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公开(公告)号：US20250116911A1
公开(公告)日：2025-04-10
申请号：US18583161
申请日：2024-02-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young KIM , Junghyun PARK , Sunil KIM , Minkyung LEE , Byunggil JEONG
IPC: G02F1/31
Abstract: A beam scanning device includes a light modulation array and a processor. The light modulation array is configured to scan an external space based on phase modulating a plurality of light beams and, in a state in which the plurality of light beams are arranged in a first direction, sequentially steering the plurality of light beams in a second direction different from the first direction. The processor is configured to control the light modulation array to cause a degree of steering shift of the light modulation array to vary depending on whether a region of interest is located in the external space.
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公开(公告)号：US20230117032A1
公开(公告)日：2023-04-20
申请号：US17747441
申请日：2022-05-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sunil KIM , Junghyun PARK , Minkyung LEE , Byunggil JEONG
Abstract: A spatial light modulator and a light detection and ranging (LiDAR) apparatus including the spatial light modulator are provided. The spatial light modulator includes: a first reflective layer; a second reflective layer comprising a plurality of grating structures spaced apart from each other; a resonance layer provided between the first reflective layer and the second reflective layer; and a filling layer having a heat transfer coefficient of about 100 mW/mK or less and being in contact with an upper surface of the resonance layer while surrounding at least one grating structure of the plurality of grating structures.
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公开(公告)号：US20220057642A1
公开(公告)日：2022-02-24
申请号：US17166641
申请日：2021-02-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sunil KIM , Junghyun PARK , Duhyun LEE , Byunggil JEONG
IPC: G02B27/10
Abstract: A spatial light modulator and a beam steering apparatus including the same are provided. The spatial light modulator includes a first reflective layer; a cavity layer provided on the first reflective layer; and a reflective layer including a plurality of unit lattice structures that are provided on the cavity layer are and spaced apart from each other. Each of the plurality of unit lattice structures has a polycrystalline structure, and at least one grain of the polycrystalline structure has a column shape and a height equal to a height of the plurality of unit lattice structures.
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24.发明申请公开(公告)号：US20210173239A1
公开(公告)日：2021-06-10
申请号：US16880350
申请日：2020-05-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghyun PARK , Yeonsang PARK , Sunil KIM , Duhyun LEE , Byunggil JEONG
Abstract: Provided is a light modulator including a substrate, and a resonator configured to modulate a phase of incident light by modulating a refractive index based on an external stimulus, the resonator comprising a first reflective structure provided on the substrate, a cavity layer provided on the first reflective structure, and a second reflective structure provided on the cavity layer, wherein at least one of the first reflective structure or the second reflective structure comprises first material layers, second material layers that are alternately stacked with the first material layers, and a third material layer, and wherein each of the first material layers has a first refractive index, each of the second material layers has a second refractive index that is different from the first refractive index, and the third material layer has a third refractive index that is different from the first refractive index
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公开(公告)号：US20210149227A1
公开(公告)日：2021-05-20
申请号：US16860527
申请日：2020-04-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Duhyun LEE , Bochul PARK , Sunil KIM , Junghyun PARK , Byunggil JEONG
Abstract: A beam steering apparatus includes a substrate; at least one light source provided on the substrate; a first waveguide configured to transmit a first light beam radiated from the at least one light source; at least one beam splitter configured to split the first light beam transmitted by the first waveguide to obtain a second light beam; a second waveguide configured to receive the second light beam; and a quantum dot optical amplifier provided on the second waveguide and comprising a barrier layer, a quantum dot layer, and a wetting layer, the quantum dot optical amplifier being configured to modulate a phase of the second light beam, and to amplify an intensity of the second light beam.
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Patent Agency Ranking
公开(公告)号：US20190018299A1
公开(公告)日：2019-01-17
申请号：US15971044
申请日：2018-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghyun PARK , Jisoo KYOUNG , Sunil KIM , Changgyun SHIN , Byunggil JEONG , Byounglyong CHOI
IPC: G02F1/29
CPC classification number: G02F1/29 , G02B5/008 , G02F1/0123 , G02F2201/12 , G02F2201/18 , G02F2202/20 , G02F2203/02 , G02F2203/10 , G02F2203/24 , G02F2203/50
Abstract: Provided are an optical modulation device and a method of operating the same. The optical modulation device may include a nano-antenna, a conductor, and an active layer located between the nano-antenna and the conductor. The optical modulation device may further include a first dielectric layer located between the active layer and the conductor and a second dielectric layer located between the active layer and the nano-antenna. The optical modulation device may further include a signal applying unit configured to independently apply an electrical signal to at least two of the nano-antenna, the active layer, and the conductor.
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公开(公告)号：US20180366901A1
公开(公告)日：2018-12-20
申请号：US15805717
申请日：2017-11-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongsik SHIM , Byunggil JEONG , Byounglyong CHOI
CPC classification number: H01S5/026 , G02B6/42 , H01S5/021 , H01S5/0218 , H01S5/02256 , H01S5/02453 , H01S5/1032 , H01S5/141 , H01S5/142 , H01S5/22 , H01S5/343 , H01S5/34326 , H01S5/34333 , H01S5/4062 , H01S5/4068
Abstract: Provided are a hybrid photon device including an etch stop layer and a method of manufacturing the hybrid photon device. The hybrid photon device includes: a silicon substrate including a waveguide on a surface thereof; a front etch stop layer and a rear etch stop layer disposed on a surface of the waveguide, the front and rear etch stop layers formed respectively to either side of the first region in a length direction of the waveguide; and a group III/V light-emitting unit generating light on a region of the silicon substrate between the front and rear etch stop layers.
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公开(公告)号：US20170076131A1
公开(公告)日：2017-03-16
申请号：US15040029
申请日：2016-02-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byunggil JEONG , Cheheung KIM , Jungwoo KIM
IPC: G06K9/00
CPC classification number: G06K9/0002
Abstract: A fingerprint sensor for reinforcing an electric field and preventing electric interference between adjacent electrodes. The fingerprint sensor includes a plurality of sensor electrodes provided on a substrate, an insulating layer, and a discontinuous grid formed in the insulating layer. The discontinuous grid includes a plurality of walls that are arranged in a two-dimensional (2D) manner. The plurality of walls are electrically insulated from each other.
Abstract translation: 一种用于加强电场并防止相邻电极之间的电干扰的指纹传感器。 指纹传感器包括设置在基板上的多个传感器电极，绝缘层和形成在绝缘层中的不连续格栅。 不连续网格包括以二维（2D）方式布置的多个壁。 多个壁彼此电绝缘。
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公开(公告)号：US20160057868A1
公开(公告)日：2016-02-25
申请号：US14623263
申请日：2015-02-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byunggil JEONG
CPC classification number: H05K13/0015 , B06B1/0292 , H05K3/3436 , H05K13/046 , H05K2201/10151 , H05K2201/10734 , H05K2203/167 , Y02P70/613
Abstract: A packaging system of an electronic device, in which the electronic device is mounted on a circuit board, may comprise: a first jig having a groove configured to contain the electronic device, the first jig having a surface on which a plurality of aligning posts are prepared to protrude; a circuit board supporting member connected to the circuit board to support the circuit board, the circuit board supporting member including a plurality of first guide holes into which the aligning posts are inserted; and/or a second jig configured to apply pressure to the circuit board and including a plurality of second guide holes into which the aligning posts are inserted.
Abstract translation: 电子装置的电子装置的包装系统，其中电子装置安装在电路板上，可以包括：第一夹具，其具有构造成容纳电子装置的凹槽，第一夹具具有多个对准柱的表面 准备突出; 连接到所述电路板以支撑所述电路板的电路板支撑构件，所述电路板支撑构件包括多个第一引导孔，所述对准柱插入所述第一引导孔中; 和/或第二夹具，其构造成向电路板施加压力并且包括多个第二引导孔，对准柱插入该第二引导孔中。
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30.发明申请公开(公告)号：US20160007959A1
公开(公告)日：2016-01-14
申请号：US14728341
申请日：2015-06-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungchan KANG , Byunggil JEONG , Sangha PARK , Hyungjae SHIN
IPC: A61B8/00
CPC classification number: A61B8/4444 , A61B2562/166 , B06B1/0292 , H01L2224/48091 , H01L2224/4824 , H01L2224/49433 , H01L2924/00014 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: Provided are capacitive micromachined ultrasonic transducer (CMUT) probes that use wire bonding. A CMUT probe includes a CMUT chip which includes a plurality of first electrode pads which are disposed on a first surface thereof, a printed circuit board (PCB) which is disposed on the first surface of the CMUT chip and which is configured to expose the plurality of first electrode pads, a plurality of second electrode pads which are disposed on the PCB and which correspond to respective ones of the plurality of first electrode pads, and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads.
Abstract translation: 提供使用引线接合的电容微加工超声波换能器（CMUT）探针。 CMUT探针包括CMUT芯片，其包括设置在其第一表面上的多个第一电极焊盘，布置在CMUT芯片的第一表面上的印刷电路板（PCB），其被配置为暴露多个 的第一电极焊盘，多个第二电极焊盘，其布置在PCB上并且对应于多个第一电极焊盘中的相应电极焊盘，以及多个电线，其将多个第一电极焊盘中的每一个连接到 对应的多个第二电极焊盘之一。
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