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公开(公告)号：US10212803B2
公开(公告)日：2019-02-19
申请号：US15198110
申请日：2016-06-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Myung Sam Kang , Jung Han Lee , Young Gwan Ko
Abstract: A circuit board includes an insulating part including insulating layers, metal layers disposed on the insulating layers, vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure including a thermally conductive material, at least a part of the thermally conductive structure being inserted into the insulating part, a first via having one surface contacting the first thermally conductive structure, a first metal pattern contacting another surface of the first via, a first bonding member connected to the first metal pattern, and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part, the pads being at least in a first region and a second region having a higher temperature than the first region.
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Patent Agency Ranking
公开(公告)号：US20180130595A1
公开(公告)日：2018-05-10
申请号：US15642114
申请日：2017-07-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Woo Choi , Jin Ho Hong , Il Jong Seo , Sa Yong Lee , Myung Sam Kang , Tae Hong Min
CPC classification number: H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F19/04 , H01F27/292 , H01F27/303 , H01F41/041 , H01F2017/004 , H01F2027/2809
Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.
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公开(公告)号：US20240057251A1
公开(公告)日：2024-02-15
申请号：US18113834
申请日：2023-02-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Eun Su Kwon
IPC: H05K1/02
CPC classification number: H05K1/0296 , H05K2201/10227 , H05K2201/10984
Abstract: A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.
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公开(公告)号：US11445598B2
公开(公告)日：2022-09-13
申请号：US17068290
申请日：2020-10-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Ju Ho Kim
Abstract: A printed circuit board has a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body. The first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers. The second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers, and each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers.
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公开(公告)号：US20210076492A1
公开(公告)日：2021-03-11
申请号：US16794741
申请日：2020-02-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Ju Ho Kim
Abstract: A printed circuit board and an antenna module including the same are provided. The printed circuit board includes a core layer; a first build-up structure disposed on an upper side of the core layer, including first insulating layers and first bonding layers, alternately stacked, and further including first wiring layers disposed on upper surfaces of the first insulating layers, respectively, and embedded in the first bonding layers, respectively; and a second build-up structure disposed on a lower side of the core layer, including second insulating layers and second bonding layers, alternately stacked, and further including second wiring layers disposed on lower surfaces of the second insulating layers, respectively, and embedded in the second bonding layers, respectively. The printed circuit board has a through-portion penetrating through the core layer and the second build-up structure, and has a region in which the through-portion is disposed as a flexible region.
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公开(公告)号：US20150107880A1
公开(公告)日：2015-04-23
申请号：US14319743
申请日：2014-06-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Jin KIM , Hyo Seung Nam , Tae Hong Min , Sang Hoon Kim , Suk Hyeon Cho , Jung Han Lee
CPC classification number: H05K1/185 , H05K3/429 , H05K3/4644 , H05K3/4697 , H05K2201/096 , H05K2201/09709 , H05K2201/0979
Abstract: Disclosed herein is a multilayer printed circuit board. The multilayer printed circuit board according to the present invention includes: a stack via stacked in an upper portion of a core layer; staggered vias formed at both sides of the stack via and stacked on the core layer; and a solder resist layer stacked in a lower portion of the core layer and stacked on an insulating film except for open regions of the stack via and the staggered vias, such that the plurality of vias formed in the staggered via may increase rigidity to prevent warpage of the multilayer printed circuit board from being generated.
Abstract translation: 这里公开了一种多层印刷电路板。 根据本发明的多层印刷电路板包括：堆叠体，堆叠在芯层的上部; 形成在堆叠的两侧的交错通孔并堆叠在芯层上; 以及堆叠在芯层的下部并且堆叠在除了堆叠通孔的开口区域和交错通孔之外的绝缘膜上的阻焊层，使得形成在交错通孔中的多个通孔可以增加刚性以防止翘曲 的多层印刷电路板。
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