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公开(公告)号：US20150195433A1
公开(公告)日：2015-07-09
申请号：US14151406
申请日：2014-01-09
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Feng Lin , Yu-Kai Huang
CPC classification number: H04N5/2252 , G03B17/55 , H04N5/2253 , H04N5/2257 , H04N5/2259
Abstract: An imaging device provides efficient heat transfer by orienting components of the imaging device such that heat is transferred out of the imaging device instead of within the imaging device assembly. Heat is transferred out of the imaging device assembly through a printed circuit board to which the assembly housing is mounted thereon and/or through the housing itself.
Abstract translation: 成像装置通过使成像装置的部件定向而使得热量从成像装置而不是在成像装置组件内传送出来而提供有效的热传递。 热量通过印刷电路板从成像设备组件传送出去，组装壳体上安装有和/或通过壳体本身。
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22.发明申请Infrared Reflection/Absorption Layer For Reducing Ghost Image of Infrared Reflection Noise And Image Sensor Using the Same 有权红外反射/吸收层，用于减少红外反射噪声和图像传感器的鬼影公开(公告)号：US20140117203A1
公开(公告)日：2014-05-01
申请号：US13662640
申请日：2012-10-29
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Wei-Feng Lin , Yeh-An Chien , Chun-Sheng Fan
IPC: G01J1/24
CPC classification number: H01L27/14649 , H01L27/146 , H01L27/14607 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14629 , H01L27/14636 , H01L27/14669 , H01L2224/11
Abstract: An image sensor includes a photo sensing element for receiving infrared (IR) radiation and detecting the IR radiation and generating an electrical signal indicative of the IR radiation. A redistribution layer (RDL) is disposed under the photo sensing element, the RDL comprising pattern of conductors for receiving the electrical signal. An IR reflection layer, an IR absorption layer or an isolation layer is disposed between the photosensing element and the RDL. The IR reflection layer, IR absorption layer or isolation layer provides a barrier to IR radiation such that the IR radiation does not impinge upon the RDL. As a result, a ghost image of the RDL is not generated, resulting in reduced noise and improved sensitivity and performance of the image sensor.
Abstract translation: 图像传感器包括用于接收红外（IR）辐射并检测IR辐射并产生指示IR辐射的电信号的光感测元件。 再分配层（RDL）设置在感光元件下方，RDL包括用于接收电信号的导体图案。 在感光元件和RDL之间设置IR反射层，IR吸收层或隔离层。 IR反射层，IR吸收层或隔离层为IR辐射提供了屏障，使得IR辐射不会撞击RDL。 结果，不产生RDL的重影，导致图像传感器的噪音降低和灵敏度和性能的提高。
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公开(公告)号：US12062673B2
公开(公告)日：2024-08-13
申请号：US17517396
申请日：2021-11-02
Applicant: OmniVision Technologies, Inc.
Inventor： Chun-Sheng Fan , Wei-Feng Lin
IPC: H01L27/146 , H04N23/54
CPC classification number: H01L27/14618 , H01L27/14636 , H01L27/14683 , H04N23/54
Abstract: A curved-surface image-sensor assembly has a porous carrier having a concave surface with a thinned image sensor bonded by an adhesive to its concave surface of the porous carrier; the porous carrier is mounted into a water-resistant package. The sensor assembly is made by fabricating a thinned, flexible, image-sensor integrated circuit (IC) and applying adhesive to a non-illuminated side of the IC; positioning the IC over a concave surface of a porous carrier; applying vacuum through the porous carrier to suck the IC onto the concave surface of the porous carrier; and curing the adhesive to bond the IC to the concave surface of the porous carrier.
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公开(公告)号：US11562928B2
公开(公告)日：2023-01-24
申请号：US16257223
申请日：2019-01-25
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Feng Lin , Chi-Chih Huang
IPC: H01L21/768 , H01L23/544 , H01L27/146 , H01L23/00
Abstract: A chip comprises a semiconductor substrate having a first side and a second side opposite to the first side, a plurality of conductive metal patterns formed on the first side of the semiconductor substrate, a plurality of solder balls formed on the first side of the semiconductor substrate, and at least one code pattern formed using laser marking on the first side of the semiconductor substrate in a space free from the plurality of conductive metal patterns and the plurality of solder balls, wherein the at least one code pattern is visible from a backside of the chip, the at least one code pattern represents a binary number having four bits; and the binary number represents a decimal number to represent a tracing number of the chip.
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公开(公告)号：US11320663B2
公开(公告)日：2022-05-03
申请号：US16430517
申请日：2019-06-04
Applicant: OmniVision Technologies, Inc.
Inventor： Chun-Sheng Fan , Wei-Feng Lin
IPC: G02B5/18 , G02B27/42 , G02B27/09 , H04N13/128 , G06T7/521
Abstract: A diffractive optical element (DOE) comprises a first part comprising a first transparent non-conductive base and a first transparent conductive layer disposed on the first transparent non-conductive base and a second part comprising a second transparent non-conductive base and a second transparent conductive layer disposed on the second transparent non-conductive base. The first transparent conductive layer and the second transparent conductive layer have periodical patterns of thickness for diffracting light. Spacers separate the first part and the second part. The first part and the second part are positioned such that the first transparent conductive layer is facing the second transparent conductive layer. A first end of the first transparent conductive layer is electrically connected to a first terminal of a capacitance monitor, and a second end of the second transparent conductive layer is electrically connected to a second terminal of the capacitance monitor. The capacitance monitor constantly monitors the capacitance across the first transparent conductive layer and the second transparent conductive layer during an operation comprising diffracting a laser beam.
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Patent Agency Ranking
公开(公告)号：US11211414B2
公开(公告)日：2021-12-28
申请号：US16725698
申请日：2019-12-23
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Wei-Feng Lin , Ying-Chih Kuo , Ying Chung
IPC: H01L27/146
Abstract: An image sensor package includes a transparent substrate with a recess formed in the transparent substrate, and an image sensor positioned in the recess so that light incident on the transparent substrate passes through the transparent substrate to the image sensor. The image sensor package also includes a circuit board electrically disposed in the recess and coupled to receive image data from the image sensor, and the image sensor is positioned in the recess between the circuit board and the transparent substrate.
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公开(公告)号：US11172806B2
公开(公告)日：2021-11-16
申请号：US16796087
申请日：2020-02-20
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Feng Lin , Xiang-Dong Xiong
Abstract: A novel endoscope includes a camera module, an electrical cable, and an electrical connector. The camera module includes an analog image signal output terminal. The cable includes an analog image signal line having a first end connected to the analog image signal output terminal of the camera module. The electrical connector includes a set of electrical contacts configured to engage a complimentary set of electrical contacts of a host system. The set of electrical contacts includes at least an analog image signal contact connected to a second end of the analog image signal line of the cable.
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公开(公告)号：US20190043904A1
公开(公告)日：2019-02-07
申请号：US15666901
申请日：2017-08-02
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Chih Chien , Wei-Feng Lin
IPC: H01L27/146 , H01L23/48 , H01L23/00
Abstract: An image sensor package, comprising a silicon substrate; an image sensor pixel array that is formed on the silicon substrate; a peripheral circuit region that is formed around the image sensor pixel array on the silicon substrate; a redistribution layer (RDL) that is electrically coupled to the peripheral circuit region; at least one solder ball that is electrically coupled to the RDL; and a cover glass that is coupled to the RDL. No part of the RDL is located directly above or below the image sensor pixel array. No part of the at least one solder ball is located directly above or below the silicon substrate. A dark material layer is implemented to prevent an edge flare effect of the image sensor pixel array.
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公开(公告)号：US10152291B2
公开(公告)日：2018-12-11
申请号：US14885305
申请日：2015-10-16
Applicant: OmniVision Technologies, Inc.
Inventor： Chun-Sheng Fan , Wei-Feng Lin
Abstract: A novel multi-display projection box includes a housing that is short and wide, a set of display panels, a set of projectors, and a controller. In a particular embodiment the set of display panels includes two display panels, each coupled to opposite sides of the housing. The set of projectors includes two projectors placed adjacent opposite side walls of the housing. One of the projectors projects a first image onto one of the display panels and the other projector projects a second image onto the other display panel. The first and second image can include product information corresponding to goods placed atop the projection box in a retail store.
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公开(公告)号：US20170293115A1
公开(公告)日：2017-10-12
申请号：US15095585
申请日：2016-04-11
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Jau-Jan Deng , Wei-Feng Lin
CPC classification number: G02B13/0085 , G01J1/0204 , G01J1/0403 , G01J1/0411 , G01J1/4228 , H04N5/2252 , H04N5/2253 , H04N5/2254
Abstract: In an embodiment, a slim imager is disclosed. The slim imager includes a substrate including an aperture, an image sensor, and an optics unit. The image sensor is on a bottom side of the substrate, spans the aperture, and has an aperture-facing top surface. The optics unit is on a top side of the substrate, spans the aperture, and includes a transmissive optical element having an aperture-facing bottom surface. A volume partially bound by the aperture-facing top surface and the aperture-facing bottom surface has a refractive index less than 1.01 at visible wavelengths.
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