或多个电子部件，一个或多个冷却剂管道和一个或多个冷却剂歧管的一个或多个冷却剂冷却结构。 冷却剂冷却结构包括一个或多个冷却剂输送通道，并且冷却剂歧管包括一个或多个可旋转的歧管段。 一个冷却剂管道将相应的可旋转歧管部分和相应冷却剂冷却结构的冷却剂输送通道流体连通地连接。 相应的可旋转歧管部分可相对于冷却剂歧管的另一部分旋转，以便于将冷却剂冷却结构与其相关联的电子部件分离，同时保持冷却剂冷却结构与相应的可旋转歧管部分流体连通，通过一个冷却剂管道 ，其在一个实施例中是基本刚性的冷却剂导管。

公开(公告)号：US08789385B2

公开(公告)日：2014-07-29

申请号：US13451668

申请日：2012-04-20

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： F25B21/02 ,  F25B40/00 ,  H05K7/20836

摘要： A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.

摘要翻译： 提供了一种便于冷却电子部件的方法。 该方法包括：提供构造成制冷剂流过环路的制冷剂回路; 联接压缩机与环路流体连通，其中环路的第一部分位于压缩机的制冷剂入口的上游，第二部分位于下游; 并配置可控热电阵列与制冷剂回路热连通。 热电阵列设置成与制冷剂回路的第一部分至少部分地与阵列的第一侧热接触，并且环的第二部分至少部分地与阵列的第二侧热接触。 控制阵列以确保进入压缩机的制冷剂回路中的制冷剂处于过热的热力学状态。

公开(公告)号：US08713955B2

公开(公告)日：2014-05-06

申请号：US13271290

申请日：2011-10-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Evan G. Colgan ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Evan G. Colgan ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： F25B43/003 ,  F25B2400/01 ,  H05K7/20327 ,  H05K7/20809

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system. The vapor-compression refrigeration system includes an expansion component, an evaporator, a compressor, and a condenser coupled in fluid communication via a refrigerant flow path. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant extractor coupled in fluid communication with the refrigerant flow path. The extractor includes a refrigerant boiling filter and a heater. At least a portion of refrigerant passing through the refrigerant flow path passes through the refrigerant boiling filter, and the heater provides heat to the refrigerant boiling filter to boil refrigerant passing through the filter. By boiling refrigerant passing through the filter, contaminants are extracted from the refrigerant, and are deposited in the refrigerant boiling filter.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩制冷系统。 蒸汽压缩式制冷系统包括膨胀部件，蒸发器，压缩机以及通过制冷剂流动路径流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通地联接的污染物提取器。 提取器包括制冷剂沸腾过滤器和加热器。 通过制冷剂流路的制冷剂的至少一部分通过制冷剂沸腾过滤器，并且加热器向制冷剂沸腾过滤器提供热量以沸腾通过过滤器的制冷剂。 通过沸腾通过过滤器的制冷剂，污染物从制冷剂中排出，并沉积在制冷剂沸腾过滤器中。

公开(公告)号：US20140071626A1

公开(公告)日：2014-03-13

申请号：US13613753

申请日：2012-09-13

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28D15/02 ,  B21D53/02 ,  H05K7/20 ,  F28D7/00

CPC分类号： H05K7/20309 ,  B23P15/26 ,  F28D9/0025 ,  F28D15/02 ,  F28F3/046 ,  F28F3/12 ,  F28F9/02 ,  H05K7/203 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49396

摘要： A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

摘要翻译： 提供了一种蒸汽冷凝器，其包括三维折叠结构，其至少部分地限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 蒸汽冷凝通道。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道

公开(公告)号：US08387249B2

公开(公告)日：2013-03-05

申请号：US11942221

申请日：2007-11-19

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC分类号： B21D53/02 ,  B23P6/00 ,  F28D15/00 ,  H01S4/00

CPC分类号： H05K7/20781 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49352 ,  Y10T29/49826

摘要： Apparatus and method for facilitating servicing of a liquid-cooled electronics rack are provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

摘要翻译： 提供了一种便于维护液冷电子机架的设备和方法。 该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线， 冷却液返回口和冷却液箱。 每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。 至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。 当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

公开(公告)号：US08274790B2

公开(公告)日：2012-09-25

申请号：US12947302

申请日：2010-11-16

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Randall G. Kemink ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Randall G. Kemink ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  F28D15/00

CPC分类号： H05K7/20781 ,  H05K7/20836

摘要： An apparatus is provided for cooling an electronics rack, which includes an electronic subsystem across which air passing through the rack flows. A cooling unit provides, via system coolant supply and return manifolds, system coolant in parallel to the electronic subsystem and an air-to-liquid heat exchanger disposed to cool, in normal-mode, air passing through the rack. A controller monitors coolant associated with the cooling unit and automatically transitions the cooling apparatus from normal-mode to failure-mode responsive to detecting a failure of the coolant. In transitioning to failure-mode, multiple isolation valves are employed in switching to a serial flow of system coolant from the electronic subsystem to the heat exchanger for rejecting, via the system coolant, heat from the electronic subsystem to air passing across the heat exchanger.

摘要翻译： 提供了一种用于冷却电子机架的装置，其包括通过机架的空气流过的电子子系统。 冷却单元通过系统冷却剂供应和回流歧管提供与电子子系统并联的系统冷却剂，以及空气 - 液体热交换器，其设置为在正常模式下冷却通过该架的空气。 控制器监测与冷却单元相关联的冷却剂，并响应于检测冷却剂的故障而自动地将冷却装置从正常模式转换到故障模式。 在转换到故障模式时，采用多个隔离阀来切换到从电子子系统到热交换器的系统冷却剂的串联流，从而通过系统冷却剂从热电子系统向热交换器排出热量。

公开(公告)号：US08194406B2

公开(公告)日：2012-06-05

申请号：US12565175

申请日：2009-09-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20827

摘要： Apparatus and method are provided for two-phase dielectric cooling of an electronic device. The apparatus includes a coolant flow path, a vapor condenser and one or more vapor fans. The coolant flow path is in fluid communication with the electronic device, where liquid dielectric coolant within the flow path vaporizes upon contacting the electronic device, forming dielectric coolant vapor, and thereby facilitating cooling of the electronic device. The vapor condenser is also in fluid communication with the coolant flow path and facilitates condensate formation from the dielectric coolant vapor. The one or more vapor fans are disposed within the flow path to actively move dielectric coolant vapor into contact with the vapor condenser, and thereby enhance cooling of the electronic device by facilitating coolant condensate formation and thus recirculation of the coolant condensate as liquid dielectric coolant.

摘要翻译： 提供了用于电子设备的两相电介质冷却的装置和方法。 该装置包括冷却剂流路，蒸汽冷凝器和一个或多个蒸气风扇。 冷却剂流动路径与电子设备流体连通，其中流动路径内的液体电介质冷却剂在接触电子设备时蒸发，形成电介质冷却剂蒸汽，从而便于电子设备的冷却。 蒸汽冷凝器还与冷却剂流动路径流体连通，并且有助于从电介质冷却剂蒸气形成冷凝物。 一个或多个蒸汽风扇设置在流动路径内以主动地移动介质冷却剂蒸汽与蒸汽冷凝器接触，从而通过促进冷却剂冷凝物的形成并因此使冷却剂冷凝物作为液体电介质冷却剂再循环来增强电子设备的冷却。

公开(公告)号：US08184436B2

公开(公告)日：2012-05-22

申请号：US12825781

申请日：2010-06-29

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20809

摘要： Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for holding dielectric fluid; a gravity drain line coupled to drain dielectric fluid condensate from the vapor-condensing heat exchanger to the reservoir; an immersed, sub-cooling heat exchanger disposed within the reservoir; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump for supplying under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

摘要翻译： 提供液冷电子机架，包括：浸入式冷却电子子系统; 蒸气冷凝热交换器，用于冷凝从浸没冷却的电子子系统排出的介质流体蒸气; 介电流体蒸汽返回联接器，其使浸没冷却的电子子系统的蒸汽出口和蒸汽冷凝热交换器流体连通; 用于保持介电流体的储存器; 重力排放管线，其耦合以将介电流体冷凝物从所述蒸汽冷凝热交换器排出到所述储存器; 设置在储存器内的浸没式次冷热交换器; 介质流体供应歧管联接以使浸没冷却的电子子系统的储存器和电介质流体入口流体连通; 以及用于将压力介质流体从储存器供应到介电流体供应歧管的泵，用于将浸没冷却的电子子系统内的介质流体保持在液态。

公开(公告)号：US07978473B2

公开(公告)日：2011-07-12

申请号：US12706912

申请日：2010-02-17

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Bruce K. Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Bruce K. Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Robert E. Simons

IPC分类号： H05K7/20 ,  G06F1/20 ,  H01L23/34

CPC分类号： H01L23/4735 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 制造方法包括：获得焊料材料; 将焊料材料设置在要冷却的表面上; 回流和成形设置在待冷却表面上的焊料材料，以将焊料材料构成为具有从其延伸的多个翅片的基底。 除了在待冷却的表面上原位配置，基底同时冶金结合到待冷却的表面上。 构造为具有从其延伸的多个翅片的基底的焊料材料是通过其被冶金结合到要冷却的表面热连接到要冷却的表面的单个整体结构。