公开(公告)号：US11605584B2

公开(公告)日：2023-03-14

申请号：US17329256

申请日：2021-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Lim Suk ,  Keung Beum Kim ,  Dongkyu Kim ,  Minjung Kim ,  Seokhyun Lee

IPC: H01L23/48 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor package includes a redistribution substrate and a semiconductor chip thereon. The redistribution substrate includes a ground under-bump pattern, signal under-bump patterns laterally spaced apart from the ground under-bump pattern, first signal line patterns disposed on the signal under-bump patterns and coupled to corresponding signal under-bump patterns, and a first ground pattern coupled to the ground under-bump pattern and laterally spaced apart from the first signal line pattern. Each of the signal and ground under-bump patterns includes a first part and a second part formed on the first part and that is wider than the first part. The second part of the ground under-bump pattern is wider than the second part of the signal under-bump pattern. The ground under-bump pattern vertically overlaps the first signal line patterns. The first ground pattern does not vertically overlap the signal under-bump patterns.

公开(公告)号：US20220302002A1

公开(公告)日：2022-09-22

申请号：US17498893

申请日：2021-10-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongkyu Kim ,  Minjung Kim ,  Kyounglim Suk ,  Seokhyun Lee

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L23/538 ,  H01L23/29

Abstract: A semiconductor package includes a redistribution substrate having first and second surfaces opposing one another, a first semiconductor chip on the first surface of the redistribution substrate, a passive device and a metal post on the second surface of the redistribution substrate and electrically connected to the redistribution pattern, a second encapsulant encapsulating at least side surfaces of the passive device and the metal post, a second insulating layer on a lower surface of the metal post and a lower surface of the second encapsulant, and having an opening exposing at least a portion of the lower surface of the metal post, and a connection bump filling the opening of the second insulating layer and in direct contact with the lower surface of the exposed metal post, wherein the metal post has a height greater than a height of each of the redistribution pattern and the redistribution via.

公开(公告)号：US11427759B2

公开(公告)日：2022-08-30

申请号：US16946495

申请日：2020-06-24

Applicant: Samsung Electronics Co., Ltd. ,  DONGWOO FINE-CHEM Co., Ltd.

Inventor： Kihun Song ,  Jungmin Oh ,  Hyosan Lee ,  Hyojoong Yoon ,  Minjung Kim ,  Jongwook Baek

IPC: C09K13/06 ,  H01L27/108 ,  H01L21/3213

Abstract: Metal-containing film etchant compositions may include hydrogen peroxide (H2O2), a phosphoric acid compound, a heterocyclic organic amine compound including at least one heteroatom in a ring, and water. Manufacturing methods of an integrated circuit (IC) may include performing a dry etch process on a conductive structure including a metal nitride film and a metal film to form a conductive pattern intermediate product and performing a wet etch process on the conductive pattern intermediate product using an etching atmosphere providing a higher etch selectivity with respect to the metal nitride film than the metal film. The etching atmosphere may include an etchant composition including hydrogen peroxide, a phosphoric acid compound, a heterocyclic organic amine compound including at least one heteroatom in a ring, and water.

公开(公告)号：US11190482B2

公开(公告)日：2021-11-30

申请号：US16842170

申请日：2020-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jookwan Lee ,  Hong Kim ,  Hansung Leem ,  Junsuk Kim ,  Hyejeong Kim ,  Minjung Kim

IPC: H04L12/00 ,  H04L29/12

Abstract: An electronic device includes a communication processor; a processor connected to the communication processor; and a memory connected to the processor and the communication processor. The memory stores a domain name system (DNS) table, first instructions that, when executed, cause the processor to: generate a first DNS query message including a domain address based on execution of a networking service; and deliver the first DNS query message to the communication processor, and second instructions that, when executed, cause the communication processor to update the DNS table by periodically receiving a first DNS response message including an IP address corresponding to the domain address, as a response to the first DNS query message, delivering the first DNS response message to the processor; transmitting a second DNS query message including the domain address to the network, and receiving a second DNS response message, as a response to the second DNS query message.

公开(公告)号：US11102137B2

公开(公告)日：2021-08-24

申请号：US16511538

申请日：2019-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinmo Sung ,  Joonyoung Heo ,  Mooyoung Kim ,  Minjung Kim

IPC: H04L12/835 ,  H04L29/06 ,  H04W28/06 ,  H04L12/805 ,  H04L12/883

Abstract: Disclosed is an electronic device including a wireless communication modem, at least one processor connected with the communication modem and comprising a plurality of cores, and a nonvolatile memory operatively connected with the processor, wherein the nonvolatile memory stores instructions that cause a first core of the processor to receive first data packets having a first size from the wireless communication modem, and to transmit at least a portion of the first data packets to a second core of the processor, and that cause the second core to receive the at least a portion of the first data packets from the first core, to merge the at least a portion of the first data packets into a plurality of second data packets having sizes larger than the first size, based at least in part on a type of the first data packets, and to transmit the second data packets to at least one other core of the processor than the first core and the second core.

公开(公告)号：US10971053B2

公开(公告)日：2021-04-06

申请号：US16733768

申请日：2020-01-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungjun Lee ,  Byeongjun Mun ,  Jinyoung Ahn ,  Sanghyun Lee ,  Minjung Kim

IPC: G09G3/20 ,  G02B27/01

Abstract: An electronic device for controlling a display based on luminance of external light and a method therefor are provided. The electronic device includes a display, a sensor, a memory, and a processor operably connected to the display, the sensor, and the memory. The processor is configured to identify first information regarding external light directed to the electronic device, acquire first frame data based on the identified first information and second information regarding the user, display the first frame data on the display, identify second frame data distinguished from the first frame data from an application stored in the memory while the first frame data is outputted on the display, adjust color of at least one of multiple pixels included in the second frame data at least partially based on the first frame data, and control the display based on the first frame data or the adjusted second frame data.

公开(公告)号：US10674555B2

公开(公告)日：2020-06-02

申请号：US15976228

申请日：2018-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyejung Bang ,  Bumjib Kim ,  Hyunah Oh ,  Dongjea Jung ,  Namju Cho ,  Buseop Jung ,  Bokun Choi ,  Doosuk Kang ,  Minjung Kim

IPC: H04W4/00 ,  H04W76/14 ,  H04W8/00 ,  H04W4/08 ,  H04W76/23 ,  H04W84/12 ,  H04W84/18

Abstract: An electronic device and a method for forming a Wi-Fi direct group thereof are provided. The electronic device may include a housing, a wireless communication circuit, at least one processor, and a memory. The memory may cause the at least one processor to receive a first list of wireless channels for a direct connection from a first external device, establish, as a group owner, a first wireless connection with the first external device acting as a group client by using a first channel selected from the first list, listen for a probe request over a second channel every selected time period, receive the probe request from a second external device during the selected time period through the second channel, transmit a probe response to the second external device, receive a second list of wireless channels for a direct connection from the second external device, and select a third channel.

公开(公告)号：US12293989B2

公开(公告)日：2025-05-06

申请号：US17680857

申请日：2022-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minjung Kim ,  Dongkyu Kim ,  Jongyoun Kim ,  Seokhyun Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/48 ,  H01L23/498 ,  H01L25/10

Abstract: A semiconductor package includes a first redistribution substrate, a lower semiconductor chip on the first redistribution substrate and a through via therein, a first lower conductive structure and a second lower conductive structure that are on the first redistribution substrate and are laterally spaced apart from the lower semiconductor chip, an upper semiconductor chip on the lower semiconductor chip and the second lower conductive structure and coupled to the through via and the second lower conductive structure, and an upper conductive structure on the first lower conductive structure. A width of the second lower conductive structure is greater than a width of the through via.

公开(公告)号：US12261104B2

公开(公告)日：2025-03-25

申请号：US17670635

申请日：2022-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjeong Hwang ,  Dongkyu Kim ,  Minjung Kim ,  Yeonho Jang

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor package including a redistribution substrate extending in a first direction and a second direction perpendicular to the first direction, a semiconductor chip mounted on a top surface of the redistribution substrate, and an outer terminal on a bottom surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern, a redistribution insulating layer covering a top surface and a side surface of the under-bump pattern, a protection pattern interposed between the top surface of the under-bump pattern and the redistribution insulating layer, and interposed between the side surface of the under-bump pattern and the redistribution insulating layer, and a redistribution pattern on the under-bump pattern. The outer terminal may be disposed on a bottom surface of the under-bump pattern.

公开(公告)号：US11955499B2

公开(公告)日：2024-04-09

申请号：US17363931

申请日：2021-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minjung Kim ,  Dongkyu Kim ,  Kyounglim Suk ,  Jaegwon Jang ,  Hyeonjeong Hwang

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14634 ,  H01L24/16 ,  H01L27/14621 ,  H01L27/14625 ,  H01L2224/16227

Abstract: An image sensor package includes a glass substrate configured to focus incident light, a first redistribution layer and a second redistribution layer both disposed under the glass substrate while being horizontally spaced apart from each other by a first distance, an image sensor disposed such that an upper surface thereof is vertically spaced apart from both a lower surface of the first redistribution layer and a lower surface of the second redistribution layer by a second distance, and a first connector that connects both the first redistribution layer and the second redistribution layer to the image sensor. The thickness of the glass substrate is 0.6 to 0.8 mm. The first distance is smaller than the horizontal length of the image sensor by 50 μm to 1 mm. The second distance is equal to or less than 0.1 mm.