公开(公告)号：US20130273696A1

公开(公告)日：2013-10-17

申请号：US13912758

申请日：2013-06-07

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Toshiyuki HATA

IPC: H01L21/50

CPC classification number: H01L21/50 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/06 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/206

Abstract: A technology with which the reliability of a package making up a semiconductor device can be enhanced is provided. A feature of the technical idea of the invention is that: a heat sink unit and an outer lead unit are separated from each other; and the outer lead unit is provided with chip placement portions and each of the chip placement portions and each heat sink are joined together. As a result, when a sealing body is formed at a resin sealing step, tying portions function as a stopper for preventing resin leakage and the formation of resin burr in a package product can be thereby prevented. In addition, camber does not occur in the heat sink unit and cracking in a sealing body caused by winding (camber) can be suppressed.

Abstract translation: 提供了一种可以提高构成半导体器件的封装的可靠性的技术。 本发明的技术思想的特征在于：散热单元和外引线单元彼此分离; 并且外部引线单元设置有芯片放置部分，并且每个芯片放置部分和每个散热器连接在一起。 结果，当在树脂密封步骤中形成密封体时，捆扎部用作防止树脂泄漏的止动件，从而可以防止树脂毛刺在包装产品中的形成。 此外，在散热单元中不会发生弯度，可以抑制由卷绕（弯度）引起的密封体的开裂。