摘要:
A system and method of tracking action items in an enterprise data processing environment. The method includes receiving, by a client from a server, an action item that includes a location. The method further includes performing a check-in, by the client, at the location related to the action item. The method further includes performing a check-out, by the client, related to the action item. The method further includes changing, by the client, the status of the action item. In this manner, a database of action items and statuses may be developed for more effective business collaboration and business management.
摘要:
Example systems and methods of managing content are described. In one implementation, a method accesses a first set of data, if second set of data, and menu data. The menu data is associated with multiple menu actions relevant to the first set of data and the second set of data. The method generates display data that allows a display device to present the first set of data, the second set of data, and the menu to a user such that the menu is positioned between the first set of data and the second set of data. The method receives a user selection of a menu action and, based on the user selection, generates a graphical object that allows the user to indicate whether to apply the selected menu action to the first set of data or the second set of data.
摘要:
A method of forming an integrated circuit structure on a substrate, the substrate includes a primary region and a secondary region. A first layer of a first material of a first thickness is formed over the substrate. A portion of the first layer is removed over the primary region to expose the substrate. The structure is exposed to an oxidizing medium. This forms a second layer, for example, of an oxide material primary region of the substrate. The second layer has a second thickness. Additionally, at least a portion of said first layer is converted to a third layer, for example, of an oxynitride material. The third layer has a third thickness.
摘要:
A lateral heterojunction bipolar transistor (HBT), comprising a semiconductor substrate having having a first insulating layer over the semiconductor substrate. A base trench is formed in a first silicon layer over the first insulating layer to form a collector layer over an exposed portion of the semiconductor substrate and an emitter layer over the first insulating layer. A semiconductive layer is formed on the sidewalls of the base trench to form a collector structure in contact with the collector layer and an emitter structure in contact with the emitter layer. A base structure is formed in the base trench. A plurality of connections is formed through an interlevel dielectric layer to the collector layer, the emitter layer, and the base structure. The base structure preferably is a compound semiconductive material of silicon and at least one of silicon-germanium, silicon-germanium-carbon, and combinations thereof.
摘要:
A method of manufacturing a BiCMOS integrated circuit including a CMOS transistor having a gate structure, and a heterojunction bipolar transistor having an extrinsic base structure. A substrate is provided, and a polysilicon layer is formed over the substrate. The gate structure and the extrinsic base structure are formed in the polysilicon layer. A plurality of contacts is formed through the interlevel dielectric layer to the CMOS transistor and the heterojunction bipolar transistor.
摘要:
A method for manufacturing a lateral heterojunction bipolar transistor (HBT) is provided comprising a semiconductor substrate having a first insulating layer over the semiconductor substrate. A base trench is formed in a first silicon layer over the first insulating layer to form a collector layer over an exposed portion of the semiconductor substrate and an emitter layer over the first insulating layer. A semiconductive layer is formed on the sidewalls of the base trench to form a collector structure in contact with the collector layer and an emitter structure in contact with the emitter layer. A base structure is formed in the base trench. A plurality of connections is formed through an interlevel dielectric layer to the collector layer, the emitter layer, and the base structure. The base structure preferably is a compound semiconductive material of silicon and at least one of silicon-germanium, silicon-germanium-carbon, and combinations thereof.
摘要:
A first method of reducing semiconductor device substrate effects comprising the following steps. O+or O2+are selectively implanted into a silicon substrate to form a silicon-damaged silicon oxide region. One or more devices are formed over the silicon substrate proximate the silicon-damaged silicon oxide region within at least one upper dielectric layer. A passivation layer is formed over the at least one upper dielectric layer. The passivation layer and the at least one upper dielectric layer are patterned to form a trench exposing a portion of the silicon substrate over the silicon-damaged silicon oxide region. The silicon-damaged silicon oxide region is selectively etched to form a channel continuous and contiguous with the trench whereby the channel reduces the substrate effects of the one or more semiconductor devices. A second method of reducing substrate effects under analog devices includes forming an analog device on a SOI substrate and then selectively etching the silicon oxide layer of the SOI substrate to form a channel at least partially underlying the analog device.
摘要翻译:降低半导体器件衬底效应的第一种方法包括以下步骤。 O +或O 2 +被选择性地注入到硅衬底中以形成硅损坏的氧化硅区域。 在硅衬底附近,在至少一个上部电介质层内的硅损坏的氧化硅区域附近形成一个或多个器件。 在所述至少一个上介电层上形成钝化层。 图案化钝化层和至少一个上电介质层以形成在硅损坏的氧化硅区域上暴露硅衬底的一部分的沟槽。 选择性地蚀刻硅损坏的氧化硅区域以形成与沟槽连续且邻接的沟道,由此沟道减小了一个或多个半导体器件的衬底效应。 减少模拟器件下的衬底效应的第二种方法包括在SOI衬底上形成模拟器件,然后选择性地蚀刻SOI衬底的氧化硅层,以形成至少部分在模拟器件下面的沟道。
摘要:
A method to form elevated source/drain (S/D) over staircase shaped openings in insulating layers. A gate structure is formed over a substrate. The gate structure is preferably comprised of a gate dielectric layer, gate electrode, first spacers, and hard mask. A first insulating layer is formed over the substrate and the gate structure. A resist layer is formed having an opening over the gate structure and over a lateral area adjacent to the gate structure. We etch the insulating layer through the opening in the resist layer. The etching removes a first thickness of the insulating layer to form a source/drain (S/D) opening. We remove the first spacers and hardmask to form a source/drain (S/D) contact opening. We implant ions into the substrate through the source/drain (S/D) contact opening to form lightly doped drain regions. We form second spacers on the sidewalls of the gate electrode and the gate dielectric and on the sidewalls of the insulating layer in the source/drain (S/D) contact opening and the source/drain (S/D) opening. A conductive layer is deposited over the gate electrode, the insulating layer. The conductive layer is planarized to exposed the insulating layer to form elevated source/drain (S/D) blocks on a staircase shape insulating layer.
摘要:
A method of forming shallow junction MOSFETs is achieved. A gate oxide layer is formed overlying a substrate. A first electrode layer, of polysilicon or metal, is deposited. A silicon nitride layer is deposited. The silicon nitride layer and the first electrode layer are etched through to form temporary MOSFET gates. Ions are implanted into the substrate to form lightly doped junctions. A spacer layer is deposited. The spacer layer and the gate oxide layer are anisotropically etched to form sidewall spacers. Ions are implanted into the substrate to form heavily doped junctions. The silicon nitride layer is etched away. A second electrode layer, of polysilicon or metal, is deposited overlying the substrate, the sidewall spacers, and the first polysilicon layer. The second electrode layer is polished down to the top surfaces of the sidewall spacers to complete the MOSFETs and to form permanent gates and conductive connections to the source and drain junctions. The second electrode layer is etched through to form separate conductive connections. An intermetal dielectric layer is deposited. The intermetal dielectric layer is etched through to form contact openings. A metal layer is deposited and etched through to form separate metal interconnects. A passivation layer is deposited, and the integrated circuit is completed.
摘要:
A method for a vertical MOS transistor whose vertical channel width can be accurately defined and controlled. Isolation regions are formed in a substrate. The isolation regions defining an active area. Then, we form a source region in the active area. A dielectric layer is formed over the active area and the isolation regions. We form a barrier layer over the dielectric layer. We form an opening in the barrier layer. A gate layer is formed in the opening. We form an insulating layer over the conductive layer and the barrier layer. We form a gate opening through the insulating layer, the gate layer and the dielectric layer to expose the source region. Gate dielectric spacers are formed over the sidewalls of the gate layer. Then, we form a conductive plug filling the gate opening. The insulating layer is removed. We form a drain region in top and side portions of the conductive plug and form doped gate regions in the gate layer. The remaining portions of the conductive plug comprise a channel region. A channel length is between the top of the source region and the drain region. We form an interlevel dielectric layer over the barrier layer, the gate layer, and the conductive plug. Contacts are formed through the interlevel dielectric layer to the doped gate regions, the drain region and the source region.