摘要:
A measurement element includes a semiconductor substrate with electrical insulating film formed thereon. A resistor formed on the electrical insulating film constitutes a heater; and a cavity is formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in the thickness direction. The measurement element has a film formed covering the region of the opening or slit.
摘要:
In a structure in which peripheral part of a diaphragm section of an electrical insulating film is covered with a protective film made of an organic material, the resistor wire on the diaphragm section crosses the peripheral part of the diaphragm section. At a place where a narrow wire of a resistance temperature detector and the like crosses the peripheral part of the diaphragm section, the protective film is thinner than the other part, and the dust impact resistance is reduced. At a place where a heating resistor wire connected to a heating resistor body or resistance temperature detector wires connected to resistance temperature detector bodies cross a periphery of the diaphragm section, a film component protruding from an electrical insulating film is arranged side by side with the heating resistor wire or the resistance temperature detector wires.
摘要:
An air flow measuring instrument, comprising: an auxiliary passage 8 arranged inside a main passage through which fluid flows, a tabular member 5 on which a pattern of a heating resistor for measuring an air flow is provided on one face 5a, the tabular member being disposed inside the auxiliary passage so that the one face 5a on which the heating resistor pattern of the tabular member is provided is disposed along a flow of fluid inside the auxiliary passage 8, a heating resistor pattern-side fluid passage 8a portion formed so that the fluid flows between the face 5a and a passage-forming surface 8d of the auxiliary passage, and a back-surface 8b side fluid passage portion formed so that fluid flows between a face 5b on a side opposite to the face of the tabular member and the passage-forming surface of the auxiliary passage. Guidance portion 13 guiding dust that collides against the end portion to back-surface side fluid passage portion 8b side is provided on upstream-side end of tabular member.
摘要:
The invention provides a thermal type flow meter which has a high reliability and a low cost. In a thermal type flow meter provided with a flow rate detecting element in which at least a heat generating resistor and a lead electrode are formed on a surface of a tabular substrate, and a support body in which a concave portion accommodating the flow rate detecting element is formed on a surface, and in which the flow rate detecting element is firmly fixed and accommodated by an adhesive agent in a back surface of the tabular substrate and a part of a bottom surface of the concave portion, an approximately straight discharge groove which is deeper than a bottom surface of the concave portion and passes through both end surfaces in upward and downward sides of the concave portion is formed from the upstream side of the support body concave portion to the downstream side, between the cavity of the tabular substrate and the back surface region of the tabular substrate in which the lead electrode is formed. Accordingly, it is possible to achieve the thermal type flow meter which has the high reliability and the low cost.
摘要:
An air flow rate measuring device is provided in which a pressure loss across a grid therein due to the load which is generated when a hose band is tightened is reduced and deterioration of its measurement accuracy due to the grid deformation is prevented. The grid is configured to have a grid portion which absorbs deformation at the outer periphery thereof, and another grid portion which does not absorb deformation at the inner periphery thereof. In order to make the grid portions independent of each other, the grid is provided with a frame, and the mesh grid inside of the frame which maintains a rectifying effect, prevents the deterioration of the measurement accuracy, and does not absorb deformation, and the grid outside of the frame absorbs deformation.
摘要:
An air flow rate measuring device is provided in which a pressure loss across a grid therein due to the load which is generated when a hose band is tightened is reduced and deterioration of its measurement accuracy due to the grid deformation is prevented. The grid is configured to have a grid portion which absorbs deformation at the outer periphery thereof, and another grid portion which does not absorb deformation at the inner periphery thereof. In order to make the grid portions independent of each other, the grid is provided with a frame, and the mesh grid inside of the frame which maintains a rectifying effect, prevents the deterioration of the measurement accuracy, and does not absorb deformation, and the grid outside of the frame absorbs deformation.
摘要:
A heating resistor type flow measuring device comprising a housing having a support part provided between a frame body and a connector and connected to the mounting part of a fluid passage, a flow rate detection element held on the frame body side of the housing, and an electronic circuit held on the housing and connected electrically to the flow rate detection element and the connector, wherein the electronic circuit is held on the frame body side of the housing and positioned in the fluid passage, a member with the rigidity higher than the material of the main structural member of the housing is formed integrally with the support part, the housing is fixed to the fluid passage through the member with high rigidity. A metal plate is inserted into the support part so as to increase rigidity. Further, a distance is provided between the support part and a metal plate forming a route for conducting the heat transferred to the metal base fixing an electronic circuit substrate by a plastic mold so as to form a structure obstructing a heat transfer, or a clearance is provided in a portion spaced by the plastic mold between the support part and the metal base so as to form a structure obstructing a heat transfer.
摘要:
A semiconductor device in which fatigue failure of a solder layer underneath a semiconductor chip mounted on a base can be prevented from occurring due to repetitions of turn-on and -off of power during operation thereof, is provided, that is, a recess is formed in the base in a part underneath the semiconductor chip so as to prevent occurrence of thermal expansion in the base.
摘要:
A resin sealed semiconductor device is provided with an organic resin wiring substrate, an LSI chip having a semiconductor integrated circuit and mounted in a bare chip package form to the organic resin wiring substrate through a plurality of electrical bonding members, and a resin charged into a gap portion between the organic resin wiring substrate and the LSI chip. In this resin sealed semiconductor device, a modulus of longitudinal elasticity of the resin to be charged, its coefficient of linear thermal expansion and its fillet shape are optimized. The resin charged is also preferably colored in black to minimize adverse effects of visible rags on the LSI chip.
摘要:
A cover for a damping roller of an offset press is comprising a tubular knitted fabric having two water-shrinkable ground yarns and the hydrophilic pile yarns. The ground yarns are intertwined and respectively form a tubular plain weft-knitted structure in which two ground yarns are alternately knitted so that wales formed by one ground yarn are interposed between two adjacent wales formed by the other ground yarn so that all the wales appear on the face of the fabric. The courses of each plain knitted structure include long sinker loops, the ground yarns being knitted into the respective plain-knitted ground fabric structure to form raised loops. The cover has high shrinking percentages both in radial and axial directions.