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    CERAMIC-TO-METAL JOINT FOR IMPLANTABLE PULSE GENERATORS
    21.
    发明申请
    CERAMIC-TO-METAL JOINT FOR IMPLANTABLE PULSE GENERATORS 有权

    公开(公告)号：US20210187291A1

    公开(公告)日：2021-06-24

    申请号：US17128444

    申请日：2020-12-21

    Applicant: Medtronic, Inc.

    Inventor： Rajesh V. Iyer ,  Steven T. Deininger ,  Jenna N. George ,  Andrew J. Thom ,  Brad C. Tischendorf ,  Gordon Munns

    IPC: A61N1/36 ,  A61N1/05 ,  A61N1/375 ,  A61N1/378

    Abstract: An implantable pulse generator configured for delivering one or more electrical pulses to a target region within a body of a patient using an implantable neurostimulation lead, the implantable pulse generator comprising a hermetically sealed housing comprising a ceramic portion defining an inner volume configured to receive a charging coil assembly comprising a charging coil wrapped around an optional ferrite core material; an intermediate metal ring; and a case, wherein the intermediate metal ring comprises a first side joined to the ceramic portion by either a braze material or a diffusion bond, wherein the braze material or the diffusion bond is substantially free of nickel, and wherein the intermediate metal ring comprises a second side joined to the case portion.

    Method of forming a sealed package
    22.
    发明授权
    Method of forming a sealed package 有权

    公开(公告)号：US10888009B2

    公开(公告)日：2021-01-05

    申请号：US16171776

    申请日：2018-10-26

    Applicant: Medtronic, Inc.

    Inventor： Christian S. Nielsen ,  Rajesh V. Iyer ,  Gordon O. Munns ,  Andrew J. Ries ,  Andrew J. Thom

    IPC: H05K5/06 ,  A61N1/375 ,  A61N1/378 ,  H01M2/30 ,  H05K5/00 ,  H05K7/14

    Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.

    TOOLLESS LEAD CONNECTOR ASSEMBLY
    23.
    发明申请
    TOOLLESS LEAD CONNECTOR ASSEMBLY 审中-公开

    公开(公告)号：US20200155853A1

    公开(公告)日：2020-05-21

    申请号：US16604383

    申请日：2018-03-14

    Applicant: Medtronic, Inc.

    Inventor： Rajesh V. Iyer ,  Randy S. Roles ,  Erik R. Scott ,  Andrew J. Thom

    IPC: A61N1/375 ,  H01R13/52 ,  H01R13/59

    Abstract: A lead connector assembly includes a lead receptacle, a sleeve, and a handle for coupling to a medical lead. The lead receptacle has an inner surface and an opening configured to receive the lead. The sleeve is deflectable by the inner surface of the lead receptacle. The sleeve has a distal end portion defining a first outer diameter to engage the lead in a locked position and a second outer diameter greater than the first diameter in an unlocked position. The handle is coupled to the lead receptacle and a proximal end portion of the sleeve to move the sleeve axially in both directions along the longitudinal axis relative to the lead receptacle. The lead connector assembly retains the lead in the locked position. The lead receptacle is couplable to a medical device housing.

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