公开(公告)号：US11239133B2

公开(公告)日：2022-02-01

申请号：US17234079

申请日：2021-04-19

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Shams U. Arifeen

IPC: G11C16/04 ,  H01L23/367 ,  G11C5/02 ,  G11C11/34 ,  H01L23/427

Abstract: A semiconductor memory system having a plurality of semiconductor memory modules that are spaced apart from each other by a gap. The system includes a heat dissipation assembly having a thermally conductive base portion configured to transfer heat away from the memory devices. The heat dissipation assembly including at least one cooling unit extending from the base portion. The at least one cooling unit having a wall with an exterior surface and a cavity. The cooling unit is configured to fit in the gap between adjacent memory modules such that a portion of the exterior surface on a first side of the cooling unit is coupled to one of the first memory devices and another portion of the exterior surface on a second side of the cooling unit is coupled to one of the second memory devices across the gap.

公开(公告)号：US20210410278A1

公开(公告)日：2021-12-30

申请号：US16941212

申请日：2020-07-28

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Hyunsuk Chun

IPC: H05K1/02 ,  H01R12/72 ,  H01L23/473

Abstract: A semiconductor component system includes a motherboard and a cooling system mounted to the motherboard. The cooling system includes sidewalls projecting from the motherboard. A sub-motherboard extends between the sidewalls and is spaced apart from the motherboard. The sidewalls and the sub-motherboard define a cooling channel over the motherboard. A connector is attached to the sub-motherboard and is configured to receive a semiconductor device daughterboard. The connector has contacts to electrically couple the semiconductor device daughterboard to the sub-motherboard.

公开(公告)号：US20210407889A1

公开(公告)日：2021-12-30

申请号：US16990943

申请日：2020-08-11

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Hyunsuk Chun ,  Eiichi Nakano

IPC: H01L23/473 ,  H01L25/065 ,  H01L25/18 ,  H01L23/367 ,  H01L21/48 ,  H01L25/00

Abstract: Semiconductor packages and/or assemblies having microchannels, a microchannel module, and/or a microfluidic network for thermal management, and associated systems and methods, are disclosed herein. The semiconductor package and/or assembly can include a substrate integrated with a microchannel and a coolant disposed within the microchannel to dissipate heat from a memory device and/or a logic device of the semiconductor package and/or assembly. The microchannel can be configured beneath the memory device and/or the logic device.

公开(公告)号：US20210272908A1

公开(公告)日：2021-09-02

申请号：US16803954

申请日：2020-02-27

Applicant: Micron Technology, Inc.

Inventor： Koustav Sinha ,  Xiaopeng Qu

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H05K1/18

Abstract: Semiconductor devices having an array of flexible connectors configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor assembly includes a substrate coupled to an array of flexible connectors. Each flexible connector can be transformed between a resting configuration and a loaded configuration. Each flexible connector can include a conductive wire electrically coupled to the substrate and a support material at least partially surrounding the conductive wire. The conductive wire can have a first shape when the flexible connector is in the resting configuration and a second, different shape when the flexible connector is in the loaded configuration.

公开(公告)号：US20210183843A1

公开(公告)日：2021-06-17

申请号：US16717827

申请日：2019-12-17

Applicant: Micron Technology, Inc.

Inventor： Shams U. Arifeen ,  Xiaopeng Qu

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

Abstract: Semiconductor devices and semiconductor device packages may include at least one first semiconductor die supported on a first side of a substrate. The at least one first semiconductor die may include a first active surface. A second semiconductor die may be supported on a second, opposite side of the substrate. The second semiconductor die may include a second active surface located on a side of the second semiconductor die facing the substrate. The second semiconductor die may be configured to have higher median power consumption than the at least one first semiconductor die during operation. An electronic system incorporating a semiconductor device package is disclosed, as are related methods.

公开(公告)号：US20210055343A1

公开(公告)日：2021-02-25

申请号：US16546674

申请日：2019-08-21

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Hyunsuk Chun

IPC: G01R31/28

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes a base portion and a plurality of protrusions extending from the base portion. When the heat spreader is coupled to the burn-in testing board, the protrusions are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

公开(公告)号：US20210055342A1

公开(公告)日：2021-02-25

申请号：US16546648

申请日：2019-08-21

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Wesley J. Orme

IPC: G01R31/28

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

公开(公告)号：US10653033B1

公开(公告)日：2020-05-12

申请号：US16174810

申请日：2018-10-30

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Hyunsuk Chun

IPC: H05K7/20 ,  G06F1/20

Abstract: Kits for cooling computing devices may include at least one heat-generating component and a fan. A first duct may be sized and shaped to surround the at least one heat-generating component on three sides to direct a portion of air flow from the fan. A second duct may be sized and shaped to extend over the first duct and direct another portion of air flow between the first and second ducts. The at least one heat-generating component may comprise multiple vertically and longitudinally aligned memory modules Computing devices, electronic systems and methods of cooling are also disclosed.

公开(公告)号：US12159811B2

公开(公告)日：2024-12-03

申请号：US17804492

申请日：2022-05-27

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L21/50 ,  H01L21/56 ,  H01L23/04 ,  H01L23/538

Abstract: A microelectronic device package may include one or more semiconductor dice coupled to a substrate. The microelectronic device package may further include a lid coupled to the substrate, the lid defining a volume over and around the one or more semiconductor die. The microelectronic device package may further include a thermally conductive dielectric filler material substantially filling the volume defined around the semiconductor die.

公开(公告)号：US12078672B2

公开(公告)日：2024-09-03

申请号：US17829224

申请日：2022-05-31

Applicant: Micron Technology, Inc.

Inventor： Xiaopeng Qu ,  Amy R. Griffin ,  Wesley J. Orme

IPC: G01R31/28

CPC classification number: G01R31/2863 ,  G01R31/2875 ,  G01R31/2879

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.