Abstract:
A propylene-based polymer comprising the following component (A) insoluble in p-xylene at 25° C. and component (B) soluble in p-xylene at 25° C., wherein (i) the weight average molecular weight (Mw) measured with GPC is 100,000 to 1,000,000, (ii) the content of the component insoluble in hot p-xylene is 0.3% by weight or lower, and (iii) the degree of strain hardening (λ max) in measurement of elongational viscosity is 2.0 or higher; and a method for producing the same, along with a resin composition comprising a propylene-ethylene copolymer (Z) in an amount of 50.0 to 99.9% by weight and a propylene-based polymer (M) in an amount of 0.1 to 50.0% by weight.Component (A): a component (CXIS) insoluble in p-xylene at 25° C., having requirements specified by (A1) to (A5). Component (B): a component (CXS) is soluble in p-xylene at 25° C., having requirements specified by (B1) to (B4).
Abstract:
In forming a thin film transistor using multi-tone exposure, a wiring width of a foundational wiring is 40 μm or less, and a ratio of a wiring width of a foundational wiring in a dense case to a space between adjacent wirings is 1.7, preferably 1.0 or less.
Abstract:
In forming a thin film transistor using multi-tone exposure, a wiring width of a foundational wiring is 40 μm or less, and a ratio of a wiring width of a foundational wiring in a dense case to a space between adjacent wirings is 1.7, preferably 1.0 or less.
Abstract:
An array substrate has regions in which an intermediate resist film thickness is formed and processed by an intermediate exposure amount which does not completely expose a resist, respectively on a drain electrode, source terminal, and a common connection wiring which are made of a second conductive film. Thin film patterns or a common wiring made of a first conductive film is formed in substantially entire regions on the bottom layers of the regions so that the heights from a substrate are substantially the same.
Abstract:
A liquid crystal display apparatus in which an arrangement possibly susceptible to degradation in display quality by a miss shot of a laser used for turning amorphous silicon into polycrystalline silicon is avoided and a narrow peripheral frame can be attained. A gate interconnection for transistors in a driving circuit area is arranged along a folded line having two lines extending in two different directions and a bent portion. Channel regions of the transistors are arranged along the two lines, such that the channel regions do not overlap the bent portion.
Abstract:
A manufacturing method for electronic devices including applying photosensitive or non-photosensitive resin onto a substrate by a slit-type dropping nozzle method. A slit-type dropping nozzle for performing resin application is scanned to apply resin while maintaining a scanning direction of the nozzle in an inclined condition relative to the substrate at a specified angle in substantially a same direction as a rotating direction of the substrate after resin has been applied thereto. With the above method, even in a case in which clogging of a part of the nozzle due to foreign matter and dropping defects have occurred, the uniformity in film thickness typically will not be affected unless the defect has occurred in the center of the substrate.
Abstract:
An object of the present invention is to provide a polyethylene-based resin composition excellent in the moldability and at the same time, excellent in the balance between impact strength and stiffness as well as in the transparency, and a molded product and a film, which are obtained by the molding of the polyethylene-based resin composition. The polyethylene-based resin composition of the present invention comprises from 41 to 99 wt % of (A) an ethylene-based polymer satisfying specific conditions and from 1 to 59 wt % of (B) an ethylene-based polymer satisfying specific conditions, wherein MFR of the composition as a whole is from 0.05 to 50 g/10 min and the density is from 0.910 to 0.960 g/cm3.
Abstract translation:本发明的目的是提供一种成型性优异,同时在冲击强度和刚度以及透明性之间的平衡方面优异的聚乙烯类树脂组合物,以及成型体和膜,其中 是通过模塑聚乙烯类树脂组合物得到的。 本发明的聚乙烯类树脂组合物含有(A)满足特定条件的(A)乙烯类聚合物和1〜59重量%(B)满足特定条件的乙烯系聚合物的41〜99重量%,其中, 组合物的总体MFR为0.05〜50g / 10min,密度为0.910〜0.960g / cm 3。
Abstract:
A thin film transistor includes a gate electrode, a semiconductor layer, and a source electrode and a drain electrode placed on the semiconductor layer and electrically connected with the semiconductor layer. The semiconductor layer includes a light-transmitting semiconductor film and an ohmic conductive film placed on the light-transmitting semiconductor film and having a lower light transmittance than the light-transmitting semiconductor film. The ohmic conductive film is formed not to protrude from the light-transmitting semiconductor film. The ohmic conductive film is formed in separate parts with a channel part between the source electrode and the drain electrode interposed therebetween. The source electrode and the drain electrode are connected to the light-transmitting semiconductor film through the ohmic conductive film.
Abstract:
A thin film transistor includes a gate electrode, a semiconductor layer, and a source electrode and a drain electrode placed on the semiconductor layer and electrically connected with the semiconductor layer. The semiconductor layer includes a light-transmitting semiconductor film and an ohmic conductive film placed on the light-transmitting semiconductor film and having a lower light transmittance than the light-transmitting semiconductor film. The ohmic conductive film is formed not to protrude from the light-transmitting semiconductor film. The ohmic conductive film is formed in separate parts with a channel part between the source electrode and the drain electrode interposed therebetween. The source electrode and the drain electrode are connected to the light-transmitting semiconductor film through the ohmic conductive film.
Abstract:
There is provided a TFT substrate including a gate electrode having a thick film part and a thin film part with a smaller film thickness than the thick film part, a semiconductor active film formed above the thick film part and the thin film part of the gate electrode, an ohmic contact film formed on an inside of the semiconductor active film and on the semiconductor active film corresponding to the thin film part on an outside of the thick film part, and an electrode film constituting a source electrode and a drain electrode, having a planar shape identical to or on an inside of the ohmic contact film, and formed on the ohmic contact film.