摘要:
An objective is to provide a pressure-contact type rectifier in which solder that increases the environmental load is not used, and neither burning nor breakage of a rectifying device occurs, even if temperature of the rectifying device increases due to current flowing or force towards outside the rectifying device is applied to a lead end, etc. By providing an electrically conductive friction reducer on at least one electrode face of the rectifying device, the temperature increase can be prevented, and the friction at the contact face can be reduced. Moreover, by providing a flexible portion on the lead end outside a cap, and fixing the flexible portion to the cap, the contact area between the lead and the rectifying device can be kept constant. As a result, a pressure-contact type rectifier in which neither burning nor breakage of the rectifying device occurs can be obtained.
摘要:
A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t≦r≦35t, where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 μm to 30 μm and larger than that of the second curved surface. The test probe may be manufactured by a method comprising the steps of roughing the tip portion of the curved surface by abrasing by means of electrolyte abrasion or abrasing particles to form a symmetrical spherical curved surface, and finishing the tip portion by sliding it on an abrasive member comprising an elastically deformable thick film fixed to a substrate and having abrasive particles therein or thereon directly or through a metallic film.
摘要翻译:一种半导体器件测试探针,其具有尖端部分,用于抵抗集成半导体器件的电极焊盘,以建立与电极焊盘的电接触,以测试半导体器件的功能。 球形尖端部分具有由9t <= r <= 35t表示的曲率半径r,其中r是球面的曲率半径,t是电极焊盘的厚度。 尖端部分可以具有基本上位于探头滑动方向上的第一弯曲表面,当探头被推靠在电极垫上并相对于电极焊盘滑动时,第一弯曲表面与第一弯曲表面相对的第二弯曲表面。 第一曲面的曲率半径为7μm〜30μm,大于第二曲面的曲率半径。 测试探针可以通过以下方法制造,该方法包括以下步骤:通过利用电解质磨损或磨损颗粒进行磨损来粗糙化弯曲表面的尖端部分以形成对称的球形曲面,并且通过将其磨削在磨料上来完成尖端部分 其包括固定到基底的可弹性变形的厚膜,其上直接或通过金属膜在其中或其上具有磨料颗粒。
摘要:
Probes 1 for testing and outer connecting terminals 14a are electrically connected to a-test socket for semiconductor devices. In use of a connecting sheet, fabricated by an elastically deformative insulating member and electrodes 202, flexibility is given, and good electrical contacts are obtainable. Further, because the connecting sheet 2 is exchangeable, contacting capability is recovered by exchange when solder debris is adhered and deposited to increase contact resistances. Accordingly, even though there is scattering of the heights of the outer connecting terminals, good electrical contact with the probes is obtainable, and even though the solder debris of the outer connecting terminals is adhered and deposited as a result of repeated usage, tests can be continuously conducted, wherein the test socket for semiconductor devices has good maintenance capability.
摘要:
A vehicle AC generator having a rectifier unit with cooling plates for the positive-electrode and negative-electrode sides, each having principal planes opposing each other; and a diode package disposed between the cooling plates for the positive-electrode and negative-electrode sides. The diode package has a base for the positive-electrode side formed of a metallic plate and joined to a cathode face of the unidirectionally conducting element for the positive-electrode side; a base for the negative-electrode side formed of a metallic plate and joined to an anode face of the unidirectionally conducting element for the negative-electrode side; and an insulating resin provided so that the unidirectionally conducting elements for the positive-electrode and negative-electrode sides are embedded therein. The end face of the base for the positive-electrode side is joined to the principal plane of the cooling plate for the positive-electrode side while the end face of the base for the negative-electrode side is joined to the principal plane of the cooling plate for the negative-electrode side.
摘要:
A manufacturing method for a defect-free cast product comprises the steps of forming a cavity surrounded by a plurality of dies, charging molten conductive material into the cavity, and applying pressure to the conductive material by pressure means. In the method, additional pressure is selectively applied to the portion of the conductive material which may suffer shrinkage cavities due to delay in solidification, by utilizing the pressure applied by the pressure means and by relatively moving a portion of the dies with respect to the conductive material when the conductive material solidifies and shrinks, whereby shrinkage cavities are prevented. Accordingly, with a cast rotor core obtained by this method, it is possible to prevent shrinkage cavities from occurring in the conductive material and it is also possible to improve the efficiency and torque characteristics of the motor, thereby achieving reductions in the size and weight of the motor.