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Patent Agency Ranking
公开(公告)号：US20180007795A1
公开(公告)日：2018-01-04
申请号：US15628059
申请日：2017-06-20
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE , Yoshito FUJIMURA
Abstract: A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.
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公开(公告)号：US20170290146A1
公开(公告)日：2017-10-05
申请号：US15463538
申请日：2017-03-20
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Yoshito FUJIMURA , Hiroyuki TANABE
CPC classification number: H05K1/0284 , H05K1/0274 , H05K1/05 , H05K3/0008 , H05K3/06 , H05K3/064 , H05K3/108 , H05K3/4644 , H05K3/4679 , H05K2201/09227 , H05K2201/09272 , H05K2203/0557 , H05K2203/056 , H05K2203/0562
Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
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公开(公告)号：US20170188465A1
公开(公告)日：2017-06-29
申请号：US15386744
申请日：2016-12-21
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu SUGIMOTO , Hiroyuki TANABE
CPC classification number: H05K3/064 , G03F7/2002 , G03F7/26 , G03F7/40 , H05K1/056 , H05K3/108 , H05K3/44 , H05K3/4661 , H05K2203/0562
Abstract: The method for producing a wired circuit board including an insulating layer and a conductive pattern provided on the insulating layer includes the steps of the following: a step (1), in which the insulating layer is provided; a step (2), in which a metal thin film is provided on an inclined face of the insulating layer; a step (3), in which a photoresist is provided on the metal thin film; a step (4), in which a photomask is disposed so that in the photoresist, a portion where the conductive pattern is to be provided is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the portion; and a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist. When exposing the photoresist, reflection is caused by the metal thin film positioned on the inclined face to reduce light projected to the portion.
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公开(公告)号：US20160262258A1
公开(公告)日：2016-09-08
申请号：US15058502
申请日：2016-03-02
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki TANABE , Yoshito FUJIMURA , Yuu SUGIMOTO
IPC: H05K1/02
CPC classification number: H05K1/0213 , G11B5/4853 , H05K1/118 , H05K1/18 , H05K1/181 , H05K3/341 , H05K2201/05 , H05K2203/048 , Y02P70/613
Abstract: A wired circuit board includes a first insulating layer, a conductive pattern disposed on the first insulating layer and including a plurality of terminals arranged in parallel to be spaced apart from each other, and a second insulating layer disposed on the first insulating layer so as to cover the conductive pattern. Each of the terminals includes a main body portion and a protruding portion protruding from the main body portion and having a dimension in a parallel arrangement direction of the terminals which is shorter than a dimension of the main body portion thereof. The second insulating layer includes a plurality of end-portion covering portions disposed individually on both end portions of the main body portion in the parallel arrangement direction and exposing a middle portion of the main body portion and the protruding portion.
Abstract translation: 布线电路板包括第一绝缘层，布置在第一绝缘层上的导电图案，并且包括彼此平行布置的多个端子，以及设置在第一绝缘层上的第二绝缘层，以便 覆盖导电图案。 每个端子包括主体部分和从主体部分突出并且具有比其主体部分的尺寸短的端子的平行排列方向的尺寸的突出部分。 第二绝缘层包括多个端部覆盖部分，该多个端部覆盖部分分别设置在主体部分的平行排列方向的两个端部上，并且暴露出主体部分和突出部分的中间部分。
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公开(公告)号：US20160133284A1
公开(公告)日：2016-05-12
申请号：US14936102
申请日：2015-11-09
Applicant: NITTO DENKO CORPORATION
Inventor： Naohiro TERADA , Yoshito FUJIMURA , Hiroyuki TANABE , Saori KANEZAKI , Yuu SUGIMOTO
CPC classification number: G11B5/4826 , G11B5/484 , G11B5/4853 , G11B5/486
Abstract: A suspension board with circuit includes a slider mounting region configured to mount a slider thereon, a pedestal portion provided in the slider mounting region and configured to support the slider, and a dam portion provided in the slider mounting region and configured to prevent an adhesive fixing the slider from flowing out of the slider mounting region. The thickness of the pedestal portion is thicker than that of the dam portion.
Abstract translation: 具有电路的悬挂板包括：滑块安装区域，其构造成在其上安装滑块;基座部，设置在滑块安装区域中并构造成支撑滑块;以及阻挡部，其设置在滑块安装区域中并且构造成防止粘合固定 滑块从滑块安装区域流出。 基座部的厚度比坝部的厚度厚。
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