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44 条记录 (耗时 0.025 秒)

    Image sensing chip package structure
    21.
    发明授权
    Image sensing chip package structure 失效
    图像感测芯片封装结构

    公开(公告)号：US07282788B2

    公开(公告)日：2007-10-16

    申请号：US11225078

    申请日：2005-09-14

    申请人： Po-Hung Chen

    发明人： Po-Hung Chen

    IPC分类号： H01L23/02

    CPC分类号： H04N5/2257 ,  H01L31/02325 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In an image sensing chip package structure, plated through vias penetrate a substrate to electrically connect metallization traces disposed on the upper and lower surfaces of the substrate. The plated through vias can be opened from the center of the substrate instead of being located at the periphery of the substrate. Contamination can thus be avoided during the glue dispensing process, and protection layers can also be used to seal gaps generated by the plated through vias, hence enhancing the producing yield. Moreover, protection layers having stickiness can further be used to secure components so as to reduce the production cost and enhance the product quality.

    摘要翻译： 在图像感测芯片封装结构中，通过通孔电镀穿过衬底以电连接设置在衬底的上表面和下表面上的金属化迹线。 电镀通孔可以从衬底的中心打开，而不是位于衬底的周边。 因此可以在胶水分配过程中避免污染，并且保护层也可用于密封由镀通孔形成的间隙，从而提高产量。 此外，可以进一步使用具有粘性的保护层来固定部件，从而降低生产成本并提高产品质量。

    Image sensor package structure
    22.
    发明申请
    Image sensor package structure 审中-公开
    图像传感器封装结构

    公开(公告)号：US20070064317A1

    公开(公告)日：2007-03-22

    申请号：US11231848

    申请日：2005-09-22

    申请人： Po-Hung Chen ,  Mao-Jung Chen

    发明人： Po-Hung Chen ,  Mao-Jung Chen

    IPC分类号： G02B7/02

    CPC分类号： H04N5/2253

    摘要： An image sensor package structure is proposed, in which the electric connection of an image sensing chip and the assembly of a housing and a lens barrel are separately carried out to avoid restriction in the packaging process and influence of outside contaminants. Moreover, corresponding faces of the housing and the lens barrel are designed to be smooth surfaces to reduce the probability of adhesion and accumulation of outside contaminants, thereby enhancing the process yield and also reducing the process cost.

    摘要翻译： 提出了一种图像传感器封装结构，其中分别执行图像感测芯片的电连接和壳体和透镜镜筒的组合，以避免封装过程中的限制和外部污染物的影响。 此外，壳体和透镜筒的相应面被设计为光滑的表面，以减少外部污染物的粘附和积聚的可能性，从而提高过程产量并且还降低工艺成本。

    Packaging structure of a light-sensing device with a spacer wall
    23.
    发明申请
    Packaging structure of a light-sensing device with a spacer wall 失效
    具有间隔壁的光感测装置的包装结构

    公开(公告)号：US20070063129A1

    公开(公告)日：2007-03-22

    申请号：US11230506

    申请日：2005-09-21

    申请人： Po-Hung Chen

    发明人： Po-Hung Chen

    IPC分类号： H01L31/00

    CPC分类号： H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention discloses a packaging structure of a light-sensing device with a spacer wall, wherein a spacer wall is used to protect the light-sensing region from external pollutants or two spacer walls are used to confine the glue to therebetween lest the overflow glue pollute the light-sensing region as in the conventional technology. Further, the present invention can reduce the packaging area and can promote the yield and quality obviously.

    摘要翻译： 本发明公开了一种具有间隔壁的光感测装置的封装结构，其中使用间隔壁来保护光感测区域免受外部污染物的影响，或者使用两个间隔壁将胶水限制在其间，以防止溢出胶 像常规技术那样污染光感测区域。 此外，本发明可以减少包装面积，并且可以显着提高产量和质量。

    Image sensing chip package structure
    24.
    发明申请
    Image sensing chip package structure 失效

    公开(公告)号：US20070057356A1

    公开(公告)日：2007-03-15

    申请号：US11225078

    申请日：2005-09-14

    申请人： Po-Hung Chen

    发明人： Po-Hung Chen

    IPC分类号： H01L23/02

    CPC分类号： H04N5/2257 ,  H01L31/02325 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In an image sensing chip package structure, plated through vias penetrate a substrate to electrically connect metallization traces disposed on the upper and lower surfaces of the substrate. The plated through vias can be opened from the center of the substrate instead of being located at the periphery of the substrate. Contamination can thus be avoided during the glue dispensing process, and protection layers can also be used to seal gaps generated by the plated through vias, hence enhancing the producing yield. Moreover, protection layers having stickiness can further be used to secure components so as to reduce the production cost and enhance the product quality.

    Area efficient global row redundancy scheme for DRAM
    25.
    发明授权
    Area efficient global row redundancy scheme for DRAM 有权
    用于DRAM的区域有效的全局行冗余方案

    公开(公告)号：US06101138A

    公开(公告)日：2000-08-08

    申请号：US358982

    申请日：1999-07-22

    申请人： Chun Shiah ,  Bor-Doou Rong ,  Jeng-Tzong Shih ,  Po-Hung Chen

    发明人： Chun Shiah ,  Bor-Doou Rong ,  Jeng-Tzong Shih ,  Po-Hung Chen

    IPC分类号： G11C29/00 ,  G11C7/00

    CPC分类号： G11C29/808

    摘要： In this invention a global row redundancy scheme for a DRAM is described which effectively uses the resources of the chip to produce an area efficient design. The DRAM is constructed from two types of memory blocks, one that has a redundant cell array and one that does not. Both memory block types contain a memory cell array and bit line sense amplifiers. The bit line sense amplifiers, contained on the block with the redundant cell array, are shared with the memory cell array also contained in the block, and thus eliminating the need for sense amplifiers for use only with the redundant cell array. Although, every block could contain a redundant cell array, only one or two blocks with the redundant cell array are normally used. In the global row redundancy scheme repair can be made to any row containing a failed memory cell located in any memory block by using any unused rows in any redundant cell array, and in doing so provides a maximum effectiveness in repairing DRAM's that provides the opportunity to maximize yield.

    摘要翻译： 在本发明中，描述了用于DRAM的全局行冗余方案，其有效地使用芯片的资源来产生区域有效的设计。 DRAM由两种类型的存储器块构成，一个具有冗余单元阵列，另一个不存在。 这两种存储块类型都包含存储单元阵列和位线读出放大器。 包含在具有冗余单元阵列的块上的位线读出放大器与也包含在该块中的存储单元阵列共享，因此不需要仅用于冗余单元阵列的读出放大器。 尽管每个块都可以包含冗余单元阵列，但通常只使用一个或两个具有冗余单元阵列的块。 在全局行冗余方案中，可以通过使用任何冗余单元阵列中的任何未使用的行来修复任何包含位于任何存储器块中的故障存储器单元的行，并且这样做可以提供修复提供机会的DRAM的最大有效性 最大化产量。

    USB MULTI-FUNCTIONS DEVICE AND METHOD THEREOF
    27.
    发明申请
    USB MULTI-FUNCTIONS DEVICE AND METHOD THEREOF 审中-公开
    USB多功能设备及其方法

    公开(公告)号：US20130097340A1

    公开(公告)日：2013-04-18

    申请号：US13275512

    申请日：2011-10-18

    申请人： Po-Hung Chen

    发明人： Po-Hung Chen

    IPC分类号： G06F3/00

    CPC分类号： G06F13/102 ,  G06F2213/0042

    摘要： A USB multi-functions device and a method thereof. The USB multi-functions device is capable of supporting a plurality of functions for a USB host, has a first software module installed to support a first selection of the functions, and comprises a function switch, a memory, and a controller. The function switch receives an input signal unrelated to any previous signal to switch from the first to a second selection of functions. The memory comprises a switch program executable by a controller, the first software module supporting the first selection of the functions and a second software module supporting the second selection of the functions. The controller executes the switch program to determine the second selection of the functions based on the input signal, and installs the second software module.

    摘要翻译： USB多功能设备及其方法。 USB多功能设备能够支持用于USB主机的多个功能，具有安装的第一软件模块以支持功能的第一选择，并且包括功能开关，存储器和控制器。 功能开关接收与任何先前信号无关的输入信号，以从第一功能切换到第二选择功能。 存储器包括可由控制器执行的开关程序，第一软件模块支持功能的第一选择以及支持功能的第二选择的第二软件模块。 控制器执行切换程序，根据输入信号确定功能的第二次选择，并安装第二个软件模块。

    HOT ZONE HEAT TRANSFER STRUCTURE OF A STIRLING ENGINE
    28.
    发明申请
    HOT ZONE HEAT TRANSFER STRUCTURE OF A STIRLING ENGINE 审中-公开
    搅拌发动机的热区传热结构

    公开(公告)号：US20120073284A1

    公开(公告)日：2012-03-29

    申请号：US13047984

    申请日：2011-03-15

    申请人： Tien-Ting CHEN ,  Chung-Ping Liu ,  Yin-Nan Huang ,  Po-Hung Chen ,  Yu-Ling Huang ,  Han-Hsun Yang ,  Ching-Hsiang Cheng

    发明人： Tien-Ting CHEN ,  Chung-Ping Liu ,  Yin-Nan Huang ,  Po-Hung Chen ,  Yu-Ling Huang ,  Han-Hsun Yang ,  Ching-Hsiang Cheng

    IPC分类号： F02G1/047

    CPC分类号： F02G1/053 ,  F02G1/055 ,  F02G2255/20

    摘要： A hot zone heat transfer structure of a Stirling engine is provided. One end of a cylinder includes a heated head, with its end wall connected with a hot air pipe. The cylinder accommodates a piston. The piston has an end surface corresponding to the end wall, between which a hot zone is defined. The end wall is fitted with a protruding heat conductor towards the piston, and the end surface is fitted with a concave heat-conducting portion, enabling normal overlapping of the ends of both the heat conductor and the heat-conducting portion. The overlapping may vary with the changing locations of the piston. A flanged section is set externally onto said heat conductor towards the exterior of the end wall. The heat from the head can be transferred to the central area of the hot zone via the help of the heat conductor and heat-conducting portion.

    摘要翻译： 提供斯特林发动机的热区传热结构。 气缸的一端包括加热头，其端壁与热空气管连接。 气缸容纳活塞。 活塞具有对应于端壁的端面，在其之间限定热区。 端壁装配有朝向活塞的突出的热导体，并​​且端面装配有凹入的导热部分，使得热导体和导热部分的两端能够正常重叠。 重叠可能随着活塞位置的变化而变化。 凸缘部分设置在所述导热体的外部朝向端壁的外部。 来自头部的热量可以通过热导体和导热部分的帮助被转移到热区的中心区域。

    Packaging method of a light-sensing semiconductor device and packaging structure thereof
    29.
    发明授权
    Packaging method of a light-sensing semiconductor device and packaging structure thereof 失效
    光敏半导体器件的封装方法及其封装结构

    公开(公告)号：US07547571B2

    公开(公告)日：2009-06-16

    申请号：US12078819

    申请日：2008-04-07

    申请人： Po-Hung Chen ,  Mao-Jung Chen

    发明人： Po-Hung Chen ,  Mao-Jung Chen

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

    摘要翻译： 本发明公开了一种感光半导体器件及其封装结构的封装方法，其中在具有多个光感测芯片的感光晶片上形成间隔壁矩阵，并将该粘合剂直接施加到 在非感光区域上的两个相邻间隔壁之间。 因此，当安装光透明盖时，没有更多的粘合剂落在感光片的感光区上。 此外，当将光透明盖按压以与间隔壁接合时，其中沟槽形成在间隔壁的顶部处，粘合剂将不会从接缝处溢出进入感光区域。