公开(公告)号：US08528608B2

公开(公告)日：2013-09-10

申请号：US13492477

申请日：2012-06-08

申请人： Rajesh Kelekar ,  Guarav Verma ,  Kurt Weiner

发明人： Rajesh Kelekar ,  Guarav Verma ,  Kurt Weiner

IPC分类号： G01F22/02

CPC分类号： G01F22/02 ,  Y10T137/86035

摘要： A pressure gauge may be coupled to a vessel into which a liquid chemical is to be dispensed. The volume of the vessel may be known and a control device may determine an initial pressure of the vessel using the pressure gauge. A volume of liquid chemical may be dispensed into the vessel which may cause the pressure within the vessel to increase to a second pressure. The control device may determine the second pressure using the pressure gauge may calculate the volume of liquid chemical dispensed into the vessel using the volume of the vessel, the initial pressure of the vessel, and the second pressure of the vessel.

摘要翻译： 压力计可以连接到要分配液体化学品的容器中。 容器的体积可以是已知的，并且控制装置可以使用压力计来确定容器的初始压力。 液体化学品的体积可以分配到容器中，这可能导致容器内的压力增加到第二压力。 控制装置可以使用压力计来确定第二压力可以使用容器的体积，容器的初始压力和容器的第二压力来计算分配到容器中的液体化学品的体积。

公开(公告)号：US20120273072A1

公开(公告)日：2012-11-01

申请号：US13492477

申请日：2012-06-08

申请人： Rajesh Kelekar ,  Gaurav Verma ,  Kurt Weiner

发明人： Rajesh Kelekar ,  Gaurav Verma ,  Kurt Weiner

IPC分类号： B67D7/02

CPC分类号： G01F22/02 ,  Y10T137/86035

摘要： A pressure gauge may be coupled to a vessel into which a liquid chemical is to be dispensed. The volume of the vessel may be known and a control device may determine an initial pressure of the vessel using the pressure gauge. A volume of liquid chemical may be dispensed into the vessel which may cause the pressure within the vessel to increase to a second pressure. The control device may determine the second pressure using the pressure gauge may calculate the volume of liquid chemical dispensed into the vessel using the volume of the vessel, the initial pressure of the vessel, and the second pressure of the vessel.

摘要翻译： 压力计可以连接到要分配液体化学品的容器中。 容器的体积可以是已知的，并且控制装置可以使用压力计来确定容器的初始压力。 液体化学品的体积可以分配到容器中，这可能导致容器内的压力增加到第二压力。 控制装置可以使用压力计来确定第二压力可以使用容器的体积，容器的初始压力和容器的第二压力来计算分配到容器中的液体化学品的体积。

公开(公告)号：US07824935B2

公开(公告)日：2010-11-02

申请号：US12167118

申请日：2008-07-02

申请人： Gaurav Verma ,  Kurt Weiner ,  Prashant Phatak ,  Imran Hashim ,  Sandra Malhotra ,  Tony Chiang

发明人： Gaurav Verma ,  Kurt Weiner ,  Prashant Phatak ,  Imran Hashim ,  Sandra Malhotra ,  Tony Chiang

IPC分类号： H01L21/00

CPC分类号： G01R31/2831 ,  G01R31/2834 ,  H01L22/34

摘要： In embodiments of the current invention, methods of combinatorial processing and a test chip for use in these methods are described. These methods and test chips enable the efficient development of materials, processes, and process sequence integration schemes for semiconductor manufacturing processes. In general, the methods simplify the processing sequence of forming devices or partially formed devices on a test chip such that the devices can be tested immediately after formation. The immediate testing allows for the high throughput testing of varied materials, processes, or process sequences on the test chip. The test chip has multiple site isolated regions where each of the regions is varied from one another and the test chip is designed to enable high throughput testing of the different regions.

摘要翻译： 在本发明的实施例中，描述了用于这些方法的组合处理方法和测试芯片。 这些方法和测试芯片能够有效地开发用于半导体制造工艺的材料，工艺和工艺顺序集成方案。 通常，这些方法简化了在测试芯片上形成器件或部分形成的器件的处理顺序，使得器件可以在形成后立即进行测试。 即时测试允许测试芯片上各种材料，工艺或工艺顺序的高通量测试。 测试芯片具有多个位置隔离区域，其中每个区域彼此变化，并且测试芯片被设计为能够实现不同区域的高通量测试。

公开(公告)号：US20110303696A1

公开(公告)日：2011-12-15

申请号：US13214426

申请日：2011-08-22

申请人： Rajesh Kelekar ,  Gaurav Verma ,  Kurt Weiner

发明人： Rajesh Kelekar ,  Gaurav Verma ,  Kurt Weiner

IPC分类号： B67D1/00

CPC分类号： G05D7/0635 ,  B01J19/0046 ,  B01J2219/00286 ,  B01J2219/00306 ,  B01J2219/00337 ,  B01J2219/00389 ,  B01J2219/00418 ,  B01J2219/00479 ,  B01J2219/00585 ,  B01J2219/00698 ,  B01J2219/0072 ,  B01J2219/00756 ,  Y10T137/0379 ,  Y10T137/3115 ,  Y10T137/3127 ,  Y10T137/4807

摘要： A pressure gauge may be coupled to a supply line which carries liquid from a bottle to either one or more mixing vessels and/or one or more reactors in a combinatorial processing tool. A control device may monitor the pressure measured by the pressure gauge, and the control device may be configured to change the pressure supplied to the bottle based on a comparison of the measured pressure to a predetermined pressure value. The control device may adjust the pressure provided to the bottle using a pressure regulator coupled to the pressure source. By changing the pressure provided to the bottle, the control device may maintain a relatively constant flow rate of fluids from the liquid source into one or more mixing vessels and/or the one or more reactors.

摘要翻译： 压力计可以耦合到供应管线，其将液体从瓶运送到组合加工工具中的一个或多个混合容器和/或一个或多个反应器。 控制装置可以监测由压力计测量的压力，并且控制装置可以被配置成基于测量的压力与预定压力值的比较来改变供给到瓶子的压力。 控制装置可以使用耦合到压力源的压力调节器来调节提供给瓶子的压力。 通过改变提供给瓶子的压力，控制装置可以保持流体从液体源到一个或多个混合容器和/或一个或多个反应器的相对恒定的流速。

公开(公告)号：US20100001269A1

公开(公告)日：2010-01-07

申请号：US12167118

申请日：2008-07-02

申请人： Gaurav Verma ,  Kurt Weiner ,  Prashant Phatak ,  Imran Hashim ,  Sandra Malhotra ,  Tony Chiang

发明人： Gaurav Verma ,  Kurt Weiner ,  Prashant Phatak ,  Imran Hashim ,  Sandra Malhotra ,  Tony Chiang

IPC分类号： C23C16/00 ,  H01L21/66 ,  H01L23/58

CPC分类号： G01R31/2831 ,  G01R31/2834 ,  H01L22/34

摘要： In embodiments of the current invention, methods of combinatorial processing and a test chip for use in these methods are described. These methods and test chips enable the efficient development of materials, processes, and process sequence integration schemes for semiconductor manufacturing processes. In general, the methods simplify the processing sequence of forming devices or partially formed devices on a test chip such that the devices can be tested immediately after formation. The immediate testing allows for the high throughput testing of varied materials, processes, or process sequences on the test chip. The test chip has multiple site isolated regions where each of the regions is varied from one another and the test chip is designed to enable high throughput testing of the different regions.

摘要翻译： 在本发明的实施例中，描述了用于这些方法的组合处理方法和测试芯片。 这些方法和测试芯片能够有效地开发用于半导体制造工艺的材料，工艺和工艺顺序集成方案。 通常，这些方法简化了在测试芯片上形成器件或部分形成的器件的处理顺序，使得器件可以在形成后立即进行测试。 即时测试允许测试芯片上各种材料，工艺或工艺顺序的高通量测试。 测试芯片具有多个位置隔离区域，其中每个区域彼此变化，并且测试芯片被设计为能够实现不同区域的高通量测试。

公开(公告)号：US20070202614A1

公开(公告)日：2007-08-30

申请号：US11674132

申请日：2007-02-12

申请人： Tony Chiang ,  David Lazovsky ,  Kurt Weiner ,  Gustavo Pinto ,  Thomas Boussie ,  Alexander Gorer

发明人： Tony Chiang ,  David Lazovsky ,  Kurt Weiner ,  Gustavo Pinto ,  Thomas Boussie ,  Alexander Gorer

IPC分类号： H01L21/66

CPC分类号： H01L22/20 ,  C23C14/54 ,  C23C16/52 ,  H01L21/76849 ,  H01L22/14 ,  Y02P80/40

摘要： A method for analyzing and optimizing fabrication techniques using variations of materials, unit processes, and process sequences is provided. In the method, a subset of a semiconductor manufacturing process sequence and build is analyzed for optimization. During the execution of the subset of the manufacturing process sequence, the materials, unit processes, and process sequence for creating a certain structure is varied. During the combinatorial processing, the materials, unit processes, or process sequence is varied between the discrete regions of a semiconductor substrate, wherein within each of the regions the process yields a substantially uniform or consistent result that is representative of a result of a commercial manufacturing operation. A tool for optimizing a process sequence is also provided.

摘要翻译： 提供了一种使用材料，单元过程和工艺顺序的变化来分析和优化制造技术的方法。 在该方法中，分析半导体制造过程序列和构建的子集以进行优化。 在执行制造过程序列的子集期间，用于创建特定结构的材料，单元过程和过程顺序是变化的。 在组合处理期间，材料，单元工艺或工艺顺序在半导体衬底的离散区域之间变化，其中在每个区域内，该工艺产生基本均匀或一致的结果，其代表商业制造的结果 操作。 还提供了用于优化处理顺序的工具。

公开(公告)号：US20070202610A1

公开(公告)日：2007-08-30

申请号：US11674137

申请日：2007-02-12

申请人： Tony Chiang ,  David Lazovsky ,  Kurt Weiner ,  Gustavo Pinto ,  Thomas Boussie ,  Alexander Gorer

发明人： Tony Chiang ,  David Lazovsky ,  Kurt Weiner ,  Gustavo Pinto ,  Thomas Boussie ,  Alexander Gorer

IPC分类号： C40B30/02 ,  C40B40/18 ,  H01L21/00 ,  C40B50/00

CPC分类号： H01L22/20 ,  C23C14/54 ,  C23C16/52 ,  H01L21/76849 ,  H01L22/14 ,  Y02P80/40

摘要： A method for analyzing and optimizing fabrication techniques using variations of materials, unit processes, and process sequences is provided. In the method, a subset of a semiconductor manufacturing process sequence and build is analyzed for optimization. During the execution of the subset of the manufacturing process sequence, the materials, unit processes, and process sequence for creating a certain structure is varied. During the combinatorial processing, the materials, unit processes, or process sequence is varied between the discrete regions of a semiconductor substrate, wherein within each of the regions the process yields a substantially uniform or consistent result that is representative of a result of a commercial manufacturing operation. A tool for optimizing a process sequence is also provided.

公开(公告)号：US5956603A

公开(公告)日：1999-09-21

申请号：US141842

申请日：1998-08-27

申请人： Somit Talwar ,  Kurt Weiner

发明人： Somit Talwar ,  Kurt Weiner

IPC分类号： H01L29/78 ,  H01L21/20 ,  H01L21/265 ,  H01L21/268 ,  H01L21/336 ,  H01L21/8238 ,  H01L27/092

CPC分类号： H01L21/268 ,  H01L21/26513 ,  H01L21/26506 ,  H01L21/8238 ,  H01L29/6659 ,  Y10S438/952

摘要： A method for fabricating a plurality of shallow-junction metal oxide semiconductor field-effect transistors (MOSFETs) on a selected area of a silicon wafer, in the case in which the MOSFETs are spaced from one another by substantially transparent isolation elements. The method includes the step of flooding the entire selected area with laser radiation that is intended to effect the heating to a desired threshold temperature of only the selected depth of a surface layer of silicon that has been previously amorphized to this selected depth and then doped. This threshold temperature is sufficient to melt amorphized silicon but is insufficient to melt crystalline silicon. However, should the laser radiation be directly incident on both the substantially transparent isolation elements and the silicon surface, a variable portion of the energy of the incident radiation traveling through the substantially transparent isolation elements would be transferred to the silicon surfaces in contact with the isolation elements depending on the depth of the isolation elements thereby causing unpredictable additional heating of the silicon which would result in an unwanted shift in the fluence required to reach the melt threshold temperature in those silicon regions which reach the melt threshold temperature. To prevent this, a top layer stack of a dielectric and a highly radiation-absorbent material (e.g., silicon dioxide and tantalum nitride) is deposited over the selected area prior to the flooding of the entire selected area with laser radiation taking place. After, the melted silicon has cooled and recrystallized, the top layer of highly radiation-absorbent material is stripped.

摘要翻译： 在通过基本上透明的隔离元件彼此隔开的情况下，在硅晶片的选定区域上制造多个浅结金属氧化物半导体场效应晶体管（MOSFET）的方法。 该方法包括用激光辐射淹没整个所选择的区域的步骤，该激光辐射旨在将加热至仅被预先非晶化到该选定深度的硅的表面层的选定深度的所需阈值温度，然后掺杂。 该阈值温度足以熔化非晶硅，但不足以熔化晶体硅。 然而，如果激光辐射直接入射到基本上透明的隔离元件和硅表面上，则穿过基本上透明的隔离元件的入射辐射的能量的可变部分将被转移到与隔离物接触的硅表面 元素取决于隔离元件的深度，从而引起硅的不可预测的额外加热，这将导致在达到熔融阈值温度的那些硅区域中达到熔体阈值温度所需的注量的不希望的变化。 为了防止这种情况，在发生激光辐射的整个选定区域的溢流之前，在所选择的区域上沉积电介质和高辐射吸收材料（例如二氧化硅和氮化钽）的顶层堆叠。 之后，熔融的硅已经冷却并重结晶，剥离高度辐射吸收材料的顶层。

公开(公告)号：US09164517B2

公开(公告)日：2015-10-20

申请号：US13214426

申请日：2011-08-22

申请人： Rajesh Kelekar ,  Gaurav Verma ,  Kurt Weiner

发明人： Rajesh Kelekar ,  Gaurav Verma ,  Kurt Weiner

IPC分类号： G05D16/00 ,  G05D7/06 ,  B01J19/00

CPC分类号： G05D7/0635 ,  B01J19/0046 ,  B01J2219/00286 ,  B01J2219/00306 ,  B01J2219/00337 ,  B01J2219/00389 ,  B01J2219/00418 ,  B01J2219/00479 ,  B01J2219/00585 ,  B01J2219/00698 ,  B01J2219/0072 ,  B01J2219/00756 ,  Y10T137/0379 ,  Y10T137/3115 ,  Y10T137/3127 ,  Y10T137/4807

摘要： A pressure gauge may be coupled to a supply line which carries liquid from a bottle to either one or more mixing vessels and/or one or more reactors in a combinatorial processing tool. A control device may monitor the pressure measured by the pressure gauge, and the control device may be configured to change the pressure supplied to the bottle based on a comparison of the measured pressure to a predetermined pressure value. The control device may adjust the pressure provided to the bottle using a pressure regulator coupled to the pressure source. By changing the pressure provided to the bottle, the control device may maintain a relatively constant flow rate of fluids from the liquid source into one or more mixing vessels and/or the one or more reactors.

摘要翻译： 压力计可以耦合到供应管线，其将液体从瓶运送到组合加工工具中的一个或多个混合容器和/或一个或多个反应器。 控制装置可以监测由压力计测量的压力，并且控制装置可以被配置成基于测量的压力与预定压力值的比较来改变供给到瓶子的压力。 控制装置可以使用耦合到压力源的压力调节器来调节提供给瓶子的压力。 通过改变提供给瓶子的压力，控制装置可以保持流体从液体源到一个或多个混合容器和/或一个或多个反应器的相对恒定的流速。

公开(公告)号：US09059223B2

公开(公告)日：2015-06-16

申请号：US12333226

申请日：2008-12-11

申请人： Kurt Weiner ,  Aaron Francis ,  Ken Williams

发明人： Kurt Weiner ,  Aaron Francis ,  Ken Williams

IPC分类号： B05C5/00 ,  C40B60/00 ,  H01L21/67

CPC分类号： H01L21/6719 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6715

摘要： A combinatorial processing system having modular dispense heads is provided. The modular dispense heads are disposed on a rail system enabling an adjustable pitch of the modular dispense heads for the combinatorial processing. The modular dispense heads are configured so that sections of the modular dispense heads are detachable in order to accommodate various processes through a first section without having to completely disconnect and re-connect facilities to a second section.

摘要翻译： 提供了具有模块化分配头的组合处理系统。 模块化分配头设置在轨道系统上，使得用于组合处理的模块化分配头的可调节距。 模块化分配头被配置为使得模块化分配头的部分可拆卸以便通过第一部分适应各种过程，而不必完全断开并将设备重新连接到第二部分。