Abstract:
An integrated circuit includes a memory array and a read voltage regulator that generates read voltages from the memory array. The read voltage regulator includes a replica memory cell and the replica bitline current path. The replica memory cell is a replica of memory cells of the memory array. The replica bitline current path is a replica of current paths associated with deadlines of the memory array. The read voltage regulator generates a read voltage based on the current passed through the replica bitline current path. This read voltage is then supplied to the wordlines of the memory array during a read operation.
Abstract:
A voltage supply circuit and a method for controlling a voltage supply circuit are provided. The voltage supply circuit includes a positive charge pump stage that generates a positive voltage and a negative charge pump stage that generates a negative voltage. The voltage supply circuit also includes a control stage that compares a voltage representative of the negative voltage with a reference voltage and causes a slope of the positive voltage to decrease when the voltage representative of the negative voltage exceeds the reference voltage.
Abstract:
An integrated circuit includes an array of phase-change memory (PCM) cells, and bitlines coupled to the array of PCM cells. The integrated circuit also includes a first decoder circuit having a respective plurality of transistors having a first conductivity type being coupled together and to a given bitline from among the plurality thereof and configured to inject a program current pulse into a selected PCM cell. In addition, the integrated circuit includes a second decoder circuit having a plurality of transistors having a second conductivity type being coupled together and to the given bitline and configured to discharge the given bitline at an end of the program current pulse.
Abstract:
A voltage doubler circuit supports operation in a positive voltage boosting mode to positively boost voltage from a first node to a second node and operation in a negative voltage boosting mode to negatively boost voltage from the second node to the first node. The voltage doubler circuits receive two clock signals having different high voltage levels. A series of voltage doubler circuit are connected in a charge pump with controllable operation in the first and second modes. A connecting circuit interconnects the first and second nodes of the voltage doubler circuits to provide a first connection path, with a first input voltage, to support the positive voltage boosting mode operation and a second connection path, with a proper input voltage, to support the negative voltage boosting mode. A discharge circuit is provided to discharge the voltage doubler circuits when operation of the charge pump circuit is terminated.
Abstract:
An integrated circuit includes an array of phase-change memory (PCM) cells, and bitlines coupled to the array of PCM cells. The integrated circuit also includes a first decoder circuit having a respective plurality of transistors having a first conductivity type being coupled together and to a given bitline from among the plurality thereof and configured to inject a program current pulse into a selected PCM cell. In addition, the integrated circuit includes a second decoder circuit having a plurality of transistors having a second conductivity type being coupled together and to the given bitline and configured to discharge the given bitline at an end of the program current pulse.
Abstract:
A cascode voltage generating circuit and method are provided. The circuit includes four switching elements. In a high voltage operation mode, the first and second switching elements, respectively, couple a first intermediate voltage input node to a first intermediate voltage output node, and a second intermediate voltage input node to a second intermediate voltage output node. In a low voltage operation mode, the third switching element couples the first and second intermediate voltage input nodes to a ground reference voltage level, and the fourth switching element couples the first and second intermediate voltage output nodes to a supply voltage level.
Abstract:
A cascode voltage generating circuit and method are provided. The circuit includes four switching elements. In a high voltage operation mode, the first and second switching elements, respectively, couple a first intermediate voltage input node to a first intermediate voltage output node, and a second intermediate voltage input node to a second intermediate voltage output node. In a low voltage operation mode, the third switching element couples the first and second intermediate voltage input nodes to a ground reference voltage level, and the fourth switching element couples the first and second intermediate voltage output nodes to a supply voltage level.
Abstract:
A memory includes a column decoder performing at least two levels of decoding using a first level decoder that decodes between the column bit lines and first level decode lines and a second level decoder that decodes between the first level decode lines and second level decode lines. The second level decoder includes first transistors coupled between the first level decode lines and read output lines and second transistors coupled between the first level decode lines and write input lines. The first transistors have a first voltage rating and are driven by decode control signals referenced to a low supply voltage compatible with the first voltage rating. The second transistors have a second voltage rating, higher than the first voltage rating, and are driven by decode control signals referenced to a high supply voltage (in excess of the low supply voltage) compatible with the second voltage rating.
Abstract:
A memory includes an array of non-volatile memory cells. Each cell includes a select transistor in series connection with a floating gate transistor. The cells are configurable for operation in a programming mode and an erase mode. When in the programming mode, the gate terminal of the select transistor is driven with a negative bias voltage so as to bias that transistor in the accumulation region and eliminate sub-threshold leakage. When in the erase mode, the gate terminal of a pull-down transistor coupled to the memory cell is driven with a negative bias voltage so as to bias that transistor in the accumulation region and eliminate sub-threshold leakage.
Abstract:
A memory includes an array of non-volatile memory cells. Each cell includes a select transistor in series connection with a floating gate transistor. The cells are configurable for operation in a programming mode and an erase mode. When in the programming mode, the gate terminal of the select transistor is driven with a negative bias voltage so as to bias that transistor in the accumulation region and eliminate sub-threshold leakage. When in the erase mode, the gate terminal of a pull-down transistor coupled to the memory cell is driven with a negative bias voltage so as to bias that transistor in the accumulation region and eliminate sub-threshold leakage.