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公开(公告)号:US20210325517A1
公开(公告)日:2021-10-21
申请号:US17360775
申请日:2021-06-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junghyun Park , Jungwoo Kim , Byunggil Jeong , Changgyun Shin , Byounglyong Choi
Abstract: A beam scanning apparatus includes a light source configured to emit light, and a reflective phased array device configured to reflect the light emitted from the light source and incident on the reflective phased array device, and electrically adjust a reflection angle of the reflected light reflected by the reflective phased array device, wherein the light source and the reflective phased array device are disposed such the light is incident on the reflective phased array device at an incidence angle with respect to a normal of a reflective surface of the reflective phased array device.
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公开(公告)号:US10788725B2
公开(公告)日:2020-09-29
申请号:US15700391
申请日:2017-09-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Duhyun Lee , Changgyun Shin , Jisoo Kyoung , Byounglyong Choi
Abstract: A phase modulation active device and a method of driving the phase modulation active device are provided. The phase modulation active device includes channels independently modulating a phase of incident light. The method includes selecting a first phase value and a second phase value to be used for the channels, setting a binary phase profile by allocating the selected first phase value or the selected second phase value to each of the channels quasi-periodically, in a sequence in which the channels are arranged, and driving the phase modulation active device, based on the set binary phase profile.
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公开(公告)号:US10705406B2
公开(公告)日:2020-07-07
申请号:US15815188
申请日:2017-11-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunil Kim , Jungwoo Kim , Duhyun Lee , Changgyun Shin , Byounglyong Choi
Abstract: A two-dimensional (2D) light modulating device may include a plurality of phase modulating elements and a circuit board. The plurality of phase modulating elements may include a meta surface having a nano-structure. The circuit board may be configured to independently control electrical signals that are respectively transmitted to the plurality of phase modulating elements. The circuit board may include a plurality of pixel circuit units. Each of the plurality of pixel circuit units may include a transistor and a capacitor.
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公开(公告)号:US20200012120A1
公开(公告)日:2020-01-09
申请号:US16557113
申请日:2019-08-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sunghyun Nam , Sookyoung Roh , Seokho Yun , Changgyun Shin , Hyungue Hong
Abstract: Color separation devices, and image sensors including the color separation devices and color filters, include at least two transparent bars that face each other with a gap therebetween. Mutually-facing surfaces of the at least two transparent bars are separated from each other by the gap such that the at least two transparent bars allow diffraction of visible light passing therebetween. The at least two transparent bars have a refractive index greater than a refractive index of a surrounding medium.
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公开(公告)号:US10483414B2
公开(公告)日:2019-11-19
申请号:US15830166
申请日:2017-12-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seunghoon Han , Lilong Shi , Kwanghee Lee , Changgyun Shin
IPC: H01L31/0232 , H01L27/146 , H01L27/30 , H01L51/42 , H01L31/103 , H01L31/101
Abstract: A stack-type image sensor may include a photodiode and a meta-filter. The photodiode may include a first photodiode configured to absorb first light of a first wavelength band and a second photodiode disposed on the first photodiode and configured to absorb second light of a second wavelength band. The meta-filter may include a first meta-filter disposed in a lower portion of the first photodiode and configured to reflect the first light of the first wavelength band to the first photodiode.
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公开(公告)号:US10254448B2
公开(公告)日:2019-04-09
申请号:US15194739
申请日:2016-06-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Duhyun Lee , Sunil Kim , Changgyun Shin , Jungwoo Kim , Chang bum Lee
Abstract: A light modulation device includes a dielectric antenna and a refractive-index-variable layer which faces the dielectric antenna and comprises a material having a refractive index that changes according to a signal. A light may be modulated, since resonance characteristics of the dielectric antenna are controlled according to a refractive-index change of the refractive-index-variable layer.
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公开(公告)号:US09356065B2
公开(公告)日:2016-05-31
申请号:US14596524
申请日:2015-01-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sunghyun Nam , Sookyoung Roh , Seokho Yun , Changgyun Shin , Hyungue Hong
IPC: H01L31/0232 , H01L27/146 , H01L31/0216
CPC classification number: H01L27/1463 , H01L27/14603 , H01L27/14605 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14645 , H01L31/02162
Abstract: An image sensor includes a first pixel row including a plurality of first pixels configured to sense first wavelength light, the first wavelength light having a first wavelength, a second pixel row adjacent to the first pixel row, the second pixel row including a plurality of second pixels configured to sense second wavelength light and a plurality of third pixels configured to sense third wavelength light, the plurality of second pixels and the plurality of third pixels being alternately arranged, the second wavelength light having a second wavelength and the third wavelength light having a third wavelength and a plurality of first color separation elements in the plurality of second pixels, respectively, the plurality of separation elements configured to change a spectrum distribution of incident light.
Abstract translation: 图像传感器包括:第一像素行,包括被配置为感测第一波长光的多个第一像素,具有第一波长的第一波长光,与第一像素行相邻的第二像素行,第二像素行包括多个第二波长 被配置为感测第二波长光的像素和被配置为感测第三波长光的多个第三像素,所述多个第二像素和所述多个第三像素被交替布置,所述第二波长光具有第二波长,并且所述第三波长光具有 第三波长和多个第二像素中的多个第一颜色分离元件,所述多个分离元件被配置为改变入射光的光谱分布。
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公开(公告)号:US12032232B2
公开(公告)日:2024-07-09
申请号:US18307080
申请日:2023-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongsik Shim , Changgyun Shin , Changbum Lee
CPC classification number: G02F1/025 , G01S7/4814 , H01S5/0071 , H01S5/0201 , H01S5/021 , H01S5/0218 , H01S5/0282 , H01S5/3013 , H01S5/4025 , H01S5/4075 , G02F1/292 , G02F2203/24 , G02F2203/50 , H01S5/005 , H01S2301/176
Abstract: Provided in a method of fabricating an optical element array including providing a silicon substrate, providing a first element layer on the silicon substrate, the first element layer including a plurality of passive optical elements, providing a plurality of semiconductor blocks on a compound semiconductor wafer, providing semiconductor dies by dicing the compound semiconductor wafer by the plurality of semiconductor blocks, and providing a second element layer by providing the semiconductor dies on the first element layer, each of the plurality of semiconductor blocks contacting at least one corresponding passive optical element from among the plurality of passive optical elements.
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公开(公告)号:US11947016B2
公开(公告)日:2024-04-02
申请号:US17021546
申请日:2020-09-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongjae Shin , Jisan Lee , Changgyun Shin , Inoh Hwang , Hyunil Byun
IPC: G01S17/04 , G01S17/894 , G01S7/4865
CPC classification number: G01S17/894 , G01S17/04 , G01S7/4865
Abstract: An object detection device may include: a converter configured to convert a transmission signal radiated towards an object into a digital transmission signal and a received signal reflected from the object into a digital received signal, according to a predetermined sampling period; and at least one processor configured to: interpolate between elements of the digital transmission signal and the digital received signal that have the predetermined sampling period, to obtain an interpolated transmission signal and an interpolated received signal; remove noise from each of the interpolated transmission signal and the interpolated received signal; generate a cross-correlation signal between the interpolated transmission signal from which the noise is removed and the interpolated received signal from which the noise is removed; and acquire a three-dimensional (3D) image of the object based on at least one peak value of the cross-correlation signal.
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公开(公告)号:US11675220B2
公开(公告)日:2023-06-13
申请号:US16426861
申请日:2019-05-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongsik Shim , Changgyun Shin , Changbum Lee
IPC: G02F1/025 , H01S5/02 , H01L21/304 , G01S7/481 , H01S5/028 , H01S5/30 , H01S5/00 , H01S5/40 , G02F1/29
CPC classification number: G02F1/025 , G01S7/4814 , H01S5/0071 , H01S5/0201 , H01S5/021 , H01S5/0218 , H01S5/0282 , H01S5/3013 , H01S5/4025 , H01S5/4075 , G02F1/292 , G02F2203/24 , G02F2203/50 , H01S5/005 , H01S2301/176
Abstract: Provided in a method of fabricating an optical element array including providing a silicon substrate, providing a first element layer on the silicon substrate, the first element layer including a plurality of passive optical elements, providing a plurality of semiconductor blocks on a compound semiconductor wafer, providing semiconductor dies by dicing the compound semiconductor wafer by the plurality of semiconductor blocks, and providing a second element layer by providing the semiconductor dies on the first element layer, each of the plurality of semiconductor blocks contacting at least one corresponding passive optical element from among the plurality of passive optical elements.
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