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21.发明授权
公开(公告)号：US4814296A
公开(公告)日：1989-03-21
申请号：US90827
申请日：1987-08-28
IPC分类号： B28D5/00 , B27G19/10 , F28D5/00 , H01L21/301 , H01L21/304 , H01L21/306 , H01L27/148
CPC分类号： B27G19/10 , H01L21/3043 , Y10S148/028
摘要： A process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves defining the die faces, relatively wide grooves are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side of the saw blade facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.
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公开(公告)号：US4641949A
公开(公告)日：1987-02-10
申请号：US769515
申请日：1985-08-26
CPC分类号： G03G15/65 , B65H43/02 , G03G2215/00371 , G03G2215/00611 , G03G2215/00632 , G03G2215/00734
摘要： The present invention is concerned with a switching element comprised of oppositely disposed conductive fiber brushes and/or brush-like elements for detecting the presence or absence of paper at various locations in a xerographic copy machine. The oppositely disposed brushes are made from poly-acrylo-nitrile, a carbon based polymer material, which can be fabricated with relatively low values of resistance. Typical fiber bundles may consist of 6000 individual fibers each of 6-10 microns in diameter. In operation each individual conductive fiber acts as a separate electrical path through which the external circuit is completed. Passage of paper through the "nip" of the fiber to fiber electrical contact opens the circuit which is easily detected through associated circuitry which indicates the presence of paper. Likewise, arrays incorporating multiple such sensor switches may be fabricated for the purpose of indicating the size of the document interrupting specific low resistance fiber-fiber switches.
摘要翻译： 本发明涉及由相对设置的导电纤维刷和/或刷状元件组成的开关元件，用于在静电复印机中的各个位置检测是否存在纸。 相对布置的刷子由聚丙烯腈（碳 - 丙烯腈）制成，其可以制造成具有相对较低的电阻值。 典型的纤维束可以由直径为6-10微米的6000个单独纤维组成。 在操作中，每个单独的导电纤维作为外部电路完成的单独的电路径。 将纸通过纤维的“咬合”到纤维电接触，打开电路，通过指示纸张存在的相关电路容易地检测。 同样，可以制造并入多个这样的传感器开关的阵列，用于指示中断特定的低电阻光纤开关的文件尺寸。
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公开(公告)号：US06768565B1
公开(公告)日：2004-07-27
申请号：US09657342
申请日：2000-09-07
IPC分类号： H01L2700
CPC分类号： H04N1/031 , H01L27/14621 , H04N2201/02493
摘要： The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.
摘要翻译： 本发明一般涉及用于扫描图像的数字扫描仪。 更具体地，本发明涉及一种用于增强通过滤出数字数据的红外分量而获得的扫描图像的质量以提供增强的数字图像的方法和装置。
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24.发明授权Reflective test patches for translucent color filters in photosensitive semiconductor chips 失效光敏半导体芯片中半透明滤色片的反光测试贴片
公开(公告)号：US5808297A
公开(公告)日：1998-09-15
申请号：US693781
申请日：1996-07-22
申请人： Josef E. Jedlicka , Brian T. Ormond
发明人： Josef E. Jedlicka , Brian T. Ormond
CPC分类号： H01L27/14687 , H01L27/14621
摘要： Semiconductor chips for use in a chip array assembly for scanning of hard-copy images include rows of photosensors, each row of photosensors having a polyimide filter layer for passing one primary color. In addition to the photosensors, a reflective area is provided on the chip, with filter portions provided on the reflective area. The filter portions are created at the same time as the filter layers placed on the photosensors. The filter layers disposed on the reflective area can be used as test sites for determining the light transmissivity of the filter layers on the photosensors.
摘要翻译： 用于扫描硬拷贝图像的芯片阵列组件的半导体芯片包括光传感器行，每行光电传感器具有用于传递一种原色的聚酰亚胺滤光层。 除了光电传感器之外，在芯片上提供反射区域，其中设置在反射区域上的过滤部分。 过滤器部分与放置在光电传感器上的过滤层同时产生。 设置在反射区域上的滤光层可以用作测定光电传感器上的滤光层透光率的测试位置。
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公开(公告)号：US5753959A
公开(公告)日：1998-05-19
申请号：US779045
申请日：1997-01-06
IPC分类号： G02B27/00 , B41J2/155 , B41J2/16 , H01L21/98 , H01L27/14 , H01L29/06 , H01L33/00 , H04N1/028 , H01L31/00
CPC分类号： H01L25/50 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1635 , B41J2202/19 , B41J2202/20 , H01L29/0657 , H01L2924/0002
摘要： Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips. By increasing the spacing of a defective chip from neighboring chips, the defective chip can be removed while minimizing the risk of damage to neighboring chips. Also, batches of chips can be originally manfactured on a single wafer as either "regular" chips or "replacement" chips, with the replacement chips being slightly shorter in a critical dimension.
摘要翻译： 用于全页幅扫描器的光传感器阵列或全页宽喷墨打印机的半导体芯片安装在基板上，以保持相邻芯片之间的合理一致的间隔。 为了从阵列中除去有缺陷的芯片，衬底被均匀地推向限定凸弓的工作表面。 或者，沿着芯片的邻接边缘提供背切，并且围绕这些背切切割的硅可被锯掉以将有缺陷的芯片与邻近的好的芯片隔开。 通过增加有缺陷的芯片与相邻芯片的间隔，可以去除有缺陷的芯片，同时最小化对相邻芯片的损坏风险。 此外，批次的芯片可以原始地在单个晶片上制造为“常规”芯片或“替换”芯片，替换芯片在临界尺寸上略短。
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公开(公告)号：US5119181A
公开(公告)日：1992-06-02
申请号：US681809
申请日：1991-04-08
IPC分类号： H04N1/48
CPC分类号： H04N1/486
摘要： A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.
摘要翻译： 特别适用于制造全宽阵列的彩色芯片结构，其中由蓝色，绿色和红色光电二极管组成的单个芯片光电二极管形成并定位成提供具有方形侧面的矩形光泽，以增强与其他类似物的颜色芯片对接 彩色芯片组成全彩色阵列。
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公开(公告)号：US5031032A
公开(公告)日：1991-07-09
申请号：US501584
申请日：1990-03-30
CPC分类号： H04N1/486
摘要： A color chip construction especially adapted for use in fabricating full width arrays in which the individual chip photosites consisting of a blue, green, and red photodiode shaped and positioned to provide a rectangular photosite with square sides that enhance butting of the color chip with other like color chips to form full width color arrays.
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