摘要:
A head-gimbal assembly. The head-gimbal assembly includes a suspension, a microactuator disposed on the suspension, and a head-slider bonded to the microactuator. The head-gimbal assembly further includes a connection pad disposed on the suspension, a connection pad disposed on the microactuator and formed over an edge between a side surface and a top surface of the microactuator to have a bend portion with an obtuse angle, and a metallic interconnection joint for interconnecting the connection pad of the suspension with the connection pad of the microactuator.
摘要:
A micro-machined vibration-damping device comprises a patterned visco-elastic polymer and a substrate for receiving the patterned visco-elastic polymer.
摘要:
A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.
摘要:
A head-gimbal assembly. The head-gimbal assembly includes a suspension, a microactuator disposed on the suspension, and a head-slider bonded to the microactuator. The head-gimbal assembly further includes a connection pad disposed on the suspension, a connection pad disposed on the microactuator and formed over an edge between a side surface and a top surface of the microactuator to have a bend portion with an obtuse angle, and a metallic interconnection joint for interconnecting the connection pad of the suspension with the connection pad of the microactuator.
摘要:
A high-aspect ratio motion limiter of a microactuator and a method for fabrication are disclosed. In one embodiment, at least one low-aspect ratio gap is created in a substrate of a microactuator of a hard disk drive. The low-aspect ratio gap is then utilized to facilitate the creation of a high-aspect ratio motion limiter in the substrate of the microactuator.
摘要:
A high-aspect ratio motion limiter of a microactuator and a method for fabrication are disclosed. In one embodiment, at least one low-aspect ratio gap is created in a substrate of a microactuator of a hard disk drive. The low-aspect ratio gap is then utilized to facilitate the creation of a high-aspect ratio motion limiter in the substrate of the microactuator.
摘要:
Embodiments of the present invention help to suppress reduction of the operation quantity of a microactuator. According to one embodiment, a microactuator comprises a silicon substrate and a piezoelectric element. The silicon substrate has some rigidity and provides elastic counter force to the piezoelectric element. In the piezoelectric element a secondary piezoelectric layer is laminated on a primary piezoelectric layer opposite from the silicon substrate. The contraction force of the secondary piezoelectric layer acts on the primary piezoelectric layer so that it bends toward the secondary piezoelectric layer opposite from the silicon substrate. When the primary piezoelectric layer expands, the contraction force of the secondary piezoelectric layer acts on the primary piezoelectric layer so that it warps against the primary piezoelectric layer.
摘要:
A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.
摘要:
A head support mechanism includes a head to read/write information, and an actuator for moving the head. Flanges are provided on opposite sides of a load beam of the head support mechanism, and at least one recessed portion is provided on the load beam. A thickness of the load beam at the at least one recessed portion is smaller than a thickness at other portions of the load beam at least one of oscillation damping material and an IC circuit is arranged in the at least one recessed portion.
摘要:
Embodiments of the invention suppress head jump at the time of application of an impact to provide for an excellent impact resistance performance in a magnetic disk device. In one embodiment, an actuator of a magnetic disk device comprises a suspension mounting the slider on a tip end side thereof to give a predetermined load to the slider, and an arm that holds the suspension, the arm being supported to be able to turn. The arm comprises two arm portions juxtaposed in a direction perpendicular to a surface of the disk, and a spacing between the two arm portions on a side of supported portions thereof in the direction perpendicular to the surface of the disk is larger than that on a side of the slider in the direction perpendicular to the surface of the disk.