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    Method and system to operate arrays of reflective elements for extended lifetime operation in use with high intensity power light sources
    21.
    发明授权
    Method and system to operate arrays of reflective elements for extended lifetime operation in use with high intensity power light sources 有权
    用于操作反射元件阵列的方法和系统，用于与高强度功率光源一起使用的延长寿命操作

    公开(公告)号：US09477161B2

    公开(公告)日：2016-10-25

    申请号：US14186562

    申请日：2014-02-21

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Timothy D. Stowe ,  David K. Biegelsen ,  Sourobh Raychaudhuri

    IPC: G03F7/20

    CPC classification number: G03F7/70891 ,  G03F7/70291 ,  G03F7/70425 ,  G03F7/7055 ,  G03F7/70558 ,  G03F7/70858 ,  G03F7/70875

    Abstract: A method and system is provided to extend operational life of a mirror array of an image generating system, wherein the image generating system further includes a high intensity power light source to cause light to impinge on the mirror array, sufficient to cause deleterious plastic deformation of associated hinges of the mirror array, and an image output generating section configured to receive light from the mirror array. Image date is received by the image generating system image data to control mirrors of the mirror array and to generate an output image. A required level of illumination is provided from the mirror array to the image output generating section over a predetermined time period, in accordance with the received image data. Then during at least a portion of the same predetermined time period of providing the required level of illumination from the mirror array to the image output generating section, de-stress switching operations are performed for selected ones of the mirrors of the mirror array to reduce the plastic deformation of the associated hinges. Next, an output image is generated based on the received image data, wherein the de-stress switching operations occurring during at least a portion of the providing of the desired level of illumination is undetected.

    Abstract translation: 提供了一种方法和系统来延长图像产生系统的反射镜阵列的使用寿命，其中图像产生系统还包括高强度光源，以使光线撞击在镜阵列上，足以引起有害的塑性变形 反射镜阵列的相关联的铰链，以及被配置为从反射镜阵列接收光的图像输出生成部。 图像生成系统图像数据接收图像日期以控制反射镜阵列的反射镜并生成输出图像。 根据接收到的图像数据，在预定时间段内从镜阵列到图像输出生成部分提供所需的照明水平。 然后在从反射镜阵列向图像输出产生部分提供所需等级的照明的相同预定时间段的至少一部分中，对反射镜阵列的所选反射镜执行去应力切换操作，以减少 相关铰链的塑性变形。 接下来，基于接收到的图像数据生成输出图像，其中在提供期望的照明级别的至少一部分期间发生的去应力切换操作未被检测到。

    PLASMONIC POLARIZATION-SENSITIVE IMAGE SENSOR
    22.
    发明申请
    PLASMONIC POLARIZATION-SENSITIVE IMAGE SENSOR 审中-公开
    PLASMONIC偏振敏感图像传感器

    公开(公告)号：US20160173834A1

    公开(公告)日：2016-06-16

    申请号：US14570962

    申请日：2014-12-15

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Julie Bert ,  Robert A. Street ,  Sourobh Raychaudhuri

    IPC: H04N9/04 ,  G02B5/30 ,  H04N5/335

    CPC classification number: H04N9/045 ,  G02B27/286 ,  H01L27/14625 ,  H04N5/2254 ,  H04N5/335

    Abstract: A polarization-sensitive imager, include a polarization filter, the polarization filter including a first region and a second region, a pixel array of light sensors coupled to the polarization filter, the pixel array of light sensors including a first region associated with the first region of the polarization filter and a second region associated with the second region of the polarization filter, each region of the pixel array of light sensors configured to output a signal based on an amount of light illuminated on the region and a processor configured to simultaneously determine an intensity image and a polarization image by taking a sum and difference of the signal of the first region of the pixel array of lights sensors and the signal of the second region of the pixel array of light sensors.

    Abstract translation: 偏振敏感成像器包括偏振滤光器，偏振滤光器包括第一区域和第二区域，耦合到偏振滤光器的光传感器的像素阵列，光传感器的像素阵列包括与第一区域相关联的第一区域 并且与所述偏振滤光器的第二区域相关联的第二区域，所述光传感器的像素阵列的每个区域被配置为基于在所述区域上照射的光的量输出信号，以及处理器，被配置为同时确定 通过获取光传感器的像素阵列的第一区域的信号与光传感器的像素阵列的第二区域的信号之和的和和的差，来获得强度图像和偏振图像。

    CHIPLET LOADER FOR MICROASSEMBLER
    23.
    发明公开
    CHIPLET LOADER FOR MICROASSEMBLER 审中-公开

    公开(公告)号：US20240242993A1

    公开(公告)日：2024-07-18

    申请号：US18097543

    申请日：2023-01-17

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： JengPing Lu ,  David K. Biegelsen ,  Sourobh Raychaudhuri ,  Bradley Rupp ,  Eugene M. Chow

    IPC: H01L21/677

    CPC classification number: H01L21/67721 ,  H01L21/67736

    Abstract: A micro-assembly system includes a reservoir that stores a supply of chiplets suspended in a suspension fluid. Each of the chiplets has a bottom major surface that defines a right side down orientation. The system includes a delivery surface or belt that delivers the chiplets from the reservoir to an assembly surface. The system includes a micro assembler that may arrange the first subset of the chiplets in a pattern on the assembly surface. The micro assembler moves the first subset of chiplets towards a subsequent assembly stage. The micro assembler has an array of field generators fixed relative to the assembly surface that move the first subset of the chiplets along the assembly surface in response to signals applied to each of the field generators.

    METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS
    26.
    发明申请
    METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS 有权

    公开(公告)号：US20220388295A1

    公开(公告)日：2022-12-08

    申请号：US17889514

    申请日：2022-08-17

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： JengPing Lu ,  Eugene M. Chow ,  Sourobh Raychaudhuri

    IPC: B32B37/00 ,  B32B37/10 ,  B32B38/04 ,  B32B38/18

    Abstract: A system includes a separation tool that separates a carrier wafer to form a plurality of chiplet carriers. The carrier wafer having sheets of thin film material attached. A sensor and processor of the system determine an orientation of the portions of the sheets of thin film material relative to the chiplets to determine a mapping therebetween. A fluid carrier of the system places the chiplet carriers on an assembly surface in a disordered pattern. The system includes a micro assembler that arranges the chiplet carriers from the disordered pattern to a predetermined pattern based on the mapping. A carrier of the system transfers the portions of the thin film material from the chiplet carriers to a target substrate.

    Multipass transfer surface for dynamic assembly
    27.
    发明授权
    Multipass transfer surface for dynamic assembly 有权

    公开(公告)号：US11279616B2

    公开(公告)日：2022-03-22

    申请号：US16702148

    申请日：2019-12-03

    Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

    Inventor： Sourobh Raychaudhuri ,  Jeng Ping Lu ,  David K. Biegelsen

    IPC: B81C99/00 ,  H01L21/683 ,  H02N13/00

    Abstract: A method of manufacturing an intermediate transfer surface includes depositing an array of etch stops on a conductive surface, etching the conductive surface to form mesas of the conductive surface separated by gaps, and coating the mesas with a dielectric coating. A method of performing microassembly includes forming an assembly of particles on an assembly plane, providing an intermediate transfer surface having an array of electrodes, applying a bias to the intermediate transfer surface to form an electrostatic field between the assembly plane and the intermediate transfer surface, and moving the intermediate transfer surface towards the assembly surface until the electrostatic field strength is strong enough to cause transfer of the assembly to the intermediate transfer surface.

    Transfer substrate utilizing selectable surface adhesion transfer elements
    29.
    发明授权
    Transfer substrate utilizing selectable surface adhesion transfer elements 有权

    公开(公告)号：US10964582B2

    公开(公告)日：2021-03-30

    申请号：US16449844

    申请日：2019-06-24

    Applicant: Palo Alto Research Center Incorporated

    Inventor： Yunda Wang ,  Sourobh Raychaudhuri ,  JengPing Lu

    IPC: H01L21/683 ,  B65G47/90 ,  H01L25/075 ,  H01L33/62

    Abstract: An apparatus includes a transfer substrate with two or more transfer elements. Each of the transfer elements includes an adhesion element having a first surface adhesion at a first temperature and a second surface adhesion at a second temperature. The second surface adhesion less than the first surface adhesion. Each transfer element has a thermal element operable to change a temperature of the adhesion element in response to an input. A controller is coupled to provide the inputs to the thermal elements of the two or more transfer elements to cause a subset of the transfer elements to selectably hold objects to and release the objects from the transfer substrate in response to changes between the first and second surface adhesion of the subset of the transfer elements.

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