SEMICONDUCTOR DEVICE TEST PROBE HAVING IMPROVED TIP PORTION
    22.
    发明申请
    SEMICONDUCTOR DEVICE TEST PROBE HAVING IMPROVED TIP PORTION 有权
    具有改进提示部分的半导体器件测试探针

    公开(公告)号:US20050189955A1

    公开(公告)日:2005-09-01

    申请号:US10645595

    申请日:2003-08-22

    IPC分类号: G01R1/067 H01L21/66 G01R31/02

    摘要: A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t≦r≦35t, where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 μm to 30 μm and larger than that of the second curved surface. The test probe may be manufactured by a method comprising the steps of roughing the tip portion of the curved surface by abrasing by means of electrolyte abrasion or abrasing particles to form a symmetrical spherical curved surface, and finishing the tip portion by sliding it on an abrasive member comprising an elastically deformable thick film fixed to a substrate and having abrasive particles therein or thereon directly or through a metallic film.

    摘要翻译: 一种半导体器件测试探针,其具有尖端部分,用于抵抗集成半导体器件的电极焊盘,以建立与电极焊盘的电接触,以测试半导体器件的功能。 球形尖端部分具有由9t <= r <= 35t表示的曲率半径r,其中r是球面的曲率半径,t是电极焊盘的厚度。 尖端部分可以具有基本上位于探头滑动方向上的第一弯曲表面,当探头被推靠在电极垫上并相对于电极焊盘滑动时,第一弯曲表面与第一弯曲表面相对的第二弯曲表面。 第一曲面的曲率半径为7μm〜30μm,大于第二曲面的曲率半径。 测试探针可以通过以下方法制造,该方法包括以下步骤:通过利用电解质磨损或磨损颗粒进行磨损来粗糙化弯曲表面的尖端部分以形成对称的球形曲面,并且通过将其磨削在磨料上来完成尖端部分 其包括固定到基底的可弹性变形的厚膜,其上直接或通过金属膜在其中或其上具有磨料颗粒。

    Socket for testing a semiconductor device and a connecting sheet used for the same
    23.
    发明申请
    Socket for testing a semiconductor device and a connecting sheet used for the same 审中-公开
    用于测试半导体器件的插座和用于其的连接片

    公开(公告)号:US20050145842A1

    公开(公告)日:2005-07-07

    申请号:US11057468

    申请日:2005-02-15

    CPC分类号: G01R1/0483

    摘要: Probes 1 for testing and outer connecting terminals 14a are electrically connected to a-test socket for semiconductor devices. In use of a connecting sheet, fabricated by an elastically deformative insulating member and electrodes 202, flexibility is given, and good electrical contacts are obtainable. Further, because the connecting sheet 2 is exchangeable, contacting capability is recovered by exchange when solder debris is adhered and deposited to increase contact resistances. Accordingly, even though there is scattering of the heights of the outer connecting terminals, good electrical contact with the probes is obtainable, and even though the solder debris of the outer connecting terminals is adhered and deposited as a result of repeated usage, tests can be continuously conducted, wherein the test socket for semiconductor devices has good maintenance capability.

    摘要翻译: 用于测试的探针1和外部连接端子14a电连接到用于半导体器件的测试插座。 在使用通过弹性变形绝缘构件和电极202制造的连接片材的情况下,给出柔性,并且可以获得良好的电接触。 此外,由于连接片2是可交换的,所以当焊料残渣被附着和沉积以增加接触电阻时,通过交换来回收接触能力。 因此,即使存在外部连接端子的高度的散射,也可以获得与探针的良好的电接触,并且即使由于重复使用而使外部连接端子的焊料残渣粘附和沉积,也可以是 连续进行,其中半导体器件测试插座具有良好的维护能力。

    Manufacturing method for defect-free casting product
    25.
    发明授权
    Manufacturing method for defect-free casting product 失效
    无缺陷铸造产品的制造方法

    公开(公告)号:US5067550A

    公开(公告)日:1991-11-26

    申请号:US487291

    申请日:1990-03-02

    IPC分类号: B22D27/11

    CPC分类号: B22D27/11

    摘要: A manufacturing method for a defect-free cast product comprises the steps of forming a cavity surrounded by a plurality of dies, charging molten conductive material into the cavity, and applying pressure to the conductive material by pressure means. In the method, additional pressure is selectively applied to the portion of the conductive material which may suffer shrinkage cavities due to delay in solidification, by utilizing the pressure applied by the pressure means and by relatively moving a portion of the dies with respect to the conductive material when the conductive material solidifies and shrinks, whereby shrinkage cavities are prevented. Accordingly, with a cast rotor core obtained by this method, it is possible to prevent shrinkage cavities from occurring in the conductive material and it is also possible to improve the efficiency and torque characteristics of the motor, thereby achieving reductions in the size and weight of the motor.

    摘要翻译: 一种无缺陷铸造产品的制造方法包括以下步骤:形成由多个模具包围的空腔,将熔融的导电材料装入空腔中,并通过压力装置对导电材料施加压力。 在该方法中,额外的压力被选择性地施加到导电材料的部分,其可能由于固化延迟而遭受收缩空腔,通过利用由压力装置施加的压力以及通过相对于导电材料相对移动模具的一部分 导电材料固化和收缩时的材料,从而防止收缩腔。 因此,通过该方法获得的铸造转子铁芯,可以防止在导电材料中发生收缩空腔,并且还可以提高电动机的效率和转矩特性,从而实现电动机的尺寸和重量的减小 电机。