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    DEVICE HOUSING AND METHOD FOR MAKING THE DEVICE HOUSING
    21.
    发明申请
    DEVICE HOUSING AND METHOD FOR MAKING THE DEVICE HOUSING 审中-公开
    用于制造设备外壳的设备外壳和方法

    公开(公告)号：US20130052376A1

    公开(公告)日：2013-02-28

    申请号：US13323127

    申请日：2011-12-12

    Applicant: PO-FENG HO ,  XIN-WU GUAN ,  CHAO-SHENG HUANG

    Inventor： PO-FENG HO ,  XIN-WU GUAN ,  CHAO-SHENG HUANG

    IPC: B32B38/10 ,  B32B37/10 ,  B32B1/02 ,  B32B38/04

    CPC classification number: C23C14/04 ,  C23C14/16 ,  G06F1/1613 ,  G06F1/1633 ,  Y10T156/1064 ,  Y10T428/13

    Abstract: A device housing for an electronic device is provided. The device housing includes a stainless steel substrate and at least one metal decorative member. The stainless steel substrate has at least one receiving recess defined in an outer surface and has a metallic coating formed on the outer surface. The at least one metal decorative member has a top surface. The top surface has a mirror finish. The at least one metal decorative member is received in the at least one receiving recess, with the top surface exposed out of the outer surface. The at least one metal decorative member forms a desired symbol, logo, or pattern on the device housing.

    Abstract translation: 提供了一种用于电子设备的设备外壳。 装置壳体包括不锈钢基底和至少一个金属装饰构件。 不锈钢基材具有限定在外表面中的至少一个容纳凹部，并且在外表面上形成金属涂层。 所述至少一个金属装饰构件具有顶面。 顶面有镜面。 所述至少一个金属装饰构件容纳在所述至少一个容纳凹部中，其顶表面露出外表面。 至少一个金属装饰构件在装置壳体上形成期望的符号，标志或图案。

    DEVICE HOUSING AND MANUFACTURING METHOD
    23.
    发明申请
    DEVICE HOUSING AND MANUFACTURING METHOD 有权
    设备外壳和制造方法

    公开(公告)号：US20130043054A1

    公开(公告)日：2013-02-21

    申请号：US13336012

    申请日：2011-12-23

    Applicant: PO-FENG HO

    Inventor： PO-FENG HO

    IPC: H05K5/00 ,  B29C45/14

    CPC classification number: G06F1/1656 ,  B29C45/14336 ,  B29C45/14434 ,  B29C45/14467 ,  B29C45/14778 ,  B29C2045/1454 ,  B29L2031/3437 ,  B29L2031/3475

    Abstract: A housing includes a transparent panel and a housing body. The housing body includes a main body and a flange portion extending from the main body. The filler is formed between the transparent panel and the housing body. The filler includes a first connecting portion, a second connecting portion, and a support portion integrally formed together, the first connecting portion connecting the transparent panel to the flange portion, the support portion supporting the transparent panel, and the second connecting portion connected to the housing body.

    Abstract translation: 壳体包括透明板和壳体。 壳体包括主体和从主体延伸的凸缘部分。 填料形成在透明板和壳体之间。 填料包括第一连接部分，第二连接部分和一体地形成在一起的支撑部分，第一连接部分将透明板连接到凸缘部分，支撑部分支撑透明板，第二连接部分连接到 住房体。

    HOUSING FOR ELECTRONIC DEVICES AND METHOD FOR MAKING THE SAME
    24.
    发明申请
    HOUSING FOR ELECTRONIC DEVICES AND METHOD FOR MAKING THE SAME 有权
    用于电子设备的外壳及其制造方法

    公开(公告)号：US20110235246A1

    公开(公告)日：2011-09-29

    申请号：US12911831

    申请日：2010-10-26

    Applicant: KAI-RONG LIAO ,  PENG-CHENG TONG ,  PO-FENG HO ,  SHIH-WEI YANG

    Inventor： KAI-RONG LIAO ,  PENG-CHENG TONG ,  PO-FENG HO ,  SHIH-WEI YANG

    IPC: H05K5/00 ,  B65D25/54

    CPC classification number: H04M1/0283 ,  B29C45/0055 ,  B29C45/36 ,  B29C2045/0058

    Abstract: An electronic device includes a housing and an electronic module. The housing includes a transparent main body, a masking layer partially adhered to the transparent main body, and a cover. A bare area is exposed forming the masking layer to define a transparent window. The housing defines a receiving chamber and an open end communicating with the receiving chamber. The electronic module includes a touch display screen. The electronic module is received in the receiving chamber, the touch display screen aligns to the transparent window, and the cover seals the open end. The present disclosure further discloses a housing for the electronic device and a method for making the housing.

    Abstract translation: 电子设备包括壳体和电子模块。 壳体包括透明主体，部分地粘附到透明主体的掩模层和盖。 曝光的裸露区域形成掩模层以限定透明窗口。 壳体限定接收室和与接收室连通的开口端。 电子模块包括触摸显示屏。 电子模块被容纳在接收室中，触摸显示屏幕与透明窗口对准，盖子封闭开口端。 本公开进一步公开了一种用于电子设备的壳体和用于制造壳体的方法。

    HOUSING FOR ELECTRONIC DEVICES AND METHOD FOR MAKING THE SAME
    25.
    发明申请
    HOUSING FOR ELECTRONIC DEVICES AND METHOD FOR MAKING THE SAME 审中-公开
    用于电子设备的外壳及其制造方法

    公开(公告)号：US20110233220A1

    公开(公告)日：2011-09-29

    申请号：US12911838

    申请日：2010-10-26

    Applicant: KAI-RONG LIAO ,  PENG-CHENG TONG ,  PO-FENG HO ,  SHIH-WEI YANG

    Inventor： KAI-RONG LIAO ,  PENG-CHENG TONG ,  PO-FENG HO ,  SHIH-WEI YANG

    IPC: B65D25/54 ,  B23P17/00

    CPC classification number: H05K5/0243 ,  B29C45/0053 ,  B29C45/14688 ,  B29C45/14811 ,  B29L2031/3431 ,  B29L2031/3475 ,  Y10T29/4998

    Abstract: A housing includes a hollow sleeve, a top wall, and a cover. The top wall is integrally formed with the hollow sleeve and seals an open end of the hollow sleeve. The hollow sleeve and the top wall include an opaque first molded article and a transparent molded article. The first molded article defines a display window hole. The second molded article is formed on the first molded article and filled in the display window hole. The cover seals the other open end facing the open end which is sealed by the top wall. The present disclosure further discloses a method for making the housing.

    Abstract translation: 壳体包括中空套管，顶壁和盖子。 顶壁与中空套筒整体形成并密封中空套筒的开口端。 中空套筒和顶壁包括不透明的第一模制品和透明模塑制品。 第一模制品定义了显示窗孔。 第二模制品形成在第一模塑制品上并填充在显示窗孔中。 盖子密封面向开口端的另一开口端，该开口端由顶壁密封。 本公开还公开了一种用于制造壳体的方法。

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