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    SUSPENSION BOARD ASSEMBLY SHEET HAVING CIRCUITS, METHOD OF MANUFACTURING THE SAME AND METHOD OF INSPECTING THE SAME
    2.
    发明申请
    SUSPENSION BOARD ASSEMBLY SHEET HAVING CIRCUITS, METHOD OF MANUFACTURING THE SAME AND METHOD OF INSPECTING THE SAME 审中-公开
    具有电路的悬挂板组装片及其制造方法及其检测方法

    公开(公告)号：US20170019985A1

    公开(公告)日：2017-01-19

    申请号：US15208655

    申请日：2016-07-13

    Applicant: Nitto Denko Corporation

    Inventor： Yuu SUGIMOTO ,  Hiroyuki TANABE ,  Naohiro TERADA

    IPC: H05K1/02 ,  H05K1/14 ,  G11B5/48 ,  H05K3/00 ,  G01R1/04 ,  H05K1/11 ,  H05K3/42

    CPC classification number: H05K1/0268 ,  G01R1/04 ,  G11B5/486 ,  H05K1/115 ,  H05K1/142 ,  H05K3/0097 ,  H05K3/424 ,  H05K2203/0165 ,  H05K2203/162

    Abstract: A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.

    Abstract translation: 悬架板和检查基板由支撑框架一体地支撑。 在悬挂板中，依次将第一绝缘层和第二绝缘层层叠在支撑基板上。 一部分线形成在第一绝缘层上，剩余的线形成在第二绝缘层上。 在第二绝缘层中形成将线的一部分连接到剩余线的A通孔。 在检查基板中，第一绝缘层和第二绝缘层依次层叠在支撑基板上。 在第一绝缘层上形成第一检查导体层，在第二绝缘层上形成第二检查导体层。 在第二绝缘层中形成连接第一检查导体层和第二检查导体层的通孔。

    METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY SHEET
    3.
    发明申请
    METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY SHEET 有权
    制造印刷电路板组件的方法

    公开(公告)号：US20140101934A1

    公开(公告)日：2014-04-17

    申请号：US14141705

    申请日：2013-12-27

    Applicant: Nitto Denko Corporation

    Inventor： Jun ISHII ,  Terukazu IHARA ,  Naohiro TERADA

    IPC: H05K3/46

    CPC classification number: H05K3/4644 ,  G11B5/486 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09781 ,  Y10T29/49124

    Abstract: A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

    Abstract translation: 在至少一个具有一端侧的电路的悬架板和具有电路的悬挂板组装片的支撑框架之间的区域中设置虚拟轨迹部分。 在虚拟轨迹部分的支撑基板上形成基底绝缘层。 在基底绝缘层上形成多个导体迹线，在基底绝缘层上形成盖绝缘层，以覆盖每个导体迹线。 虚拟轨迹部分中的基底绝缘层和覆盖绝缘层中的至少一个具有凹槽。

    SUSPENSION BOARD WITH CIRCUIT
    5.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT 有权
    悬挂板与电路

    公开(公告)号：US20160234936A1

    公开(公告)日：2016-08-11

    申请号：US14950978

    申请日：2015-11-24

    Applicant: NITTO DENKO CORPORATION

    Inventor： Tomoaki OKUNO ,  Yoshito FUJIMURA ,  Naohiro TERADA

    IPC: H05K1/11

    CPC classification number: G11B5/60 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/056

    Abstract: A suspension board with circuit includes a first layer having electrically conductive properties, a second layer having insulation properties and formed at one side in a thickness direction of the first layer, a third layer having electrically conductive properties and formed at one side in the thickness direction of the second layer, and a fourth layer having insulation properties and formed at one side in the thickness direction of the third layer. The first layer includes an electronic component connecting terminal for being electrically connected to an electronic component. The second layer includes a first opening portion passing through in the thickness direction. The third layer includes a first conductive circuit having a magnetic head, and a second conductive circuit. The fourth layer and the second layer are formed with a second opening portion.

    Abstract translation: 具有电路的悬挂板包括具有导电特性的第一层，具有绝缘性能并形成在第一层的厚度方向的一侧的第二层，具有导电性能的第三层，并且形成在厚度方向的一侧 以及具有绝缘性的第四层，并且形成在第三层的厚度方向的一侧。 第一层包括用于电连接到电子部件的电子部件连接端子。 第二层包括在厚度方向上穿过的第一开口部分。 第三层包括具有磁头的第一导电电路和第二导电电路。 第四层和第二层形成有第二开口部分。

    SUSPENSION BOARD WITH CIRCUIT
    7.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT 有权
    悬挂板与电路

    公开(公告)号：US20160133284A1

    公开(公告)日：2016-05-12

    申请号：US14936102

    申请日：2015-11-09

    Applicant: NITTO DENKO CORPORATION

    Inventor： Naohiro TERADA ,  Yoshito FUJIMURA ,  Hiroyuki TANABE ,  Saori KANEZAKI ,  Yuu SUGIMOTO

    IPC: G11B5/48 ,  G11B5/60

    CPC classification number: G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486

    Abstract: A suspension board with circuit includes a slider mounting region configured to mount a slider thereon, a pedestal portion provided in the slider mounting region and configured to support the slider, and a dam portion provided in the slider mounting region and configured to prevent an adhesive fixing the slider from flowing out of the slider mounting region. The thickness of the pedestal portion is thicker than that of the dam portion.

    Abstract translation: 具有电路的悬挂板包括：滑块安装区域，其构造成在其上安装滑块;基座部，设置在滑块安装区域中并构造成支撑滑块;以及阻挡部，其设置在滑块安装区域中并且构造成防止粘合固定 滑块从滑块安装区域流出。 基座部的厚度比坝部的厚度厚。

    SUSPENSION BOARD WITH CIRCUIT
    8.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT 有权
    悬挂板与电路

    公开(公告)号：US20160007458A1

    公开(公告)日：2016-01-07

    申请号：US14755173

    申请日：2015-06-30

    Applicant: NITTO DENKO CORPORATION

    Inventor： Naohiro TERADA ,  Yoshito FUJIMURA

    IPC: H05K1/11

    CPC classification number: H05K1/181 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/0394 ,  H05K2201/2009 ,  Y02P70/611

    Abstract: A suspension board with circuit includes a metal supporting board having a support opening portion passing through a thickness direction; a base insulating layer disposed on an upper surface of the metal supporting board and having an insulating opening portion passing through the thickness direction, when projected in the thickness direction, to be included in the support opening portion; and a conductive layer having a wire portion disposed on an upper surface of the base insulating layer and a terminal portion disposed in the insulating opening portion to be connected to an electronic element and connected to the wire portion. The base insulating layer has a cutout portion obtained by cutting out the base insulating layer in a direction orthogonal to the thickness direction and continuous to the insulating opening portion and the terminal portion includes a terminal free end portion opened by the cutout portion.

    Abstract translation: 具有电路的悬挂板包括具有穿过厚度方向的支撑开口部分的金属支撑板; 基底绝缘层，其设置在所述金属支撑基板的上表面上，具有贯穿所述厚度方向的绝缘开口部，当在厚度方向上突出时，所述绝缘开口部包含在所述支撑开口部中; 以及导电层，其具有布置在所述基底绝缘层的上表面上的导线部分和设置在所述绝缘开口部分中以连接到电子元件并连接到所述导线部分的端子部分。 所述基底绝缘层具有通过在与所述厚度方向正交的方向上切割所述基底绝缘层而与所述绝缘开口部连续的端部而形成的切口部，并且所述端子部包括由所述切口部开口的端子自由端部。

    SUSPENSION BOARD WITH CIRCUIT
    9.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT 审中-公开
    悬挂板与电路

    公开(公告)号：US20150305156A1

    公开(公告)日：2015-10-22

    申请号：US14690827

    申请日：2015-04-20

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yoshito FUJIMURA ,  Naohiro TERADA

    IPC: H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/112 ,  H05K1/0281 ,  H05K1/056 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/10083 ,  Y02P70/611

    Abstract: A suspension board with circuit includes a pad portion configured to be bonded to an electronic element. The pad portion includes a conductive layer; in the pad portion, a through hole passing through the pad portion with its periphery closed by the pad portion is formed; and at least a part of an inner peripheral surface facing the through hole in the pad portion is divided only by the conductive layer.

    Abstract translation: 具有电路的悬挂板包括被配置为结合到电子元件的焊盘部分。 焊盘部分包括导电层; 在焊盘部分中形成有通过焊盘部分的通孔，其周边被焊盘部分封闭; 并且面对焊盘部分中的通孔的内周面的至少一部分仅被导电层分开。

    SUSPENSION BOARD WITH CIRCUIT ASSEMBLY SHEET
    10.
    发明申请
    SUSPENSION BOARD WITH CIRCUIT ASSEMBLY SHEET 有权
    具有电路组装板的悬挂板

    公开(公告)号：US20150216039A1

    公开(公告)日：2015-07-30

    申请号：US14605150

    申请日：2015-01-26

    Applicant: NITTO DENKO CORPORATION

    Inventor： Naohiro TERADA ,  Yoshito FUJIMURA ,  Tomoaki OKUNO

    IPC: H05K1/02

    CPC classification number: H05K3/0097 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/05 ,  H05K2201/09027 ,  H05K2201/0909 ,  H05K2201/0969 ,  H05K2203/0169 ,  H05K2203/1545

    Abstract: A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided.

    Abstract translation: 具有电路组件片的悬挂板包括组装设置区域，该组件设置区域设置有多个悬挂板，其具有沿着一个方向彼此间隔开的电路，以及至少在相对于该一个方向的交叉方向上的一侧设置的边缘区域 的组装提供区域。 在组装提供区域中，在悬挂板之间设置有彼此相邻的电路和在边缘区域中的第一开口部分，设置有脆弱部分。

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