公开(公告)号：US20100119759A1

公开(公告)日：2010-05-13

申请号：US12593004

申请日：2007-10-22

申请人： Hiroyuki Kondo ,  Yasuhiro Amano

发明人： Hiroyuki Kondo ,  Yasuhiro Amano

IPC分类号： B32B27/04

CPC分类号： H01L21/6835 ,  C08L9/02 ,  C08L2666/08 ,  C09J163/00 ,  H01L21/4828 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/20752 ,  Y10T428/1405 ,  Y10T428/1452 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An adhesive film for manufacturing a semiconductor device, which is to be finally removed in the method for manufacturing a semiconductor device, can be suitably used in the manufacture of a semiconductor device having a so-called standoff, wherein a part of a conductor projects from an encapsulation resin, and has excellent wire bonding property. The adhesive film includes a thermosetting adhesive layer, and the thermosetting adhesive layer includes a layered clay mineral, wherein the adhesive film is used in a method for manufacturing a semiconductor device including (a) embedding at least a part of a conductor in the adhesive film; (b) mounting a semiconductor chip on the conductor; (c) connecting the semiconductor chip to the conductor; (d) encapsulating the semiconductor chip with an encapsulation resin; and (e) removing the adhesive film therefrom.

摘要翻译： 用于制造半导体器件的粘合膜，其在半导体器件的制造方法中最终被去除，可以适用于制造具有所谓的间隔的半导体器件，其中导体的一部分从 封装树脂，并且具有优异的引线接合性能。 粘合膜包括热固性粘合剂层，并且热固性粘合剂层包括层状粘土矿物，其中粘合膜用于制造半导体器件的方法中，所述方法包括（a）将至少一部分导体嵌入粘合膜中 ; （b）将半导体芯片安装在导体上; （c）将半导体芯片连接到导体; （d）用封装树脂封装半导体芯片; 和（e）从其中除去粘合剂膜。

公开(公告)号：US20100236689A1

公开(公告)日：2010-09-23

申请号：US12675433

申请日：2008-08-26

申请人： Yasuhiro Amano ,  Sadahito Misumi ,  Takeshi Matsumura ,  Naohide Takamoto

发明人： Yasuhiro Amano ,  Sadahito Misumi ,  Takeshi Matsumura ,  Naohide Takamoto

IPC分类号： C09J7/00 ,  B32B37/12

CPC分类号： C09J133/08 ,  C09J7/35 ,  C09J7/385 ,  C09J11/04 ,  H01L23/24 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T156/10 ,  Y10T428/249921 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： The present invention provides an adhesive sheet for manufacturing a semiconductor device, which, even when the adhesive sheet is made thin, makes it possible to easily identify the presence or absence of the adhesive sheet, thereby decreasing down time for the manufacturing apparatus and enabling an improvement of the yield, and to provide a semiconductor device manufacturing method using the sheet. The present invention relates to an adhesive sheet for manufacturing a semiconductor device which is used to adhere a semiconductor element to an adherend, wherein the adhesive sheet contains a pigment which adsorbs or reflects light having a wavelength in a range from 290 to 450 nm.

摘要翻译： 本发明提供一种用于制造半导体器件的粘合片，即使当粘合片变薄时，也可以容易地识别粘合片的存在或不存在，从而减少制造装置的停留时间并使得能够 提高产量，并提供使用该片材的半导体器件制造方法。 本发明涉及一种用于制造用于将半导体元件粘合到被粘物上的半导体器件的粘合片，其中该粘合片含有吸收或反射波长在290至450nm范围内的光的颜料。