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公开(公告)号：US20210136921A1
公开(公告)日：2021-05-06
申请号：US16474705
申请日：2017-12-04
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Kou NOGUCHI , Hiroshi UEDA
Abstract: A method for manufacturing a printed circuit board according to one embodiment of the present invention includes a step of forming a resist pattern, and a step of forming a conductive pattern by using the resist pattern. The resist pattern has an acute angle portion in which an outer edge of a resist is bent to form an acute angle in a plan view. In a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge.
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公开(公告)号：US20210022254A1
公开(公告)日：2021-01-21
申请号：US16766884
申请日：2018-11-23
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Kou NOGUCHI , Hiroshi UEDA
Abstract: According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.
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公开(公告)号：US20190008037A1
公开(公告)日：2019-01-03
申请号：US15752359
申请日：2016-08-01
Inventor： Kohei OKAMOTO , Kousuke MIURA , Hiroshi UEDA , Takashi KASUGA , Kazuhiro MIYATA
Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.
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公开(公告)号：US20180371191A1
公开(公告)日：2018-12-27
申请号：US15777771
申请日：2016-11-22
Inventor： Kayo HASHIZUME , Yoshio OKA , Takashi KASUGA , Kentaro OKAMOTO , Atsushi KIMURA , Hiroshi UEDA
Abstract: A base film for a printed circuit board according to an embodiment of the present invention is a base film for a printed circuit board, the base film containing a polyimide as a main component. A ratio of a peak intensity around a wave number of 1705 cm−1 to a peak intensity around a wave number of 1494 cm−1 in an absorption intensity spectrum of a surface of the base film, the spectrum being measured at an angle of incidence of 45° by total reflection infrared absorption spectroscopy, is 0.50 or more and 1.10 or less. A substrate for a printed circuit board according to an embodiment of the present invention includes the base film for a printed circuit board and a metal layer stacked on the surface of the base film for a printed circuit board.
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公开(公告)号：US20180333739A1
公开(公告)日：2018-11-22
申请号：US15776813
申请日：2016-11-10
Inventor： Kazuhiro MIYATA , Takashi KASUGA , Yoshio OKA , Yasuhiro OKUDA , Jinjoo PARK , Hiroshi UEDA , Kohei OKAMOTO
CPC classification number: B05C5/0254 , B05C5/02 , B05C5/0208 , B05C11/10 , B05D1/26
Abstract: A coating device according to an aspect of the present invention includes a travel module that causes a strip-shaped sheet to travel in a longitudinal direction, a coating module that coats a surface of the strip-shaped sheet with ink while the strip-shaped sheet travels, and a supply module that supplies the ink to the coating module. The coating module includes a slot-type coating head that is disposed above the strip-shaped sheet so as to span the strip-shaped sheet in a width direction. The slot-type coating head includes an ink storage part that widens toward the strip-shaped sheet in cross-sectional view and an ink supply path that communicates with an upper part of the ink storage part.
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Patent Agency Ranking
26.发明申请公开(公告)号：US20180014403A1
公开(公告)日：2018-01-11
申请号：US15544961
申请日：2016-01-19
Inventor： Takashi KASUGA , Yoshio OKA , Shigeaki UEMURA , Jinjoo PARK , Hiroshi UEDA , Kousuke MIURA
IPC: H05K1/02 , H05K3/40 , H05K3/18 , H05K3/10 , C23C28/02 , H05K3/06 , H05K3/02 , H05K1/09 , H05K3/42 , H05K3/12
CPC classification number: H05K1/0298 , C23C28/023 , H05K1/09 , H05K1/097 , H05K3/025 , H05K3/064 , H05K3/108 , H05K3/1283 , H05K3/188 , H05K3/245 , H05K3/381 , H05K3/4038 , H05K3/424 , H05K2201/0116 , H05K2201/0141 , H05K2201/0145 , H05K2201/0154 , H05K2203/072 , H05K2203/095 , H05K2203/1131
Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.
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公开(公告)号：US20250159798A1
公开(公告)日：2025-05-15
申请号：US18839087
申请日：2023-02-22
Inventor： Satoshi KIYA , Kazuo MURATA , Hiroshi UEDA , Suguru YAMAGISHI , Ichiro KUWAYAMA , Yuichi NAKAMURA , Takanori FUKUNAGA
IPC: H05K1/02
Abstract: The printed wiring board includes a base film, a first conductor pattern, a protective layer, a conductive adhesive layer, and a conductor film. The base film has a first main surface. The first conductor pattern is disposed on the first main surface. The first conductor pattern includes a signal pattern, a first ground pattern, and a second ground pattern, each of which extends along a first direction in a planar view. The signal pattern is disposed between the first ground pattern and the second ground pattern in a second direction orthogonal to the first direction. The protective layer is disposed on the first main surface so as to cover the first conductor pattern.
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28.发明申请公开(公告)号：US20210059045A1
公开(公告)日：2021-02-25
申请号：US16080759
申请日：2017-11-15
Inventor： Katsunari MIKAGE , Masamichi YAMAMOTO , Junichi OKAUE , Hiroshi UEDA
Abstract: A flexible printed circuit board of the present invention includes an insulating base film and an electrode stacked on a first surface of the base film, in which the electrode includes a low-melting-point metal layer on a surface of the electrode, and a plate- or strip-like rigid member electrically insulated from the electrode is disposed in a region of a second surface of the base film opposite from the electrode.
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公开(公告)号：US20200037434A1
公开(公告)日：2020-01-30
申请号：US16474727
申请日：2017-12-21
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Hiroshi UEDA , Kousuke MIURA , Kou NOGUCHI
IPC: H05K1/02
Abstract: A flexible printed circuit board according to an embodiment of the present invention includes an insulative base film; and a conductive pattern provided on at least one surface of the base film and including a wiring line including a bent portion having an angle of greater than or equal to 60° or a branched portion having an angle of greater than or equal to 60° in plan view. The wiring line is provided with a relaxation structure that relaxes stress concentration at the bent portion or the branched portion. The relaxation structure is structured such that the wiring line constitutes a wide wiring line or a dense wiring line group in a region in which a distance from the bent portion or the branched portion is less than or equal to 5 times a minimum width of the wiring line. The wide wiring line has a wiring line width that is greater than or equal to twice the minimum width of the wiring line. A ratio of a wiring line width to a wiring line interval of the dense wiring line group is greater than or equal to 1.5, and a total width of the dense wiring line group is greater than or equal to twice the minimum width of the wiring line.
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公开(公告)号：US20190008035A1
公开(公告)日：2019-01-03
申请号：US15752383
申请日：2016-08-01
Inventor： Kohei OKAMOTO , Kousuke MIURA , Hiroshi UEDA , Takashi KASUGA , Kazuhiro MIYATA
Abstract: A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.
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