中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

25 records (took 0.017 seconds)

    SUSPENSION BOARD ASSEMBLY SHEET HAVING CIRCUITS, METHOD OF MANUFACTURING THE SAME AND METHOD OF INSPECTING THE SAME
    2.
    发明申请
    SUSPENSION BOARD ASSEMBLY SHEET HAVING CIRCUITS, METHOD OF MANUFACTURING THE SAME AND METHOD OF INSPECTING THE SAME 审中-公开
    具有电路的悬挂板组装片及其制造方法及其检测方法

    公开(公告)号：US20170019985A1

    公开(公告)日：2017-01-19

    申请号：US15208655

    申请日：2016-07-13

    Applicant: Nitto Denko Corporation

    Inventor： Yuu SUGIMOTO ,  Hiroyuki TANABE ,  Naohiro TERADA

    IPC: H05K1/02 ,  H05K1/14 ,  G11B5/48 ,  H05K3/00 ,  G01R1/04 ,  H05K1/11 ,  H05K3/42

    CPC classification number: H05K1/0268 ,  G01R1/04 ,  G11B5/486 ,  H05K1/115 ,  H05K1/142 ,  H05K3/0097 ,  H05K3/424 ,  H05K2203/0165 ,  H05K2203/162

    Abstract: A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.

    Abstract translation: 悬架板和检查基板由支撑框架一体地支撑。 在悬挂板中，依次将第一绝缘层和第二绝缘层层叠在支撑基板上。 一部分线形成在第一绝缘层上，剩余的线形成在第二绝缘层上。 在第二绝缘层中形成将线的一部分连接到剩余线的A通孔。 在检查基板中，第一绝缘层和第二绝缘层依次层叠在支撑基板上。 在第一绝缘层上形成第一检查导体层，在第二绝缘层上形成第二检查导体层。 在第二绝缘层中形成连接第一检查导体层和第二检查导体层的通孔。

    SUSPENSION BOARD WITH CIRCUIT
    3.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT 有权
    悬挂板与电路

    公开(公告)号：US20160105954A1

    公开(公告)日：2016-04-14

    申请号：US14877424

    申请日：2015-10-07

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yuu SUGIMOTO ,  Hiroyuki TANABE

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/05

    CPC classification number: H05K1/0271 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/056 ,  H05K3/4685 ,  H05K2201/09245 ,  H05K2203/0323

    Abstract: A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness direction of the metal supporting board, a first conductive layer including a first wire portion formed at the one side of the first insulating layer, a second insulating layer including a covering portion covering the first wire portion, and a second conductive layer including a second wire portion formed at the one side of the second insulating layer and a terminal portion connected to the first or second wire portion. The second insulating layer includes a second terminal supporting portion formed at the other of the terminal portion. The first insulating layer includes a first terminal supporting portion formed at the other side of the second terminal supporting portion. The metal supporting board is not formed at the other side thereof.

    Abstract translation: 具有电路的悬挂板包括金属支撑板，第一绝缘层，包括形成在金属支撑板的厚度方向上的一侧的布置部分;第一导电层，包括形成在第一导电层的一侧的第一导线部分 绝缘层，包括覆盖第一导线部分的覆盖部分的第二绝缘层，以及包括形成在第二绝缘层一侧的第二导线部分和连接到第一或第二导线部分的端子部分的第二导电层。 第二绝缘层包括形成在端子部分另一端的第二端子支撑部分。 第一绝缘层包括形成在第二端子支撑部分的另一侧的第一端子支撑部分。 金属支撑板不形成在其另一侧。

    WIRED CIRCUIT BOARD
    5.
    发明申请
    WIRED CIRCUIT BOARD 有权
    有线电路板

    公开(公告)号：US20170042024A1

    公开(公告)日：2017-02-09

    申请号：US15305188

    申请日：2015-03-20

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yuu SUGIMOTO

    IPC: H05K1/05 ,  G11B5/48

    CPC classification number: H05K1/05 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/4873 ,  H05K1/056 ,  H05K1/113

    Abstract: A wired circuit board includes a metal pedestal portion formed from a metal material that is the same as the material of the metal supporting board at the pad portion, a pedestal opening formed by opening the metal pedestal portion, a lower conductive layer disposed on one side in the thickness direction of the metal pedestal portion as the first conductive layer, and an upper conductive layer as the second conductive layer formed on one side in the thickness direction of the lower conductive layer as the first conductive layer, wherein one of the lower conductive layer as the first conductive layer and the upper conductive layer as the second conductive layer is disposed in the pedestal opening when projected in the thickness direction, and the periphery of the other is disposed outside of the pedestal opening when projected in the thickness direction.

    Abstract translation: 布线电路板包括由金属材料形成的金属基座部分，该金属基座与衬垫部分处的金属支撑板的材料相同，通过打开金属基座部分形成的基座开口，设置在一侧的下导电层 在作为第一导电层的金属基座部的厚度方向上形成作为第二导电层的上导电层，作为第二导电层，在作为第一导电层的下导电层的厚度方向的一侧上形成第二导电层，其中， 作为第一导电层的层，作为第二导电层的上导电层在沿厚度方向突出时设置在基座开口中，另一方的外周在沿厚度方向突出时设置在基座开口的外侧。

    SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
    6.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF 有权
    具有电路的悬挂板及其制造方法

    公开(公告)号：US20160270229A1

    公开(公告)日：2016-09-15

    申请号：US15059850

    申请日：2016-03-03

    Applicant: NITTO DENKO CORPORATION

    Inventor： Hiroyuki TANABE ,  Yuu SUGIMOTO ,  Yoshito FUJIMURA

    IPC: H05K1/11 ,  H05K3/40 ,  G11B5/48 ,  H05K3/10

    CPC classification number: G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/056 ,  H05K1/184

    Abstract: A suspension board with circuit Includes a first layer made of a metal supporting board, a second layer having insulating properties and provided at one side in a thickness direction of the first layer, and a third layer provided at one side in the thickness direction of the second layer and made of copper or a copper alloy. The first layer includes a first opening portion passing through in the thickness direction. The first opening portion is provided with a conductor layer that is, when projected in a direction orthogonal to the thickness direction, overlapped with the first layer. The conductor layer includes a first conductor circuit having a first electronic component-connecting terminal for being electrically connected to a first electronic component and made of copper or a copper alloy. The third layer includes a second conductor circuit having a second electronic component-connecting terminal for being electrically connected to a second electronic component.

    Abstract translation: 具有电路的悬挂板包括由金属支撑板制成的第一层，具有绝缘性质的第二层，并且设置在第一层的厚度方向的一侧，以及设置在第一层的厚度方向的一侧的第三层 第二层由铜或铜合金制成。 第一层包括在厚度方向上穿过的第一开口部。 第一开口部设置有当与厚度方向正交的方向投影时与第一层重叠的导体层。 导体层包括具有第一电子元件连接端子的第一导体电路，用于电连接到第一电子元件并由铜或铜合金制成。 第三层包括具有电连接到第二电子部件的第二电子部件连接端子的第二导体电路。

    SUSPENSION BOARD WITH CIRCUIT
    7.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT 有权
    悬挂板与电路

    公开(公告)号：US20160111115A1

    公开(公告)日：2016-04-21

    申请号：US14878319

    申请日：2015-10-08

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yoshito FUJIMURA ,  Hiroyuki TANABE ,  Saori KANEZAKI ,  Naohiro TERADA ,  Yuu SUGIMOTO

    IPC: G11B5/48

    CPC classification number: G11B5/4853 ,  G11B5/4826 ,  G11B5/484

    Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.

    Abstract translation: 具有电路的悬挂板包括金属支撑层，在其一个厚度方向上的绝缘基底层，设置在绝缘基底层上的导电图案，设置在绝缘基底层上以覆盖导电性的绝缘覆盖层 图案，以及用于支撑包括薄基座部分的滑块的基座。 薄基座部分包括基底绝缘层中包括的基座基层，包括在基座基层上的导电图案中的基座导电层，以及包括在绝缘覆盖层中并设置在基座导电 层。 导电图案包括放置成在具有较窄部分的绝缘基底层上延伸的第一线，并且基座导电层的尺寸为较窄部分的尺寸的0.5至3倍。

    WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
    10.
    发明申请
    WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF 审中-公开

    公开(公告)号：US20170295650A1

    公开(公告)日：2017-10-12

    申请号：US15478711

    申请日：2017-04-04

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yuu SUGIMOTO ,  Hiroyuki TANABE ,  Yoshito FUJIMURA

    IPC: H05K3/02 ,  H05K1/02

    Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

Patent Agency Ranking