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公开(公告)号：US09754723B2
公开(公告)日：2017-09-05
申请号：US14485437
申请日：2014-09-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byeong Cheol Moon , Jae Hoon Lee , Myeong Gi Kim , Jin Woo Han , Soo Hwan Son
IPC: H05K7/10 , H05K7/12 , H01G4/40 , H01G4/30 , H05K1/18 , H01F27/02 , H01F27/29 , H01F27/40 , H01F27/28 , H05K1/02
CPC classification number: H01G4/40 , H01F27/022 , H01F27/292 , H01F27/40 , H01F2027/2809 , H01G2/065 , H01G2/22 , H01G4/232 , H01G4/30 , H05K1/0231 , H05K1/0233 , H05K1/181 , H05K2201/10015 , H05K2201/1003 , Y02P70/611
Abstract: A composite electronic component may include a composite body including a capacitor and an inductor coupled to each other; an input terminal formed on a first end surface of the composite body and connected to the coil part of the inductor; an output terminal including a first output terminal formed on a second end surface of the composite body and connected to the coil part of the inductor and a second output terminal formed on the second end surface of the composite body and connected to the first internal electrode of the capacitor; and a ground terminal formed on a first end surface of the capacitor in the composite body. The capacitor may be coupled to a side surface of the inductor, and the sum of ratio of lengths of a short axis to a long axis of the coil part is 0.7 to 1.0.
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公开(公告)号：US09349512B2
公开(公告)日：2016-05-24
申请号：US13633544
申请日：2012-10-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Woo Hahn , Myeong Gi Kim , Sung Yong An , Ic Seob Kim , Byeong Cheol Moon
CPC classification number: H01F3/14 , H01F17/0013 , H01F17/0033 , H01F27/292
Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 μm≦Tg≦7 μm, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.
Abstract translation: 提供一种多层芯片电子部件，其包括：包括2016尺寸以下的多层磁性层的多层体; 导电图案在堆叠方向上电连接以形成多层体内的线圈图案; 以及形成在多层磁性层之间的层叠多层体的层叠表面上并且具有在1μm和n1E范围内的厚度Tg的非磁隙层; Tg＆lt; 1lE;7μm，其中非磁隙层数 可以具有在磁性层中的至少四层之间的范围内的间隙层的数量和线圈图案的匝数。
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公开(公告)号：US12260983B2
公开(公告)日：2025-03-25
申请号：US17209458
申请日：2021-03-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Hui Li , Byung Soo Kang , Ju Hwan Yang , Seung Min Lee , Yoon Mi Cha , Boum Seock Kim , Byeong Cheol Moon
Abstract: A coil component is disposed. The coil component according to an aspect of the present disclosure includes: a body; a coil portion disposed in the body; an external electrode portion including a first metal layer disposed on the body, and connected to the coil portion; and a surface insulating layer disposed on the body to cover a first region of the first metal layer and open a second region of the first metal layer. Surface roughness of an interface of the first region of the first metal layer with the surface insulating layer is higher than surface roughness of an outer surface of the second region of the first metal layer.
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公开(公告)号：US20240404746A1
公开(公告)日：2024-12-05
申请号：US18444559
申请日：2024-02-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Jin Lee , Dong Hwan Lee , Byeong Cheol Moon , Boum Seock Kim
Abstract: According to an aspect of the present disclosure, a coil component includes a body including a first surface and a second surface opposing each other in a first direction, and a slit disposed in the first surface; a coil disposed in the body and including a coil portion having at least one turn, a lead-out portion extending from an outermost turn of the coil portion, and a protrusion extending to the slit; and an external electrode disposed on the slit to be in contact with the protrusion.
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公开(公告)号：US12062481B2
公开(公告)日：2024-08-13
申请号：US17186376
申请日：2021-02-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Soo Kang , Ju Hwan Yang , Yong Hui Li , Byeong Cheol Moon , Boum Seock Kim
CPC classification number: H01F27/29 , H01F27/255 , H01F27/2804 , H01F27/32 , H01F41/12 , H01F2027/2809
Abstract: A coil component includes a body; a support substrate disposed in the body; a coil portion including a first coil pattern, a first lead-out pattern, and a second lead-out pattern; a first slit portion defined at a corner portion between the first end surface and the first surface, and a second slit portion defined at a corner portion between the second end surface and the first surface, the first and second slit portions exposing the first and second lead-out patterns; a first external electrode and a second external electrode spaced apart from each other on the first surface, and respectively extending onto the first and second slit portions to be connected to the first and second lead-out patterns; and a surface insulating layer disposed on the first and second slit portions to cover a portion of the first and second external electrodes and extending onto the first surface.
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Patent Agency Ranking
公开(公告)号：US11942264B2
公开(公告)日：2024-03-26
申请号：US17114987
申请日：2020-12-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： No Il Park , Byung Soo Kang , Seung Mo Lim , Byeong Cheol Moon , Boum Seock Kim , Yong Hui Li , Seung Min Lee
CPC classification number: H01F27/29 , H01F27/2804 , H01F27/323 , H01F41/041 , H01F41/122 , H01F2027/2809
Abstract: A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.
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公开(公告)号：US11923124B2
公开(公告)日：2024-03-05
申请号：US16530391
申请日：2019-08-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Hwan Yang , Jae Hun Kim , Joung Gul Ryu , Byung Soo Kang , Byeong Cheol Moon , Jeong Gu Yeo
IPC: H01F27/28
CPC classification number: H01F27/2804 , H01F2027/2819
Abstract: A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.
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公开(公告)号：US11901112B2
公开(公告)日：2024-02-13
申请号：US16991587
申请日：2020-08-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Hwan Yang , Seung Mo Lim , No Il Park , Byung Soo Kang , Byeong Cheol Moon
CPC classification number: H01F27/292 , H01F17/0013 , H01F17/04 , H01F27/255 , H01F27/324 , H01F2017/048
Abstract: A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body including the support substrate and the coil portion disposed therein, an external electrode disposed on a surface of the body and connected to the coil portion, and an insulating layer disposed in a region of the surface of the body other than a region in which the external electrode is disposed, wherein an average roughness (Ra) of the surface of the body in contact with the external electrode is different from an average roughness (Ra) of the surface of the body in contact with the insulating layer.
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公开(公告)号：US11881346B2
公开(公告)日：2024-01-23
申请号：US16530407
申请日：2019-08-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： In Young Kang , Byeong Cheol Moon , Doo Ho Park , Tai Yon Cho , No Il Park , Seung Mo Lim , Tae Jun Choi , Jeong Hoon Ryou
CPC classification number: H01F27/29 , H01F27/2823
Abstract: A coil electronic component includes a body having one surface and the other surface, opposing each other, and a plurality of wall surfaces respectively connecting the one surface and the other surface of the body, first and second recesses, respectively formed in both end surfaces of the body opposing each other among the plurality of wall surfaces of the body, extending to the one surface of the body, a wound coil, embedded in the body, including first and second lead-out portions, a first external electrode disposed along an internal wall of the first recess and the one surface of the body and connected to the first lead-out portion, and a second external electrode disposed along an internal wall of the second recess and the one surface of the body and connected to the first lead-out portion. The first and second external electrodes are spaced apart from each other.
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公开(公告)号：US20240006118A1
公开(公告)日：2024-01-04
申请号：US18369314
申请日：2023-09-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hyung Jung , Byeong Cheol Moon , Joung Gul Ryu
CPC classification number: H01F27/327 , H01F27/2847 , H01F27/324 , H01F17/02 , H01F27/2804 , H01F27/292 , H01F17/0006
Abstract: A coil component includes a nonmagnetic body having a cured product of a polymer resin, an insulating substrate embedded in the body and having a thickness of 30 μm or less, a coil portion including first and second coil patterns respectively disposed on first and second opposing surfaces of the insulating substrate, and first and second external electrodes disposed on a surface of the body to be connected to each of the first and second coil patterns exposed to the surface of the body.
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