公开(公告)号：US20200266519A1

公开(公告)日：2020-08-20

申请号：US16793360

申请日：2020-02-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juneseok LEE ,  Junsig KUM ,  Kwanghyun BAEK ,  Dohyuk HA ,  Jinsu HEO ,  Youngju LEE ,  Jungyub LEE

IPC: H01Q1/22 ,  H01Q9/42 ,  H01Q9/04 ,  H04B7/06 ,  H05K1/18 ,  H01Q1/24

Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.

公开(公告)号：US20180175901A1

公开(公告)日：2018-06-21

申请号：US15834627

申请日：2017-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinsu HEO ,  Seungtae KO ,  Sangho LIM

IPC: H04B1/40 ,  H05K1/02

CPC classification number: H04B1/40 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0251 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/10098

Abstract: A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.

公开(公告)号：US20180048075A1

公开(公告)日：2018-02-15

申请号：US15671623

申请日：2017-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungmin PARK ,  Byungchul KIM ,  Hyunjin KIM ,  Kwanghyun BAEK ,  Youngju LEE ,  Jinsu HEO

IPC: H01Q21/29 ,  H01Q19/10 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q15/14

CPC classification number: H01Q21/29 ,  H01Q1/2275 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/528 ,  H01Q9/0414 ,  H01Q15/14 ,  H01Q19/10 ,  H01Q19/28 ,  H01Q21/24

Abstract: An antenna device for providing a higher data transmission rate in a wireless communication system is provided. The antenna device includes a first radiating body mounted to a side surface of a multiple layer circuit board to transmit and receive a wireless signal and a second radiating body mounted to a top surface of the multiple layer circuit board and electrically connected to the first radiating body to transmit and receive the wireless signal together with the first radiating body.