公开(公告)号：US10520817B2

公开(公告)日：2019-12-31

申请号：US15605259

申请日：2017-05-25

Applicant: NITTO DENKO CORPORATION

Inventor： Yuu Sugimoto ,  Hiroyuki Tanabe ,  Yoshito Fujimura

IPC: G03F7/20 ,  G03F1/38 ,  G03F7/039 ,  G03F7/26 ,  G03F7/38 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18

Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.

公开(公告)号：US10143088B2

公开(公告)日：2018-11-27

申请号：US15386744

申请日：2016-12-21

Applicant: NITTO DENKO CORPORATION

Inventor： Yuu Sugimoto ,  Hiroyuki Tanabe

IPC: G03F7/20 ,  H05K3/06 ,  G03F7/26 ,  G03F7/40

Abstract: The method for producing a wired circuit board including an insulating layer and a conductive pattern provided on the insulating layer includes the steps of the following: a step (1), in which the insulating layer is provided; a step (2), in which a metal thin film is provided on an inclined face of the insulating layer; a step (3), in which a photoresist is provided on the metal thin film; a step (4), in which a photomask is disposed so that in the photoresist, a portion where the conductive pattern is to be provided is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the portion; and a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist. When exposing the photoresist, reflection is caused by the metal thin film positioned on the inclined face to reduce light projected to the portion.

公开(公告)号：US10028378B2

公开(公告)日：2018-07-17

申请号：US15373573

申请日：2016-12-09

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki Tanabe ,  Naohiro Terada ,  Yuu Sugimoto ,  Daisuke Yamauchi

IPC: H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  G11B5/48 ,  H05K3/40 ,  H05K3/44 ,  H05K1/02 ,  H05K1/03

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

公开(公告)号：US09713245B2

公开(公告)日：2017-07-18

申请号：US15058502

申请日：2016-03-02

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki Tanabe ,  Yoshito Fujimura ,  Yuu Sugimoto

IPC: H05K1/02 ,  H05K1/18 ,  G11B5/48 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/0213 ,  G11B5/4853 ,  H05K1/118 ,  H05K1/18 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/05 ,  H05K2203/048 ,  Y02P70/613

Abstract: A wired circuit board includes a first insulating layer, a conductive pattern disposed on the first insulating layer and including a plurality of terminals arranged in parallel to be spaced apart from each other, and a second insulating layer disposed on the first insulating layer so as to cover the conductive pattern. Each of the terminals includes a main body portion and a protruding portion protruding from the main body portion and having a dimension in a parallel arrangement direction of the terminals which is shorter than a dimension of the main body portion thereof. The second insulating layer includes a plurality of end-portion covering portions disposed individually on both end portions of the main body portion in the parallel arrangement direction and exposing a middle portion of the main body portion and the protruding portion.

公开(公告)号：US09418687B2

公开(公告)日：2016-08-16

申请号：US14936102

申请日：2015-11-09

Applicant: NITTO DENKO CORPORATION

Inventor： Naohiro Terada ,  Yoshito Fujimura ,  Hiroyuki Tanabe ,  Saori Kanezaki ,  Yuu Sugimoto

IPC: G11B5/40 ,  G11B5/48

CPC classification number: G11B5/4826 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486

Abstract: A suspension board with circuit includes a slider mounting region configured to mount a slider thereon, a pedestal portion provided in the slider mounting region and configured to support the slider, and a dam portion provided in the slider mounting region and configured to prevent an adhesive fixing the slider from flowing out of the slider mounting region. The thickness of the pedestal portion is thicker than that of the dam portion.

Abstract translation: 具有电路的悬挂板包括：滑块安装区域，其构造成在其上安装滑块;基座部，设置在滑块安装区域中并构造成支撑滑块;以及阻挡部，其设置在滑块安装区域中并且构造成防止粘合固定 滑块从滑块安装区域流出。 基座部的厚度比坝部的厚度厚。

公开(公告)号：US09029712B2

公开(公告)日：2015-05-12

申请号：US13828616

申请日：2013-03-14

Applicant: Nitto Denko Corporation

Inventor： Yuu Sugimoto ,  Youhei Shirafuji

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/11 ,  H01K3/10 ,  H05K1/02 ,  H05K13/00 ,  H05K1/05

CPC classification number: H05K1/0296 ,  H05K1/0278 ,  H05K1/056 ,  H05K1/111 ,  H05K13/00 ,  H05K2201/09063 ,  Y02P70/611 ,  Y10T29/49165

Abstract: Read wiring traces and write wiring traces are formed on an insulating layer that is formed on a support substrate. Connection terminals that are electrically connectable to external circuits are formed at parts of the read wiring traces and write wiring traces on the insulating layer, respectively. Openings are formed in the support substrate so as to partially or entirely surround overlap regions that overlap with the connection terminals and have the same plane shape as the connection terminals. Parts of the insulating layer are exposed in the openings.

Abstract translation: 读取布线迹线和写入布线迹线形成在形成在支撑基板上的绝缘层上。 可以连接到外部电路的连接端子分别形成在绝缘层上的读取布线迹线和写入布线迹线的部分。 开口形成在支撑基板上，以便部分地或全部地围绕与连接端子重叠的重叠区域，并且具有与连接端子相同的平面形状。 绝缘层的一部分露出在开口中。

公开(公告)号：US08917483B2

公开(公告)日：2014-12-23

申请号：US14230772

申请日：2014-03-31

Applicant: Nitto Denko Corporation

Inventor： Yuu Sugimoto ,  Takatoshi Sakakura

IPC: G11B5/48 ,  G11B5/84

CPC classification number: G11B5/484 ,  G11B5/4846 ,  G11B5/84 ,  Y10T29/49071 ,  Y10T156/10

Abstract: First and second laminated structures are respectively formed at one surface and the other surface of an insulating layer. A laminate is formed of the first laminated structure, the insulating layer and the second laminated structure. A heat-assisted wiring trace is included in the first laminated structure, and a support substrate and a connection terminal are included in the second laminated structure. The surface of the connection terminal is exposed at the other surface of the insulating layer. A first portion of the laminate including the connection terminal has a thickness smaller than the thickness of second and third portions of the laminate including portions on both sides of the connection terminal.

Abstract translation: 第一和第二层压结构分别形成在绝缘层的一个表面和另一个表面上。 由第一层叠结构，绝缘层和第二层叠结构形成层压体。 在第一层压结构中包括热辅助布线，并且在第二层叠结构中包括支撑基板和连接端子。 连接端子的表面在绝缘层的另一个表面露出。 包括连接端子的层压体的第一部分的厚度小于包括连接端子两侧部分的层压体的第二和第三部分的厚度。