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公开(公告)号：US20200105472A1
公开(公告)日：2020-04-02
申请号：US16198473
申请日：2018-11-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Woo SONG , Min Gon LEE , Sang Soo PARK , Jin Man JUNG , Woo Chul SHIN , Jin Kyung JOO
Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).
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公开(公告)号：US20180090275A1
公开(公告)日：2018-03-29
申请号：US15484311
申请日：2017-04-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Won Young LEE , Sung Kwon AN , Taek Jung LEE , Jin Kyung JOO , Hyo Youn LEE
CPC classification number: H01G4/30 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/228 , H01G4/232 , H05K1/181 , H05K2201/10015 , Y02P70/611
Abstract: A multilayer capacitor includes a body including dielectric layers, and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, first and second groove parts formed in external surfaces of the body in a first direction in which the dielectric layers are stacked, having at least one corner, and contacting the first and second internal electrodes, respectively, and first and second connection electrodes disposed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.
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公开(公告)号：US20180068796A1
公开(公告)日：2018-03-08
申请号：US15495121
申请日：2017-04-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Won SEO , Jin Kyung JOO , Ik Hwan CHANG , Jin Woo CHUN , Jin Man JUNG
CPC classification number: H01G4/30 , H01G4/005 , H01G4/008 , H01G4/12 , H01G4/228 , H01G4/232 , H05K1/111 , H05K1/181 , H05K2201/10015
Abstract: A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. A first via electrode penetrates through the plurality of first internal electrodes and is exposed at the first surface of the capacitor body. A second via electrode penetrates through the plurality of second internal electrodes, is exposed at the first surface of the capacitor body, and is spaced apart from the first via electrode. First and second external electrodes are on a first surface of the capacitor body, spaced apart from each other, and respectively connected to end portions of the first and second via electrodes. The first and second external electrodes each include a nickel (Ni) layer on the first surface of the capacitor body and a gold (Au) plating layer on the nickel layer.
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公开(公告)号：US20180068793A1
公开(公告)日：2018-03-08
申请号：US15485555
申请日：2017-04-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Taek Jung LEE , Hyo Youn LEE , Won Young LEE , Sung Kwon AN , Jae Yeol CHOI , Jin Kyung JOO
Abstract: A capacitor component includes a body, a plurality of internal electrodes disposed in the body, connection electrodes extended in a thickness direction of the body and electrically connected to the plurality of internal electrodes, upper electrodes disposed on an upper surface of the body and electrically connected to the connection electrodes, and lower electrodes disposed on a lower surface of the body and electrically connected to the connection electrodes A thickness of the upper electrodes is different from that of the lower electrodes, and an area of contact between the upper electrodes and the body is different from an area of contact between the lower electrodes and the body.
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公开(公告)号：US20180019064A1
公开(公告)日：2018-01-18
申请号：US15595070
申请日：2017-05-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Ok HAN , Jin Kyung JOO , Jin Ju PARK , Jae Yeol CHOI , Hong Seok KIM
CPC classification number: H01G4/40 , H01G2/06 , H01G4/008 , H01G4/0085 , H01G4/012 , H01G4/018 , H01G4/232 , H01G4/30 , H01L21/3043 , H05K3/3431 , H05K2201/10015
Abstract: A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively; and first and second via electrodes formed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.
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Patent Agency Ranking
公开(公告)号：US20160225524A1
公开(公告)日：2016-08-04
申请号：US14981650
申请日：2015-12-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Kyung JOO , Byoung Hwa LEE , Tae Ho KIM , Doo Young KIM , Taek Jung LEE , Sin Il GU
CPC classification number: H01G4/12 , H01G4/008 , H01G4/1209
Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a multilayer structure in which dielectric layers containing an alumina base material and internal electrode layers containing nickel are alternately stacked, plasticizing the multilayer structure by heating to a temperature of 500 to 900° C. at a first heating rate under a first reducing atmosphere at a first hydrogen concentration, sintering the multilayer structure by heating to a temperature of 1,250° C. to 1,400° C. at a second heating rate greater than the first heating rate under a second reducing atmosphere at a second hydrogen concentration higher than the first hydrogen concentration, and then maintaining the temperature of 1,250° C. to 1,400° C., and annealing the multilayer structure by cooling the multilayer structure to room temperature at a first cooling rate.
Abstract translation: 一种制造多层陶瓷电子部件的方法包括制备多层结构，其中包含氧化铝基底材料和含有镍的内部电极层的电介质层交替堆叠，通过加热至500至900℃的温度来增塑多层结构 在第一氢气浓度的第一还原气氛下的第一加热速率，通过在第二还原气氛下以大于第一加热速率的第二加热速率加热至1250℃至1400℃的温度来烧结多层结构 在比第一氢浓度高的第二氢浓度下，然后将温度保持在1250℃至1400℃，并通过以多个第一冷却速率将多层结构冷却至室温来退火多层结构。
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公开(公告)号：US20210166880A1
公开(公告)日：2021-06-03
申请号：US17177343
申请日：2021-02-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Gon LEE , Seung Woo SONG , Jae Yeol CHOI , Jin Kyung JOO , Taek Jung LEE , Jin Man JUNG
Abstract: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.
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公开(公告)号：US20210057158A1
公开(公告)日：2021-02-25
申请号：US16817783
申请日：2020-03-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Gon LEE , Taek Jung LEE , Jin Man JUNG , Jin Kyung JOO , Ji Hong JO
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second through electrodes penetrating the body, connected to the first and second internal electrodes, respectively, and including nickel; first and second external electrodes, and connected to the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes, and connected to the second through electrode. Each of the first to fourth external electrodes includes a sintered electrode including nickel, and a first plating layer and a second plating layer stacked on the sintered electrode in order.
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公开(公告)号：US20210005384A1
公开(公告)日：2021-01-07
申请号：US16809917
申请日：2020-03-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Taek Jung LEE , Min Gon LEE , Jin Kyung JOO , Ji Hong JO , Jae Yeol CHOI
Abstract: A multilayer ceramic capacitor has a body including first and second internal electrodes laminated with a dielectric layer interposed therebetween, and having fifth and sixth surfaces opposing each other, third and fourth surfaces opposing each other, and first and second surfaces opposing each other. A first through-electrode penetrates through the body to be connected to the first internal electrode, and a second through-electrode penetrates through the body to be connected to the second internal electrode. First and second external electrodes are disposed on the first and second surfaces, respectively, and third and fourth external electrodes are disposed on the first and second surfaces, respectively, to be spaced apart from the first and second external electrodes. Each of the first to fourth external electrodes is a respective sintered electrode including nickel.
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公开(公告)号：US20200234880A1
公开(公告)日：2020-07-23
申请号：US16537845
申请日：2019-08-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yeang Jun KIM , Gam Woo KIM , Jae Won KIM , Jin Kyung JOO
Abstract: A multilayer capacitor includes a capacitor body including first and sixth surfaces; including an active region including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and cover regions disposed on an upper surface and a lower surface of the active region; and having one end of each of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; and first and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body. Each of the cover regions has a plurality of holes.
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