公开(公告)号：US20090315051A1

公开(公告)日：2009-12-24

申请号：US12401620

申请日：2009-03-11

申请人： Chia-Hao Wu ,  Hung-Yuan Su

发明人： Chia-Hao Wu ,  Hung-Yuan Su

IPC分类号： H01L33/00

CPC分类号： H01L33/508 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0091

摘要： A transparent layer and a phosphor layer are covered on the LED chip for increasing light emission efficiency and evenness of the LED. Based on angle-dependent emission strength of the LED chip, the phosphor layer is designed with different thickness or contains different phosphor powder concentration in different section. The lights emitted with different strength from different angle of the LED chip are transformed into uniform compound lights after passing through the phosphor layer that has different thickness or phosphor powder concentration. Micro structures capable of destroying the full reflection occurred on the incident lights are further configured on both the inner and outer surfaces of the phosphor layer to increase the light emission efficiency.

摘要翻译： 在LED芯片上覆盖透明层和荧光体层，以提高LED的发光效率和均匀性。 基于LED芯片的角度依赖性发射强度，荧光体层设计成不同的厚度或不同部分含有不同的荧光粉浓度。 从LED芯片的不同角度发出的不同强度的光在通过具有不同厚度或荧光粉浓度的荧光体层后，转变为均匀的复合光。 在荧光体层的内表面和外表面上进一步配置能够破坏入射光全反射的微结构，以提高发光效率。

公开(公告)号：US07053414B2

公开(公告)日：2006-05-30

申请号：US10821967

申请日：2004-04-12

申请人： Hung-Yuan Su ,  Jen Chun Weng

发明人： Hung-Yuan Su ,  Jen Chun Weng

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An optical semiconductor component has multiple conducting wire holders, multiple chip carriers secured, multiple semiconductor chips, a first curved surface made of the conducting wire holders, the semiconductor chips being placed at its focus, multiple connecting components made of the conducting wire holders, and a second curved surface surrounded by a package body, the semiconductor chips being placed at its focus. The chip carriers are independent components and have a multi-layer structure. The middle layer is an insulator used to separate the chip from the conducting wire holder electrically or thermally. Hence, when connected with a metal radiator, the chip carrier does not cause electric leakage. Further, the connecting components of the present invention are mutually independent, which can provide multiple photodiodes with different driving voltages to connect with each other in series or parallel.

摘要翻译： 光半导体元件具有多个导线保持器，多个芯片载体固定，多个半导体芯片，由导线保持器制成的第一弯曲表面，半导体芯片放置在其焦点处，由导线保持器制成的多个连接部件和 由封装体包围的第二弯曲表面，半导体芯片被放置在其焦点处。 芯片载体是独立的部件，具有多层结构。 中间层是用于将芯片与导线保持器电或热分离的绝缘体。 因此，当与金属散热器连接时，芯片载体不会导致漏电。 此外，本发明的连接部件是相互独立的，其可以提供具有不同驱动电压的多个光电二极管，以串联或并联连接。

公开(公告)号：US07009285B2

公开(公告)日：2006-03-07

申请号：US10912061

申请日：2004-08-06

申请人： Hung-Yuan Su ,  Chung-Chan Wu ,  Shu-Yun Su

发明人： Hung-Yuan Su ,  Chung-Chan Wu ,  Shu-Yun Su

IPC分类号： H01L23/02

CPC分类号： H01L33/60 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An optoelectronic semiconductor component applies to a surface mount component of an optoelectronic semiconductor. The optoelectronic semiconductor component has one or more semiconductor chip secured on a chip carrier. The chip carrier is a part of a lead frame, and another part of the lead frame is formed with an independent connection part as a contact of the semiconductor chip. An encapsulation body centers on the semiconductor chip and encircles part of the chip carrier and the independent connection part to form an annular ellipsoid for reflecting or receiving radiation of the semiconductor chip. The encapsulation body has a recess and a window part filling the recess. The window part is composed of materials for transforming the optical characteristics of the semiconductor chip. Part of the chip carrier and the independent connection part extend out the encapsulation body to form outside contacts as a SMT component.

摘要翻译： 光电子半导体部件适用于光电子半导体的表面安装部件。 光电子半导体部件具有固定在芯片载体上的一个或多个半导体芯片。 芯片载体是引线框架的一部分，引线框架的另一部分形成有独立的连接部分作为半导体芯片的接触。 封装体以半导体芯片为中心，并且环绕芯片载体和独立连接部分的一部分，以形成用于反射或接收半导体芯片的辐射的环形椭圆体。 封装体具有凹部和填充凹部的窗口部分。 窗口部分由用于变换半导体芯片的光学特性的材料组成。 芯片载体和独立连接部分的一部分延伸出封装体以形成作为SMT部件的外部触点。

公开(公告)号：US20060038197A1

公开(公告)日：2006-02-23

申请号：US10923025

申请日：2004-08-23

申请人： Daw-Heng Wang ,  Hung-Yuan Su

发明人： Daw-Heng Wang ,  Hung-Yuan Su

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A reflection-type optoelectronic semiconductor device has an LED chip disposed on a first conducting wire portion, a second conducting wire portion connected to the LED chip via a connection wire, a packaging body for sealing the LED chip and part of the first conducting wire portion and the second conducting wire portion, a reflecting face disposed in an opposite direction of a light emission face of the LED chip and surrounding the packaging body, and an optical spectrum conversion layer coated onto the packaging body. A primary light emitted by the LED chip is reflected to the optical spectrum conversion layer by the reflecting face to undergo light excitation for producing a secondary light. The primary light and the secondary light are combined to generate a mixed light. A lens can be placed in the travel direction of the mixed light to change the distribution of the mixed light.

摘要翻译： 反射型光电子半导体器件具有设置在第一导线部分上的LED芯片，经由连接线连接到LED芯片的第二导线部分，用于密封LED芯片的封装体和第一导线部分的一部分 所述第二导线部，与所述LED芯片的发光面相反的方向配置并包围所述封装体的反射面以及涂覆在所述封装体上的光谱转换层。 由LED芯片发射的初级光被反射面反射到光谱转换层，以进行用于产生二次光的光激发。 初级光和次级光被组合以产生混合光。 可以将透镜放置在混合光的行进方向上以改变混合光的分布。

公开(公告)号：US20050224815A1

公开(公告)日：2005-10-13

申请号：US10821967

申请日：2004-04-12

申请人： Hung-Yuan Su ,  Jen Weng

发明人： Hung-Yuan Su ,  Jen Weng

IPC分类号： H01L25/075 ,  H01L27/15 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An optical semiconductor component has multiple conducting wire holders, multiple chip carriers secured, multiple semiconductor chips, a first curved surface made of the conducting wire holders, the semiconductor chips being placed at its focus, multiple connecting components made of the conducting wire holders, and a second curved surface surrounded by a package body, the semiconductor chips being placed at its focus. The chip carriers are independent components and have a multi-layer structure. The middle layer is an insulator used to separate the chip from the conducting wire holder electrically or thermally. Hence, when connected with a metal radiator, the chip carrier does not cause electric leakage. Further, the connecting components of the present invention are mutually independent, which can provide multiple photodiodes with different driving voltages to connect with each other in series or parallel.

摘要翻译： 光半导体元件具有多个导线保持器，多个芯片载体固定，多个半导体芯片，由导线保持器制成的第一弯曲表面，半导体芯片放置在其焦点处，由导线保持器制成的多个连接部件和 由封装体包围的第二弯曲表面，半导体芯片被放置在其焦点处。 芯片载体是独立的部件，具有多层结构。 中间层是用于将芯片与导线保持器电或热分离的绝缘体。 因此，当与金属散热器连接时，芯片载体不会导致漏电。 此外，本发明的连接部件是相互独立的，其可以提供具有不同驱动电压的多个光电二极管，以串联或并联连接。

公开(公告)号：US20050205974A1

公开(公告)日：2005-09-22

申请号：US10912061

申请日：2004-08-06

申请人： Hung-Yuan Su ,  Chung-Chan Wu ,  Shu-Yun Su

发明人： Hung-Yuan Su ,  Chung-Chan Wu ,  Shu-Yun Su

IPC分类号： H01L23/02 ,  H01L25/16 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An optoelectronic semiconductor component applies to a surface mount component of an optoelectronic semiconductor. The optoelectronic semiconductor component has one or more semiconductor chip secured on a chip carrier. The chip carrier is a part of a lead frame, and another part of the lead frame is formed with an independent connection part as a contact of the semiconductor chip. An encapsulation body centers on the semiconductor chip and encircles part of the chip carrier and the independent connection part to form an annular ellipsoid for reflecting or receiving radiation of the semiconductor chip. The encapsulation body has a recess and a window part filling the recess. The window part is composed of materials for transforming the optical characteristics of the semiconductor chip. Part of the chip carrier and the independent connection part extend out the encapsulation body to form outside contacts as a SMT component.

摘要翻译： 光电子半导体部件适用于光电子半导体的表面安装部件。 光电子半导体部件具有固定在芯片载体上的一个或多个半导体芯片。 芯片载体是引线框架的一部分，引线框架的另一部分形成有独立的连接部分作为半导体芯片的接触。 封装体以半导体芯片为中心，并且环绕芯片载体和独立连接部分的一部分，以形成用于反射或接收半导体芯片的辐射的环形椭圆体。 封装体具有凹部和填充凹部的窗口部分。 窗口部分由用于变换半导体芯片的光学特性的材料组成。 芯片载体和独立连接部分的一部分延伸出封装体以形成作为SMT部件的外部触点。

公开(公告)号：US08421336B2

公开(公告)日：2013-04-16

申请号：US13427670

申请日：2012-03-22

申请人： Tseng-Guang Tsai ,  Jia-Min Shieh ,  Chih-Chiang Kao ,  Hung-Yuan Su

发明人： Tseng-Guang Tsai ,  Jia-Min Shieh ,  Chih-Chiang Kao ,  Hung-Yuan Su

IPC分类号： H01J1/62

CPC分类号： H01L33/501

摘要： A manufacturing method of an LED device includes the following steps. First, a substrate and at least one LED disposed on the substrate are provided. Next, a porous material layer having a plurality of pores is formed on a surface of the LED. Finally, a plurality of nanocrystals are formed in the pores to construct a phosphor layer on the surface of the LED.

摘要翻译： LED装置的制造方法包括以下步骤。 首先，设置基板和设置在基板上的至少一个LED。 接下来，在LED的表面上形成具有多个孔的多孔材料层。 最后，在孔中形成多个纳米晶体，以在LED的表面上构建荧光体层。

公开(公告)号：US07750362B2

公开(公告)日：2010-07-06

申请号：US12230193

申请日：2008-08-26

申请人： Chien-Lin Chang Chien ,  Hung-Yuan Su ,  Chen-Hsiu Lin

发明人： Chien-Lin Chang Chien ,  Hung-Yuan Su ,  Chen-Hsiu Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor light-emitting device includes: a hollow body including a bottom wall and a surrounding wall cooperating with the bottom wall to define an encapsulant-receiving recess, the bottom wall being formed with a through-hole, the surrounding wall having a diffuse surface that surrounds the encapsulant-receiving recess; a heat-dissipating body provided on a bottom side of the bottom wall and covering the through-hole in the bottom wall; a light-emitting chip disposed in the through-hole in the bottom wall; a transparent encapsulant filling the encapsulant-receiving recess and the through-hole; and a wavelength-converting layer covering the transparent encapsulant.

摘要翻译： 一种半导体发光装置，包括：中空体，其包括与所述底壁配合的底壁和周壁，以限定密封剂容纳凹部，所述底壁形成有通孔，所述周壁具有漫射面 围绕所述密封剂容纳凹部; 散热体，设置在底壁的底侧并覆盖底壁中的通孔; 布置在底壁中的通孔中的发光芯片; 填充所述密封剂容纳凹部和所述通孔的透明密封剂; 以及覆盖透明密封剂的波长转换层。

公开(公告)号：US07259401B2

公开(公告)日：2007-08-21

申请号：US10923025

申请日：2004-08-23

申请人： Daw-Heng Wong ,  Hung-Yuan Su

发明人： Daw-Heng Wong ,  Hung-Yuan Su

IPC分类号： H01L29/22 ,  H01L29/24

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A reflection-type optoelectronic semiconductor device has an LED chip disposed on a first conducting wire portion, a second conducting wire portion connected to the LED chip via a connection wire, a packaging body for sealing the LED chip and part of the first conducting wire portion and the second conducting wire portion, a reflecting face disposed in an opposite direction of a light emission face of the LED chip and surrounding the packaging body, and an optical spectrum conversion layer coated onto the packaging body. A primary light emitted by the LED chip is reflected to the optical spectrum conversion layer by the reflecting face to undergo light excitation for producing a secondary light. The primary light and the secondary light are combined to generate a mixed light. A lens can be placed in the travel direction of the mixed light to change the distribution of the mixed light.

摘要翻译： 反射型光电子半导体器件具有设置在第一导线部分上的LED芯片，经由连接线连接到LED芯片的第二导线部分，用于密封LED芯片的封装体和第一导线部分的一部分 所述第二导线部，与所述LED芯片的发光面相反的方向配置并包围所述封装体的反射面以及涂覆在所述封装体上的光谱转换层。 由LED芯片发射的初级光被反射面反射到光谱转换层，以进行用于产生二次光的光激发。 初级光和次级光被组合以产生混合光。 可以将透镜放置在混合光的行进方向上以改变混合光的分布。

公开(公告)号：US08063411B2

公开(公告)日：2011-11-22

申请号：US12849491

申请日：2010-08-03

申请人： Chia-Hao Wu ,  Hung-Yuan Su

发明人： Chia-Hao Wu ,  Hung-Yuan Su

IPC分类号： H01L29/74

CPC分类号： H01L33/508 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0091

摘要： A transparent layer and a phosphor layer are covered on the LED chip for increasing light emission efficiency and evenness of the LED. Based on angle-dependent emission strength of the LED chip, the phosphor layer is designed with different thickness or contains different phosphor powder concentration in different section. The lights emitted with different strength from different angle of the LED chip are transformed into uniform compound lights after passing through the phosphor layer that has different thickness or phosphor powder concentration. Micro structures capable of destroying the full reflection occurred on the incident lights are further configured on both the inner and outer surfaces of the phosphor layer to increase the light emission efficiency.

摘要翻译： 在LED芯片上覆盖透明层和荧光体层，以提高LED的发光效率和均匀性。 基于LED芯片的角度依赖性发射强度，荧光体层设计成不同的厚度或不同部分含有不同的荧光粉浓度。 从LED芯片的不同角度发出的不同强度的光在通过具有不同厚度或荧光粉浓度的荧光体层后，转变为均匀的复合光。 在荧光体层的内表面和外表面上进一步配置能够破坏入射光全反射的微结构，以提高发光效率。