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公开(公告)号：US20220153576A1
公开(公告)日：2022-05-19
申请号：US17665305
申请日：2022-02-04
Applicant: Palo Alto Research Center Incorporated
Inventor： Anne Plochowietz , Bradley Rupp , Jengping Lu , Julie A. Bert , Lara S. Crawford , Sourobh Raychaudhuri , Eugene M. Chow , Matthew Shreve , Sergey Butylkov
Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.
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公开(公告)号：US20210272935A1
公开(公告)日：2021-09-02
申请号：US16805911
申请日：2020-03-02
Applicant: Palo Alto Research Center Incorporated
Inventor： Yunda Wang , Jengping Lu , Qian Wang , Sourobh Raychaudhuri
IPC: H01L25/075 , H01L25/16 , H01L33/00 , H01L21/66
Abstract: MicroLED chips are transferred from an epitaxy wafer to a first coupon substrate. The first coupon substrate has a first, soft adhesive layer that temporarily holds the microLED chips. Using a first transfer substrate, a subset of the microLED chips are transferred from the first coupon substrate to a second coupon substrate having a second, soft adhesive layer. A pattern of microLED chips are transferred from another substrate to the second coupon substrate via a second transfer substrate to fill vacancies in the subset of microLED chips. The transfer substrates are operable to hold and release pluralities of micro objects.
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公开(公告)号：US20200207617A1
公开(公告)日：2020-07-02
申请号：US16237419
申请日：2018-12-31
Applicant: Palo Alto Research Center Incorporated
Inventor： Anne Plochowietz , Bradley Rupp , Jengping Lu , Julie A. Bert , Lara S. Crawford , Sourobh Raychaudhuri , Eugene M. Chow , Matthew Shreve , Sergey Butylkov
Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.
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公开(公告)号：US10519037B2
公开(公告)日：2019-12-31
申请号：US14997680
申请日：2016-01-18
Applicant: PALO ALTO RESEARCH CENTER INCORPORATED
Inventor： Sourobh Raychaudhuri , Jeng Ping Lu , David K. Biegelsen
IPC: B81C99/00 , H01L21/683 , H02N13/00
Abstract: An intermediate transfer surface includes a substrate, a two-dimensional array of electrodes, a dielectric spacer layer on the two-dimensional array of electrodes, and a voltage controller electrically connected to the array of electrodes. A method of manufacturing an intermediate transfer surface, depositing an array of etch stops on a conductive surface, etching the conductive surface to form mesas of the conductive surface separated by gaps, and coating the mesas with a dielectric coating. A microassembly system includes an assembly surface having a first two dimensional array of potential wells on a first surface, a first voltage source electrically connected to the first array of potential wells, an intermediate transfer surface having a second two dimensional array of potential wells on a second surface arranged to face the first surface, and a second voltage source electrically connected to the second array of potential wells.
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公开(公告)号：US20180327905A1
公开(公告)日：2018-11-15
申请号：US15591959
申请日：2017-05-10
Applicant: Xerox Corporation , Palo Alto Research Center Incorporated
Inventor： Yunda Wang , Sourobh Raychaudhuri , JengPing Lu , Eugene M. Chow , Julie A. Bert , David Biegelsen , George A. Gibson , Jamie Kalb
IPC: C23C16/50
CPC classification number: H01L21/67271 , H01L21/67282 , H01L21/67294 , H01L24/75 , H01L24/81 , H01L24/95
Abstract: Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.
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Patent Agency Ranking
公开(公告)号：US20180282150A1
公开(公告)日：2018-10-04
申请号：US15476830
申请日：2017-03-31
Applicant: Palo Alto Research Center Incorporated
Inventor： Jeng Ping Lu , Eugene M. Chow , David K. Biegelsen , Sourobh Raychaudhuri
IPC: B81C1/00 , B82Y30/00 , B82Y40/00 , H01L21/027 , H01L21/06 , H01L29/06 , H01L31/0236 , H01L31/0352
CPC classification number: H01L29/0665 , B01J2219/00648 , B01J2219/00653 , B01J2219/00659 , B81B2203/04 , B81B2207/056 , B81C3/005 , B81C2201/0149 , B82Y30/00 , B82Y40/00 , H01L21/06 , H01L24/06 , H01L31/0352 , Y02E10/50
Abstract: An electrode array including a substrate. The electrode array includes a first plurality of electrodes disposed above a first zone of the substrate, wherein the first plurality of electrodes has a first range of spacing. The electrode array further includes a second plurality of electrodes disposed above a second zone of the substrate, wherein the second plurality of electrodes has a second range of spacing that is less than the first range of spacing.
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公开(公告)号：US20170097612A1
公开(公告)日：2017-04-06
申请号：US15380449
申请日：2016-12-15
Applicant: Palo Alto Research Center Incorporated
Inventor： Ramkumar Abhishek , Sourobh Raychaudhuri , Ashish Pattekar
CPC classification number: G04F1/00 , A61J7/0409 , A61J7/0427 , A61J2200/70 , A61M5/31 , A61M2205/584 , B65D1/02 , B65D25/205 , B65D75/367 , B65D75/54 , G01N31/229 , G04F7/00
Abstract: An elapsed timer device includes a timer element comprising a timer chamber, a timer chamber conditioning material disposed within the timer chamber, and a sensor arranged to sense a timer chemical within the timer chamber. The sensor indicates elapsed time in response to a threshold level of the chemical being present within the timer chamber. The timer chamber, timer chemical adsorption/desorption characteristics of the timer chamber conditioning material, and the sensor are configured so that an amount of the timer chemical within the timer chamber reaches the threshold level within a predetermined time after initialization of the timer element.
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公开(公告)号：US11732362B2
公开(公告)日：2023-08-22
申请号：US16781813
申请日：2020-02-04
Applicant: Xerox Corporation , Palo Alto Research Center Incorporated
Inventor： Yunda Wang , Sourobh Raychaudhuri , JengPing Lu , Eugene M. Chow , Julie A. Bert , David Biegelsen , George A. Gibson , Jamie Kalb
CPC classification number: C23C16/50 , B81B3/0018 , H01L21/67271 , H01L21/67282 , H01L21/67294 , H01L24/75 , H01L24/95 , H01L2224/95001 , H01L2224/95101 , H01L2224/95115 , H01L2224/95144 , H01L2224/95145 , H01L2924/10253 , H01L2924/1434 , H01L2924/1461
Abstract: Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.
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公开(公告)号：US20210162727A1
公开(公告)日：2021-06-03
申请号：US17171286
申请日：2021-02-09
Applicant: Palo Alto Research Center Incorporated
Inventor： JengPing Lu , Eugene M. Chow , Sourobh Raychaudhuri
Abstract: Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers to a target substrate.
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公开(公告)号：US20200207068A1
公开(公告)日：2020-07-02
申请号：US16235251
申请日：2018-12-28
Applicant: Palo Alto Research Center Incorporated
Inventor： JengPing Lu , Eugene M. Chow , Sourobh Raychaudhuri
Abstract: Sheets of a thin film material are attached to a carrier wafer. The carrier wafer and the attached sheets of thin film material are separated to form chiplet carriers. Each chiplet carrier includes a portion of the sheets of thin film material attached to a portion of the carrier wafer. The chiplet carriers are placed on an assembly surface in a random pattern. The chiplet carriers are arranged from the random pattern to a predetermined pattern, and the portions of the thin film material are transferred from the chiplet carriers in parallel to a target substrate.
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